| 1. |
- Rehg, J. M., et al.
(författare)
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Decoding children's social behavior
- 2013
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Ingår i: 2013 IEEE Conference on Computer Vision and Pattern Recognition (CVPR). - : IEEE Computer Society. ; , s. 3414-3421
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Konferensbidrag (refereegranskat)abstract
- We introduce a new problem domain for activity recognition: the analysis of children's social and communicative behaviors based on video and audio data. We specifically target interactions between children aged 1-2 years and an adult. Such interactions arise naturally in the diagnosis and treatment of developmental disorders such as autism. We introduce a new publicly-available dataset containing over 160 sessions of a 3-5 minute child-adult interaction. In each session, the adult examiner followed a semi-structured play interaction protocol which was designed to elicit a broad range of social behaviors. We identify the key technical challenges in analyzing these behaviors, and describe methods for decoding the interactions. We present experimental results that demonstrate the potential of the dataset to drive interesting research questions, and show preliminary results for multi-modal activity recognition.
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| 2. |
- Sun, S., et al.
(författare)
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Thermal performance characterization of nano thermal interface materials after power cycling
- 2012
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Ingår i: Proceedings - Electronic Components and Technology Conference. - 0569-5503. - 9781467319669 ; , s. 1426-1430
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Konferensbidrag (refereegranskat)abstract
- The need for faster, smaller, and more reliable and efficient products has resulted in increase of heat generated in microelectronic components. The removal of the heat generated is an important issue in electronic packaging. A novel Nano-TIM was developed to improve the heat dissipation of electronics packaging. This paper aims at studying the heat dissipation performance of a new class of nano-structured polymer-metal composite film (Nano-TIM) after power cycling. The new Nano-TIM uses metal to provide continuous thermal pathways while using nano-polymer to control the elasticity of the TIM. Through semiconductor processing and RTD principle, chips including 5*5, 10*10, 20*20, 30*30 (mm 2), were developed to study different size's influence on heat dissipation effect of the Nano-TIM. Additional parameters studied include power effect. RTD is used respectively to measure the junction temperature, and then the R thJC (Junction-to-Case Thermal Resistance) is calculated afterwards. The Transient thermal resistances of the Nano-TIM were also tested by T3Ster method to further study heat dissipation effect of Nano-TIM. The morphologies and interaction between the Nano-TIM and chips were carefully studied using X-ray Scanning Microscope to analyze heat flow path. The result shows that Nano-TIMs can be used to 30 mm in chip length as the thermal interface material.
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| 3. |
- Zhang, L., et al.
(författare)
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Study on the adhesion strength of new nano-structured polymer-metal composite for thermal interface material (Nano-TIM) under different pressures
- 2011
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Ingår i: Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011. - 9781457717680 ; , s. 426-429
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Konferensbidrag (refereegranskat)abstract
- With the continual increase in cooling demand for microprocessors, the microelectronics industry has been increasingly focused on the development of thermal solutions. Thermal Interface Material (TIM) plays a key role in reducing the thermal resistance of packaging and the thermal resistance between the electronic device and the external cooling components. Nano-TIM, a new type of thermal interface material, was developed to improve the heat dissipation of electronic devices. This paper describes work undertaken to research the reliability of Nano-TIM. Pull tests were used to investigate the shear strength of samples with Nano-TIM of different thicknesses coalesced between two PCBs with Sn coating made under different pressure. Scanning Electron Microscopy (SEM) analysis techniques were used to determine the morphology of the shear fracture section after pull tests and observe the structure of the cross section of Nano-TIM coalesced between two PCBs with Sn coating.
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| 4. |
- Carlberg, Björn, 1983, et al.
(författare)
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Polymer nanofiber based continuous metal phase composite for thermal management applications
- 2010
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Ingår i: 3rd Electronics System Integration Technology Conference, ESTC 2010; Berlin; Germany; 13 September 2010 through 16 September 2010. - 9781424485536 ; , s. Art. no. 5642950-
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Konferensbidrag (refereegranskat)abstract
- A new composite design approach for thermal interface materials is presented. A porous electro spun nanofiber network composed of temperature stable poly imide was infiltrated with liquid phase indium at a pressure of 30 MPa. The polymer phase defmes composition and geometry, while the continuous metal phase gives binding to surfaces and high thermal conductivity. The composite was characterized by assembly of tri-layer copper/TIM/copper sandwich structures and subsequent xenon flash measurements extracting the thermal properties of the intermediate TIM layer. The interfacial contact resistance was found to be 8 Kmm2/W and the thermal conductivity was 28 W/mK, indicating the potential for use in thermal management applications.
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| 5. |
- Casa, Marcello, et al.
(författare)
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Development and characterization of graphene-enhanced thermal conductive adhesives
- 2014
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Ingår i: 15th International Conference on Electronic Packaging Technology, ICEPT 2014; Wangjiang HotelChengdu; China; 12 August 2014 through 15 August 2014. - 9781479947072 ; :Art. no. 6922700, s. 480-483
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Konferensbidrag (refereegranskat)abstract
- According to Moore's Laws, complexity and power densities of electronic devices are increased during the last decades, moreover their dimensions are shrinking to nanometers causing hot-spot temperature escalation. Thermal management, therefore, becomes a critical issue for next generation of electronics. This scenario motivates development of novel thermal conductive adhesive (TCA) with enhanced thermal conductivity. Conventional TCAs use polymers as the matrix (base material) and utilize large loading weight fraction of the filler, usually silver particles, to achieve the thermal conductivity of 1-4 W/ m K at room temperature [1]. Lately it was discovered that graphene exhibit superior thermal conductivity [2] even when they are incorporated with matrix materials [3], which offers a potential to develop high thermal conductive graphene-filled compound. In this paper, a new functionalized graphene and its filled TCA have been developed and characterized. Starting from pristine graphite flakes, graphene was prepared through chemical exfoliation and functionalized with a nano silver layer to form a special metal/graphene hybrid material. Moreover, an efficient method to uniformly disperse the nano-scaled graphene hybrid material in silver-epoxy matrix was developed. Cross-section view of SEM has shown a homogeneous component structure, and TGA analysis of hybrid material is given. The developed compound is based on a commercial TCA which is composed with epoxy matrix and micro-sized Ag flakes. Thermal characterization through Laser-flash equipment has indicated that a significant thermal conductivity improvement was achieved through adding functionalized graphene into the material. Different TCA samples with different weight percentages of functionalized graphene ranging from 0 % (reference) to 11.5 % were prepared and tested to study thermal conductivity change. Data show that a thermal conductivity value of 7.6 W/ m K is reached when the graphene/silver percentage is 11.5 % that is almost 4 times higher than our reference.
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| 6. |
- Chen, S., et al.
(författare)
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A solder joint structure with vertically aligned carbon nanofibres as reinforcements
- 2014
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Ingår i: Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. - 9781479940264 ; , s. Art. no. 6962851-
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Konferensbidrag (refereegranskat)abstract
- In this paper, a solder joint structure was developed for the electronic packaging industry. Vertically aligned carbon nanofibres (VACNFs) were grown, transferred and used at the interface between Si/Au pads and Sn-3.0Ag-0.5Cu (SAC305) alloy as reinforcements in order to increase the solder joint thermal fatigue resistance. The transfer and assembly processes related to VACNFs were optimised and developed. The thermal cycling test results show that the thermal fatigue life of VACNF/SAC305 solder joints is 40% longer than that of pure SAC305. The dye and pry analysis and scanning electron microscopy observation prove that the VACNFs can effectively delay the crack propagation near the interface and consequently prolong the solder joint thermal fatigue life.
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| 7. |
- Daon, J., et al.
(författare)
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Electrically conductive thermal interface materials based on vertically aligned carbon nanotubes mats
- 2014
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Ingår i: IEEE 20th International Workshop on Thermal Investigation of ICs and Systems (Therminic). Greenwich, London, United Kingdom, 24-26 September 2014. - 9781479954155
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Konferensbidrag (refereegranskat)abstract
- In power microelectronics, the trends towards miniaturization and higher performances result in higher power densities and more heat to be dissipated. In most electronic assembly, thermal interface materials (TIM) help provide a path for heat dissipation but still represent a bottleneck in the total thermal resistance of the system. VA-CNTs mats are typically grown on HR silicon substrate with Al2O3 diffusion barrier layer using Thermal CVD process. In many cases, 'die attach' thermal interface materials need to be electrically conductive and the growth of dense VA-CNT mats on an electrically conductive substrate remains a challenge. This paper presents the growth of dense VA-CNT mats on doped silicon with Al2O3 and TiN diffusion barrier layer. Processes, thermal and electrical characterization of VA-CNTs based thermal interface materials are studied and reported.
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| 8. |
- Du, W., et al.
(författare)
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Study into high temperature reliability of isotropic conductive adhesive
- 2011
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Ingår i: Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011. - 9781457717680 ; , s. 1053-1055
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Konferensbidrag (refereegranskat)abstract
- With the rapid development of technologies for high density assembly and packaging in electronic industry, isotropic conductive adhesive (ICA) has been paid more and more attention as a potential substitute for solder, due to its advantages of low processing temperature, simple processing conditions and good manufacturability. However, studies into the reliability of ICA are not as abundant as those of solder. As a composite material, the failure feasibility of ICA not only depends not only on the variation in performance of different constituent parts, such as high temperature aging of the polymer, aging due to moisture absorption and oxidization of filler particles, but also on interface changes. Thus, the failure mechanism of ICA seems to be complicated and studies into the reliability of ICA are also necessary. Reliability in humidity and heat has been investigated in previous works, and in this paper high temperature reliability will be studied as a comparison. Some reliability tests and results will be given and some failure mechanisms discussed. Finally, we present some discussion about the further optimization of reliability for follow-up studies.
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| 9. |
- Fałat, T., et al.
(författare)
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Experimental results versus numerical simulations of In/Cu intermetallic compounds growth
- 2014
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Ingår i: Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014, Marina Bay Sands, Singapore, 3-5 December 2014. - 9781479969944 ; , s. 797-800
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Konferensbidrag (refereegranskat)abstract
- Indium is often used as a solder material which also plays a role of thermal interface e.g. in power LED systems. Indium and copper forms the intermetallic compounds. The growth rate constant at 400 K between copper and indium by the molecular dynamics simulations, as well as, experimentally was investigated. The results shown that the growth of the intermetallic compound in both cases follows the parabolic low, which indicates that the growth was mainly controlled by volume diffusion.
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| 10. |
- Fan, Q., et al.
(författare)
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The effect of functionalized silver on properties of conductive adhesives
- 2011
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Ingår i: Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011. - 9781457717680 ; , s. 423-425
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Konferensbidrag (refereegranskat)abstract
- This research used low molecular surface modifiers and observed that chemisorptions took place through the formation of a bond between silver surface and an adsorbed molecule, which improved the dispersion of silver flakes in the organic resin. Results of shear viscosity, bulk resistivity etc. showed that by using these low molecular organic functionalizers, isotropic conductive adhesives (ICAs) with lower shear viscosity and better electrical conductivity at high silver fillers content were obtained. Different processing methods and different matrixes were compared.
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