| 1. |
- Huang, S., et al.
(författare)
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Improved reliability of electrically conductive adhesives joints on Cu-Plated PCB substrate enhanced by graphene protection barrier
- 2017
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Ingår i: 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017. - 9781538630556 ; , s. 143-146
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Konferensbidrag (refereegranskat)abstract
- Graphene protection barrier was introduced to the interface between the ECAs and Cu-plated wire to enhance the reliability of the ECAs joints on Cu-Plated PCB substrate due to its excellent properties of impermeability to all gases/salts as well as its thermal/chemical stability. The results of shear test indicated graphene protection barrier can improve the shear strength of the ECAs joints on Cu-plated PCB substrate by almost 22% after 500 hours high temperature and high humidity cyclic test. Characterizations by optical microscope and XPS were further performed to explain the mechanism. To sum up, it can be believed that the graphene protection barrier can dramatically enhance the reliability of the ECAs joints on Cu-Plated PCB substrate.
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| 2. |
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| 3. |
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| 4. |
- Yang, Y., et al.
(författare)
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Heat dissipation performance of graphene enhanced electrically conductive adhesive for electronic packaging
- 2017
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Ingår i: 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017. - 9781538630556 ; , s. 125-128
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Konferensbidrag (refereegranskat)abstract
- Electrically conductive adhesive is a new type of environmentally interconnect material which can be used in electronic packaging to replace the traditional solders due to its advantages of simple applying process and low curing temperature. Silver coated graphene is employed in this work to enhance the thermal conductivity of the current commercial electrically conductive adhesive with very low thermal conductivity. Thermal conductivity of the electrically conductive adhesive was measured by laser flash thermal analyzer. The infrared thermal imager was utilized to obtain the temperature distribution of chip surface. The results indicated that the developed graphene enhanced electrically conductive adhesive has perfect heat performances. It can be believed that this new kind of electrically conductive adhesive possesses promising application in electronic packaging in the future.
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| 5. |
- Chen, Si, 1981, et al.
(författare)
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A High Performance Ag Alloyed Nano-scale n-type Bi2Te3 Based Thermoelectric Material
- 2015
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Ingår i: Materials Today: Proceedings. - : Elsevier BV. - 2214-7853. ; 2:2, s. 610-619
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Konferensbidrag (refereegranskat)abstract
- A silver alloyed n-type bismuth telluride (Bi2Te3) thermoelectric (TE) bulk material with nano crystalline structure was studied and characterized in this paper. The Bi2Te3 nanopowders used in this study were first fabricated via a patented explosion based process. Then, the various concentrations of Ag nanoparticles (0-20 wt. %) were added into the Bi2Te3 nanopowders in order to increase the electrical conductivity. Combining the benefits of high electrical conductivity (1.51x10(5) S.m(-1)) and low thermal conductivity (0.441 W.m(-1).K-1), the dimensionless figure of merit (ZT value) of 1.48 for this n-type Bi2Te3 TE material is achieved at 300 K temperature.
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| 6. |
- Chen, S., et al.
(författare)
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An overview of carbon nanotubes based interconnects for microelectronic packaging
- 2017
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Ingår i: 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017. - 9781538630556 ; , s. 113-119
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Konferensbidrag (refereegranskat)abstract
- Owing to the great demand in more functions and miniaturization in microelectronic packaging, the dimensions of interconnects has decreased extremely, which has resulted in electrical, thermal, and mechanical reliability issues. To address these issues, carbon nanotube (CNT) has been selected as a promising alternative material for the interconnects in packaging due to its large current density, high thermal conductivity, great flexibility, and low coefficient of thermal expansion (CTE). In this paper, the development of CNTs based vertical interconnects was reviewed. However, the resistivity of CNTs based interconnects was much higher than that of copper interconnects. Thus, this review focused on the resistivity of CNTs-based interconnects in different fabrication process and pointed out what improves the resistivity. In the future, CNTs-Cu nanocomposite with unique properties could be the suitable material for bumps to reduce the resistivity of CNTs based bumps further.
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| 7. |
- Daon, J., et al.
(författare)
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Chemically enhanced carbon nanotubes based Thermal Interface Materials
- 2015
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Ingår i: THERMINIC 2015 - 21st International Workshop on Thermal Investigations of ICs and Systems 2015. - 9781467397056
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Konferensbidrag (refereegranskat)abstract
- With progress in microelectronics the component density on a device increases drastically. As a consequence the power density reaches levels that challenge device reliability. New heat dissipation strategies are needed to efficiently drain heat. Thermal Interface Materials (TIMs) are usually used to transfer heat across interfaces, for example between a device and its packaging. Vertically Aligned Carbon Nanotubes (VACNTs) can be used to play this role. Indeed, carbon nanotubes are among the best thermal conductors (similar to 3.000 W/mK) and in the form of VACNT mats, show interesting mechanical properties. On one side, VACNTs are in contact with their growth substrate and there is a low thermal resistance. On the other side, good contact must be created between the opposite substrate and the VACNTs in order to decrease the contact thermal resistance. A thin-film deposition of an amorphous material can be used to play this role. This paper reports a chemically enhanced carbon nanotube based TIM with creation of chemical bonds between the polymer and VACNTs. We show that these covalent bonds enhance the thermal transfer from VACNTs to a copper substrate and can dramatically decrease local resistances. Implementation processes and thermal characterizations of TIMs are studied and reported.
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| 8. |
- Darmawan, C. C., et al.
(författare)
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Graphene-CNT hybrid material as potential thermal solution in electronics applications
- 2017
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Ingår i: 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac). - 9781538630556 ; , s. 190-193
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Konferensbidrag (refereegranskat)abstract
- Graphene and CNT have great potential in electronics applications. This work explored the possibility of integrating 1D CNT and 2D graphene into a 3D covalently bonded structure, i.e. a graphene-CNT hybrid material for thermal management application. The graphene-CNT hybrid material was later investigated morphologically and thermally to observe its heat dissipation capability.
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| 9. |
- Grammatikos, Sotirios, 1985, et al.
(författare)
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Concrete setting and hardening monitoring using a novel graphene-based sensor
- 2017
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Ingår i: ICF 2017 - 14th International Conference on Fracture. ; 2, s. 1204-1205
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Konferensbidrag (refereegranskat)abstract
- This paper presents the procedure towards the development of a durable structural sensor based on graphene and other carbon fillers, for the monitoring of structural performance of concrete. The sensor captures electrical resistivity as a strength development and durability index during the whole service life of concrete. To date, performance monitoring systems usually fail in the long-run before the failure of the actual structure. The proposed sensor is embedded in the interrogated structure and ensures sustainable consolidation via appropriate physico-chemical adherence and mechanical interlocking. This allows for an efficient performance monitoring 'build-up' expected to surpass the service life of the parent concrete structure. The effects of different concentrations of graphene and other fillers on the electrical properties of concrete were studied. After an initial investigation to select the appropriate synthesis, the ability of the sensor to monitor the development of resistivity during setting and hardening was tested and the results are presented herein.
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