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- Kihl, Maria, et al.
(författare)
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Vehicular Network Applications and Services
- 2009
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Ingår i: Vehicular Networks: Techniques, Standards, and Applications. - 9781420085716
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Bokkapitel (övrigt vetenskapligt/konstnärligt)abstract
- Vehicular networks will not be commercially deployed unless there are applications that benefit from them. Since the first research projects on vehicular networks, see, for example, the PROMETHEUS project [1,2], the main focus has been on increasing traffic safety. With the help of vehicular communication, the number of accidents will decrease and human lives will be saved. Therefore, the two application categories that have attracted the most attention during the years are related to public safety, for example, collision avoidance applications and vehicular traffic coordination, where vehicles coordinate their movements with each other. Some considerable work has also been done on applications related to road traffic management, which can help alleviate congested roads and thereby decrease the number of accidents, as well as decreasing the travel time. Numerous other applications have also been proposed, which relate to other objectives than traffic safety. Many of these applications can be categorized as comfort applications. The objective of these applications is to improve the travel comfort for both the drivers (e.g., with information from roadside restaurants) and the passengers (e.g., with Internet access and video-on-demand systems). The main objective of the papers proposing various vehicular applications is usually to propose a data dissemination technique for this particular application. Very few papers, if any, have been focused on how the applications should be implemented in reality. In this chapter, we will, therefore, describe some proposed solutions for the envisioned applications and, thereby, also discuss suitable communication architectures and protocols for these applications.
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| 2. |
- Sakulsombat, Morakot, et al.
(författare)
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Dynamic systemic resolution
- 2012
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Ingår i: Constitutional Dynamic Chemistry. - Berlin, Heidelberg : Springer Berlin/Heidelberg. - 9783642283437 ; , s. 55-86
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Bokkapitel (refereegranskat)abstract
- Dynamic Systemic Resolution is a powerful technique for selecting optimal constituents from dynamic systems by applying selection pressures, either externally by addition of target entities, or internally within the system constraints. This concept is a subset of Constitutional Dynamic Chemistry, and the dynamic systems are generally based on reversible covalent interactions between a range of components where the systems are maintained under thermodynamic control. In the present chapter, the concept will be described in detail, and a range of examples will be given for both selection classes. For external pressure generation, target enzymes, in aqueous and/or organic solution, have been used to demonstrate the resolution processes. In a first example, a dynamic transthiolesterification system was generated in aqueous solution at neutral pH, and resolved by hydrolysis using serine hydrolases (cholinesterases). In organic solution, lipase-catalyzed acylation was chosen to demonstrate asymmetric resolution in different dynamic systems, generating chiral ester and amide structures. By use of such biocatalysts, the optimal constituents were selectively chosen and amplified from the dynamic systems in one-pot processes. In internal selection pressure resolution, self-transformation and crystallization-induced diastereomeric resolution have been successfully used to challenge dynamic systems. The technique was, for example, used to identify the best diastereomeric substrate from a large and varied dynamic system in a single resolution reaction.
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| 3. |
- Zhang, Yan, 1976, et al.
(författare)
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Experimental investigation and micropolar modelling of the anisotropic conductive adhesive flip-chip interconnection
- 2008
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Ingår i: Electrically Conductive Adhesives. - 9789004187825 ; 22:14, s. 1717-1731
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Bokkapitel (övrigt vetenskapligt/konstnärligt)abstract
- A conductive adhesive is a promising interconnection material for microsystem packaging. The interconnect features are of great importance to system responses under various loading conditions. The flip-chip packaging system with anisotropic conductive film (ACF) joint under thermal loadings has been investigated both experimentally and theoretically. The displacement distributions have been measured by an interferometer, which could provide the in-plane whole-field deformation observation. The interconnection is of much smaller scales compared with the neighbouring components such as the chip and substrate, and there are even finer internal structures involved in the joint. The wide scale range makes both experimental observation and conventional simulation difficult. A micropolar model is thus developed. Utilizing the homogenization, this model requires low computation resource. Combination of this model with a secondorder model was able to produce a highly efficient and valid prediction of the packaging system response under thermal and mechanical loadings. Comparison of the micropolar model simulation and experimental data shows good agreement.
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