| 1. |
- Kristan, Matej, et al.
(författare)
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The Ninth Visual Object Tracking VOT2021 Challenge Results
- 2021
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Ingår i: 2021 IEEE/CVF INTERNATIONAL CONFERENCE ON COMPUTER VISION WORKSHOPS (ICCVW 2021). - : IEEE COMPUTER SOC. - 9781665401913 ; , s. 2711-2738
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Konferensbidrag (refereegranskat)abstract
- The Visual Object Tracking challenge VOT2021 is the ninth annual tracker benchmarking activity organized by the VOT initiative. Results of 71 trackers are presented; many are state-of-the-art trackers published at major computer vision conferences or in journals in recent years. The VOT2021 challenge was composed of four sub-challenges focusing on different tracking domains: (i) VOT-ST2021 challenge focused on short-term tracking in RGB, (ii) VOT-RT2021 challenge focused on "real-time" short-term tracking in RGB, (iii) VOT-LT2021 focused on long-term tracking, namely coping with target disappearance and reappearance and (iv) VOT-RGBD2021 challenge focused on long-term tracking in RGB and depth imagery. The VOT-ST2021 dataset was refreshed, while VOT-RGBD2021 introduces a training dataset and sequestered dataset for winner identification. The source code for most of the trackers, the datasets, the evaluation kit and the results along with the source code for most trackers are publicly available at the challenge website(1).
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| 2. |
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| 3. |
- Huang, Shirong, et al.
(författare)
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Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology
- 2013
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Ingår i: 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013). - 9781479928330 ; , s. 347-352
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Konferensbidrag (refereegranskat)abstract
- Monolayer graphene was synthesized through thermal chemical vapor deposition (TCVD) as heat spreader for chip cooling. Platinum (Pt) serpentine functioned as hot spot on the thermal testing chip. The thermal testing chip with monolayer graphene film attached was bonded using flip-chip technology. The temperature at the hot spot with a monolayer graphene film as heat spreader was decreased by about 12°C and had a more uniform temperature compared to those without graphene heat spreader when driven by a heat flux of about 640W/cm 2 . Further improvements to the cooling performance of graphene heat spreader could be made by optimizing the synthesis parameters and transfer process of graphene films. © 2013 IEEE.
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| 4. |
- Liu, Hao, et al.
(författare)
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Thermally Conductive Graphene Film/Indium/Aluminum Laminated Composite by Vacuum Assisted Hot-pressing
- 2020
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Ingår i: 2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). - 9781728168265
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Konferensbidrag (refereegranskat)abstract
- In order to meet the ever more demanding requirements of modern thermal management with the increasing high power density, an easy-fabricated laminated graphene film/indium/aluminum (GF/In/Al) composite was developed. The GF was fabricated through assemble graphene oxide (GO) sheets in a layer-by-layer structure and then subjected to graphitization process at high temperature as well as press forming process. The fabricated GF exhibits ultrahigh in-plane thermal conductivity together with good tensile strength. The GF/In/Al laminated composite was fabricated by hot-pressing indium coated GF and Al layers in vacuum environment. The indium layer was easily coated onto the GF due to its low melting point along with good flowing property. The thermal resistance measurements show that the indium bonding possess greater preponderance of reducing contact resistance than without bonding material and thermal conductive adhesive (TCA) bonding, because indium layer could fill the gap between GF and Al layers, and provide more stable connection. The results show that the obtained laminated composite could be potentially used in the thermal management of high power systems.
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| 5. |
- Lu, Pei, et al.
(författare)
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Thermal Conduction of Fiber-Reinforced Polymer under Loading
- 2021
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Ingår i: 2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021.
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Konferensbidrag (refereegranskat)abstract
- Thermal performance of an epoxy resin reinforced by carbon fibers is studied by numerical simulation method. Various carbon fiber structures are taken into consideration and the effective thermal conductivity of the composite carbon fiber waved structure is obtained. The influences of the number, size, shape, spacing and arrangement of the carbon fibers on the thermal conduction of the composites are analyzed. The deformation of the composite under mechanical loading and the corresponding the thermal conductivity of the carbon fiber-reinforced epoxy resin are also investigated.
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| 6. |
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| 7. |
- Wang, Yong, et al.
(författare)
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Research on Development Mechanism of "Family Farm" under E-commerce
- 2018
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Ingår i: 2018 International Conference On E-Commerce And Contemporary Economic Development (ECED 2018). - : DEStech Publications. ; , s. 1-12
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Konferensbidrag (refereegranskat)abstract
- Agricultural e-commerce will be the production and processing of agricultural products, organic combination of transportation storage and distribution sales process, the omni-directional into e-commerce system, through the computer information network, and with their own production base and advanced logistics distribution system as the backing, the convenience of using the Internet, to complete the purchase of agricultural products, sales, online payment and other related business process. Developing agricultural e-commerce is conducive to promoting agricultural development and farmers' income, and the "family farm", as a large-scale, intensive, the commercialization of agricultural management system, complied with the trend of the development of electronic commerce, so as to speed up the development of e-commerce, highlight the function mechanism of "family farm" in the agricultural e-commerce mechanism.
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| 8. |
- Yin, Hang, et al.
(författare)
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Analysis of heat dissipation characteristics of three-dimensional graphene-carbon nanotube composite structures
- 2020
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Ingår i: 2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). - 9781728168265
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Konferensbidrag (refereegranskat)abstract
- With the rapid development of electronic materials and technologies, the working frequencies of electronic components and devices have been greatly improved and the volume of electronic products has been shrinking. The integration density has increased significantly, which puts forward higher requirements for thermal management. One of the keys to the heat dissipation of electronic components is to transfer the heat rapidly to the radiator through the heat conducting medium. Therefore, the development of high conductive materials has become a research hotspot of high-density integrated devices and systems. Due to their excellent heat transfer properties, carbon nanomaterials such as carbon nanotube and graphene have attracted extensive attention. The thermal conductivities of carbon nanotube and graphene have obvious anisotropy, which limited their applications to some extent. In this paper, three-dimensional composite structures composed of graphene sheets and carbon nanotubes are considered. The heat transfer processes are simulated by molecular dynamics method and the heat transfer characteristics of van der Waals interaction and chemical bond structures are analyzed. The effects of heat flow and nanotube layout on the thermal properties of three-dimensional composite structures are discussed.
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| 9. |
- Zhang, Yong, 1982, et al.
(författare)
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2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS
- 2016
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Ingår i: China Semiconductor Technology International Conference 2016, CSTIC 2016. - 9781467388047
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Konferensbidrag (refereegranskat)abstract
- The need for faster and smaller, as well as more reliable and efficient consumer electronic products has resulted in microelectronic components that produce progressively more heat. The resultant reliability issues from the increased heat flux are serious and hinder technological development. One solution for microelectronics cooling applications is 2D materials applied as heat spreaders and these include monolayer graphene, graphene based films, and monolayer hexagonal boron nitride and BN based films. In addition, thermal performances of the graphene heat spreader were also studied under different packaging structures, including wire bonding, cooling fins and flip chips. Finally, 2D hexagonal Boron nitride (h-BN) heat spreaders, fabricated by different methods, had their heat dissipation performances characterized by different thermal characterization methods, such as resistance temperature detector (RTD) and Infrared (IR) methods. In conclusion, these new novel 2D materials developed show great potential for microelectronics cooling applications.
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| 10. |
- Zhang, Yan, et al.
(författare)
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Study on the verification of IR and RTD methods applied in the thermal measurement of high power chips
- 2014
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Ingår i: 15th International Conference on Electronic Packaging Technology, ICEPT 2014; Wangjiang HotelChengdu; China; 12 August 2014 through 15 August 2014. - 9781479947072 ; , s. 1507-1511
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Konferensbidrag (refereegranskat)abstract
- In the present paper, a chip with a Pt-based RTD that functions as a heater and sensor is tested under serial power loads, and infrared (IR) thermal imaging system is adopted to obtain the thermal measurement. Comparisons of the hotspot temperatures of the chip obtained by RTD and IR methods have been made, where different surfaces of the chip were observed by the IR camera. Combing with the heat conduction law, the IR results of the test chip with surface preparation showed quite a good agreement with the RTD data, verifying the validation of the IR analysis method.
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