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Sökning: WFRF:(Zheng Lirong)

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  • Zheng, Lirong, et al. (författare)
  • Photocatalytic activity of ZnO/Sn1-xZnxO2-x nanocatalysts : A synergistic effect of doping and heterojunction
  • 2014
  • Ingår i: Applied Catalysis B. - 0926-3373 .- 1873-3883. ; 148, s. 44-50
  • Tidskriftsartikel (refereegranskat)abstract
    • A novel configuration of porous ZnO/Sn1-xZnxO2-x, heterojunction nanocatalyst with high photocatalytic activity was successfully synthesized through a simple two-step solvothermal method. Porous Sn1-xZnxO2, was synthesized from Zn2+ and Sn4+ precursors with the Zn/Sn ratio of 2:1 in the absence of alkali, and then intermolecular dehydrolysis led to the formation of heterointerface between Sn1-xZnxO2, and ZnO. The results show that Zn2+ doping exhibits a significant influence on particle size of SnO2 leading to much higher specific surface area and larger band gap, which is in favor of the photocatalytic activity of SnO2 under UV light irradiation. In addition, the formation of ZnO/Sn1-xZnxO2 heterostructure improves the separation of photogenerated electron hole pairs due to the potential difference between Sn1-xZnxO2, and ZnO, which also benefits to photocatalysis. By taking account of them together, these results provide further insight into the synergistic effects of metal ion doping and semiconductor/semiconductor heterostructure on the activity of photocatalysts in environmental remediation applications. (C) 2013 Elsevier B.V. All rights reserved.
  • Liu, Zhiying, et al. (författare)
  • Solution-Processable Nanotube/Polymer Composite for High-Performance TFTs
  • 2011
  • Ingår i: IEEE Electron Device Letters. - 0741-3106 .- 1558-0563. ; 32:9, s. 1299-1301
  • Tidskriftsartikel (refereegranskat)abstract
    • Thin-film field-effect transistors (TFTs) are readily fabricated using a semiconductor composite that is solution processed under ambient conditions for the conduction channel. The composite comprises single-walled carbon nanotubes (SWCNTs) embedded in poly-9,9' dioctyl-fluorene-co-bithiophene. Carrier mobility values approaching 10 cm(2)V(-1)s(-1) are obtained for the composite with relatively high SWCNT concentrations. When the SWCNT concentration is reduced for a large ON/OFF current ratio > 10(6), the mobility remains decent around 0.3 cm(2)V(-1)s(-1). The resultant TFTs display remarkable environmental and operational reliability. Nanotube-based composites are therefore of significance in printed electronics owing to their simplicity in device fabrication and competitiveness in device performance.
  • Xie, Li, et al. (författare)
  • Characterization of dry biopotential electrodes
  • 2013
  • Ingår i: Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS. - 9781457702167 ; 2013, s. 1478-81
  • Konferensbidrag (refereegranskat)abstract
    • Driven by the increased interest in wearable long-term healthcare monitoring systems, varieties of dry electrodes are proposed based on different materials with different patterns and structures. Most of the studies reported in the literature focus on proposing new electrodes and comparing its performance with commercial electrodes. Few papers are about detailed comparison among different dry electrodes. In this paper, printed metal-plate electrodes, textile based electrodes, and spiked electrodes are for the first time evaluated and compared under the same experimental setup. The contact impedance and noise characterization are measured. The in-vivo electrocardiogram (ECG) measurement is applied to evaluate the overall performance of different electrodes. Textile electrodes and printed electrodes gain comparable high-quality ECG signals. The ECG signal obtained by spiked electrodes is noisier. However, a clear ECG envelope can be observed and the signal quality can be easily improved by backend signal processing. The features of each type of electrodes are analyzed and the suitable application scenario is addressed.
  • Yang, Geng, et al. (författare)
  • A Health-IoT Platform Based on the Integration of Intelligent Packaging, Unobtrusive Bio-Sensor and Intelligent Medicine Box
  • 2014
  • Ingår i: IEEE Transactions on Industrial Informatics. - : IEEE. - 1551-3203 .- 1941-0050. ; 10:4, s. 2180-2191
  • Tidskriftsartikel (refereegranskat)abstract
    • In-home healthcare services based on the Internet-of-Things (IoT) have great business potential; however, a comprehensive platform is still missing. In this paper, an intelligent home-based platform, the iHome Health-IoT, is proposed and implemented. In particular, the platform involves 1) an open-platform-based intelligent medicine box (iMedBox) with enhanced connectivity and interchangeability for the integration of devices and services, 2) intelligent pharmaceutical packaging (iMedPack) with communication capability enabled by passive radio-frequency identification (RFID) and actuation capability enabled by functional materials, and 3) flexible and wearable bio-medical sensor device (Bio-Patch) enabled by the state-of-the-art inkjet printing technology and system-on-chip. The proposed platform seamlessly fuses IoT devices (e.g., wearable sensors, intelligent medicine packages, etc.) with in-home healthcare services (e.g., telemedicine) for an improved user experience and service efficiency. The feasibility of the implemented iHome Health-IoT platform has been proven in field trials.
  • Zheng, Zhibo Pang, et al. (författare)
  • Design of a terminal solution for integration of in-home health care devices and services towards the Internet-of-Things
  • 2015
  • Ingår i: Enterprise Information Systems. - : Taylor & Francis. - 1751-7575 .- 1751-7583. ; 9:1, s. 86-116
  • Tidskriftsartikel (refereegranskat)abstract
    • In-home health care services based on the Internet-of-Things are promising to resolve the challenges caused by the ageing of population. But the existing research is rather scattered and shows lack of interoperability. In this article, a business-technology codesign methodology is proposed for cross-boundary integration of in-home health care devices and services. In this framework, three key elements of a solution (business model, device and service integration architecture and information system integration architecture) are organically integrated and aligned. In particular, a cooperative Health-IoT ecosystem is formulated, and information systems of all stakeholders are integrated in a cooperative health cloud as well as extended to patients’ home through the inhome health care station (IHHS). Design principles of the IHHS includes the reuse of 3C platform, certification of the Health Extension, interoperability and extendibility, convenient and trusted software distribution, standardised and secured electrical health care record handling, effective service composition and efficient data fusion. These principles are applied to the design of an IHHS solution called iMedBox. Detailed device and service integration architecture and hardware and software architecture are presented and verified by an implemented prototype. The quantitative performance analysis and field trials have confirmed the feasibility of the proposed design methodology and solution.
  • Ahmad, Waqar, et al. (författare)
  • Decoupling capacitance for the power integrity of 3D-DRAM-over-logic system
  • 2012
  • Ingår i: IEEE 13th Electronics Packaging Technology Conference (EPTC), 2011. - : IEEE conference proceedings. - 9781457719813 ; , s. 590-594
  • Konferensbidrag (refereegranskat)abstract
    • The 3D-DRAM stacked over the processor is a vibrant technique in order to overcome the memory wall as well as the bandwidth wall problems. We considered a system with two DRAM dies over a single processor die. We assumed the decoupling capacitors to be placed on each DRAM die and connected to the power distribution TSV pairs, where the TSVs pass through the DRAM stack. In this paper we proposed a mathematical model for the optimum value of the decoupling capacitance on each DRAM die along with the optimum values of the effective resistance of the interconnecting power distribution TSV pairs in order to ensure the power integrity of the logic load during switching. The proposed model has a maximum of 1.1% error as compared to the Ansoft Nexxim4.1.
  • Ahmad, Waqar, et al. (författare)
  • Fast Transient Simulation Algorithm for a 3D Power distribution Bus
  • 2010
  • Ingår i: Proceedings of IEEE Asia Symposium on Quality Electronic Design. ; , s. 343-350
  • Konferensbidrag (refereegranskat)abstract
    • Extensive transient simulations for on-chip power delivery networks are required to analyze power delivery fluctuations caused by dynamic IR and Ldi/dt drops. Speed and memory has become a bottleneck for simulation of power distribution networks in modern VLSI design where clock frequency is of the order of GHz. The traditional SPICE based tools are very slow and consume a lot of memory during simulation. The problem is further aggravated for huge networks like power distribution network within a stack of ICs inter-connected through TSVs. This type of 3D power distribution network may contain billions of nodes at a time. In this paper we proposed a faster transient simulation algorithm using visual C++. First we reduce 3D power distribution bus containing n nodes to a two terminal 7 network. Then we solve this two terminal reduced network for voltages and currents. After this, we apply back solving algorithm to the network to solve it for each of the intermediate nodes using visual C++. The proposed algorithm is quite accurate with 1-2% error when compared with Ansoft Nexxim4.1. The proposed algorithm is several times faster than Ansoft Nexxim as well as consumes significantly less memory as compared to Nexxim.
  • Ahmad, Waqar, et al. (författare)
  • Peak-to-peak Switching Noise and LC Resonance on a Power Distribution TSV Pair
  • 2010
  • Ingår i: 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010. - : Institute of Electrical and Electronics Engineers (IEEE). ; , s. 173-176
  • Konferensbidrag (refereegranskat)abstract
    • How peak-to-peak switching noise as well as the LC resonance term varies by varying different circuit parameters of a power distribution TSV pair (having decoupling capacitance and logic load), within a 3D stack of ICs interconnected through TSVs.
  • Ahmad, Waqar, et al. (författare)
  • Power distribution TSVs induced core switching noise
  • 2011
  • Ingår i: Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE. - : IEEE conference proceedings. - 9781424490691
  • Konferensbidrag (refereegranskat)abstract
    • Size of on-chip interconnects as well as the supply voltage is reducing with each technology node whereas the operating speed is increasing in modern VLSI design. Today, the package inductance and resistance has been reduced to such an extent that core switching noise caused by on-chip inductance and on-chip resistance is gaining importance as compared to I/O drivers switching noise. Both on-chip inductance and skin effect are prime players at frequencies of the order of GHz. The problem is further aggravated when chips are interconnected through TSVs to form a 3D integrated stack in order to achieve low form factor and high integration density. In this paper we analysed peak core switching noise in a 3D stack of integrated chips interconnected through power distribution TSV pairs, through our comprehensive mathematical model which has been proved to be quite accurate as compared to SPICE. We analysed the effect of number of chips in a 3D stack, rise time, decoupling capacitance, and skin effect on power distribution TSVs induced core switching noise in this paper.
  • Amin, Yasar, et al. (författare)
  • Blueprint and integration of vastly efficient 802.11A WLAN front-end
  • 2006
  • Ingår i: WSEAS Transactions on Electronics. - 1109-9445. ; 3:4, s. 258-261
  • Tidskriftsartikel (refereegranskat)abstract
    • Next generation wireless communications terminals will demand the use of advanced component integration processes and high density packaging technologies in order to reduce size and to increase performance. This paper presents high density multilayer interconnects and integrated passives used to design high performance prototype filter for 5GHz wireless LAN receiver realized on MCM-D substrate. The thin film implementation of Multichip Module technology is identified as a useful platform for the integration of GaAs MMIC and silicon device technologies for microwave applications where performance, size and weight are critical factors. The ability of the MCM-D technology to provide controlled impedance, microstrip structures and integrated thin film passive components with useful performance in the microwave frequency regime has now been demonstrated.
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