| 1. |
- Ahmad, Waqar, et al.
(author)
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Decoupling capacitance for the power integrity of 3D-DRAM-over-logic system
- 2012
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In: IEEE 13th Electronics Packaging Technology Conference (EPTC), 2011. - : IEEE conference proceedings. - 9781457719813 ; , s. 590-594
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Conference paper (peer-reviewed)abstract
- The 3D-DRAM stacked over the processor is a vibrant technique in order to overcome the memory wall as well as the bandwidth wall problems. We considered a system with two DRAM dies over a single processor die. We assumed the decoupling capacitors to be placed on each DRAM die and connected to the power distribution TSV pairs, where the TSVs pass through the DRAM stack. In this paper we proposed a mathematical model for the optimum value of the decoupling capacitance on each DRAM die along with the optimum values of the effective resistance of the interconnecting power distribution TSV pairs in order to ensure the power integrity of the logic load during switching. The proposed model has a maximum of 1.1% error as compared to the Ansoft Nexxim4.1.
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| 2. |
- Ahmad, Waqar, et al.
(author)
-
Fast Transient Simulation Algorithm for a 3D Power distribution Bus
- 2010
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In: Proceedings of IEEE Asia Symposium on Quality Electronic Design. ; , s. 343-350
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Conference paper (peer-reviewed)abstract
- Extensive transient simulations for on-chip power delivery networks are required to analyze power delivery fluctuations caused by dynamic IR and Ldi/dt drops. Speed and memory has become a bottleneck for simulation of power distribution networks in modern VLSI design where clock frequency is of the order of GHz. The traditional SPICE based tools are very slow and consume a lot of memory during simulation. The problem is further aggravated for huge networks like power distribution network within a stack of ICs inter-connected through TSVs. This type of 3D power distribution network may contain billions of nodes at a time. In this paper we proposed a faster transient simulation algorithm using visual C++. First we reduce 3D power distribution bus containing n nodes to a two terminal 7 network. Then we solve this two terminal reduced network for voltages and currents. After this, we apply back solving algorithm to the network to solve it for each of the intermediate nodes using visual C++. The proposed algorithm is quite accurate with 1-2% error when compared with Ansoft Nexxim4.1. The proposed algorithm is several times faster than Ansoft Nexxim as well as consumes significantly less memory as compared to Nexxim.
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| 3. |
- Ahmad, Waqar, et al.
(author)
-
Peak-to-peak Switching Noise and LC Resonance on a Power Distribution TSV Pair
- 2010
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In: 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010. - : Institute of Electrical and Electronics Engineers (IEEE). ; , s. 173-176
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Conference paper (peer-reviewed)abstract
- How peak-to-peak switching noise as well as the LC resonance term varies by varying different circuit parameters of a power distribution TSV pair (having decoupling capacitance and logic load), within a 3D stack of ICs interconnected through TSVs.
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| 4. |
- Ahmad, Waqar, et al.
(author)
-
Power distribution TSVs induced core switching noise
- 2011
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In: Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE. - : IEEE conference proceedings. - 9781424490691
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Conference paper (peer-reviewed)abstract
- Size of on-chip interconnects as well as the supply voltage is reducing with each technology node whereas the operating speed is increasing in modern VLSI design. Today, the package inductance and resistance has been reduced to such an extent that core switching noise caused by on-chip inductance and on-chip resistance is gaining importance as compared to I/O drivers switching noise. Both on-chip inductance and skin effect are prime players at frequencies of the order of GHz. The problem is further aggravated when chips are interconnected through TSVs to form a 3D integrated stack in order to achieve low form factor and high integration density. In this paper we analysed peak core switching noise in a 3D stack of integrated chips interconnected through power distribution TSV pairs, through our comprehensive mathematical model which has been proved to be quite accurate as compared to SPICE. We analysed the effect of number of chips in a 3D stack, rise time, decoupling capacitance, and skin effect on power distribution TSVs induced core switching noise in this paper.
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| 5. |
- Amin, Yasar, et al.
(author)
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Printable RFID antenna with embedded sensor and calibration functions
- 2013
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In: Progress In Electromagnetics Research Symposium Proceedings, Stockholm, Sweden, Aug. 12-15, 2013. - : Electromagnetics Academy. - 9781934142264 ; , s. 567-570
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Conference paper (peer-reviewed)abstract
- An RFID antenna with integrated humidity sensor and calibration functionality for wireless sensor network is proposed. The antenna is composed of series and shunt stubs for impedance matching and reliability for near-field communication. The innovative ladder contour structure plays the key role for humidity sensing, and sensor calibration. The quadrangular end-tip loading is employed to offer capacitance and stability for far-field communication. The prototypes of the antenna are fabricated and tested: antenna effectively senses the ambient humidity levels while demonstrating stable behavior for RFID communication. The antenna has a compact size of 1 × 10cm for 902-928 MHz RFID band.
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| 6. |
- Amin, Yasar, et al.
(author)
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SoP design on liquid crystal polymer substrate for 5 GHz RF receiver front-end module
- 2005
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In: International Microelectronics and Packaging Society - 1st International Conference and Exhibition on Device Packaging 2005. - 9781604235722 ; , s. 236-240
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Conference paper (peer-reviewed)abstract
- Next generation wireless communications terminals will demand the use of advanced component integration processes and high density packaging technologies in order to reduce size and to increase performance. This paper presents highdensity multilayer interconnects and integrated passives used to design high performance prototype filter for 5GHz wireless LAN receiver realized on liquid crystal polymer (LCP) substrate. The thin film implementation of Multichip Module technology is identified as a useful platform for the integration of GaAs MMIC and silicon device technologies for microwave applications where performance, size and weight are critical factors. The ability of the MCM-D technology to provide controlled impedance, microstrip structures and integrated thin film passive components with useful performance in the microwave frequency regime has now been demonstrated.
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| 7. |
- Ansari, Muhammad Adeel, et al.
(author)
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Diode based charge pump design using 0.35μm technology
- 2010
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In: 28th Norchip Conference, NORCHIP 2010. - : IEEE. - 9781424489732 ; , s. 5669437-
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Conference paper (peer-reviewed)abstract
- A high voltage charge pump design is being presented in this paper. The design is based on Dickson charge pump, constructed with diodes by using AMS 0.35μm technology. The innovation is made in Dickson charge pump i.e. charge control PMOS transistor is used in each stage of charge pump. PMOS transistor is used in series with charging capacitor which reduces the power consumption during the clock transition by controlling the time constant of each stage. The resistance between drain to source of PMOS transistor increases the time constant during the charging of the capacitor placed in each stage of charge pump. The output voltage of about 5.693V is achieved by the six stages of Dickson charge pump at no-load which reduces to 5.537V with the six stages of proposed charge pump but the power during the input clock transition is reduced from 340.5μw (consumed by Dickson charge pump) to 28.85 μW (consumed by the proposed modified charge pump). Some other results are also discussed in this paper, which are achieved on different load resistances.
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| 8. |
- Bao, D., et al.
(author)
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A smart catheter system for minimally invasive brain monitoring
- 2015
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In: Proceedings of the International Conference on Biomedical Electronics and Devices. - : SciTePress. - 9789897580710 ; , s. 198-203
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Conference paper (peer-reviewed)abstract
- This paper demonstrates a smart catheter system with intracranial pressure (ICP) and temperature sensing capability which is designed for real-time monitoring in traumatic brain injury (TBI) therapy. It uses a single flexible catheter with a 1 mm (3 Fr) diameter that integrates electrodes and sophisticated silicon chip on flexible substrates, enabling multimodality monitoring of physiological signals. A micro-electromechanical-system (MEMS) catheter pressure sensor is mounted on the distal end. It can be used for detecting both pressure and temperature by different switch configurations, which minimizes the size of catheter and reduces the cost. The interconnects (signalling conductors) are printed on a bio-compatible flexible substrate, and the sensor is interfaced with an embedded electronic system at the far-end. The electronic system consists of analog front end with analog-to-digital converter (ADC), a microcontroller, and data interface to the hospital infrastructure with a graphical user interface (GUI). The overall smart catheter system achieves a pressure sensing root mean square error (RMSE) of ±1.5 mmHg measured from 20 mmHg to 300 mmHg above 1 atm and a temperature sensing RMSE of ±0.08°C measured from 32°C to 42°C. The sampling rate can be up to 10S/s. The in vivo performance is demonstrated in laboratory animals.
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| 9. |
- Cao, Yuexin, et al.
(author)
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Minimal Control Placement of Turing's Model Using Symmetries
- 2023
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In: 2023 62nd IEEE Conference on Decision and Control, CDC 2023. - : Institute of Electrical and Electronics Engineers (IEEE). ; , s. 1456-1461
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Conference paper (peer-reviewed)abstract
- In this paper, the minimal control placement prob-lem for Turing's reaction-diffusion model is studied. Turing's model describes the process of morphogens diffusing and reacting with each other and is considered as one of the most fundamental models to explain pattern formation in a devel-oping embryo. Controlling pattern formation artificially has gained increasing attention in the field of development biology, which motivates us to investigate this problem mathematically. In this work, the two-dimensional Turing's reaction-diffusion model is discretized into square grids. The minimal control placement problem for the diffusion system is investigated first. The symmetric control sets are defined based on the symmetry of the network structure. A necessary condition is provided to guarantee controllability. Under certain circumstances, we prove that this condition is also sufficient. Then we show that the necessary condition can also be applied to the reaction-diffusion system by means of suitable extension of the symmetric control sets. Under similar circumstances, a sufficient condition is given to place the minimal control for the reaction-diffusion system.
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| 10. |
- Cao, Yuexin, et al.
(author)
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Network Controllability of Turing Reaction and Diffusion Model
- 2022
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In: 2022 41St Chinese Control Conference (Ccc). - : IEEE. ; , s. 259-264
-
Conference paper (peer-reviewed)abstract
- In this paper, the controllability problem of the reaction-diffusion (RD) model, or Turing model is studied. Turing model provides a valuable framework for self-organized system and has been widely used to explain to pattern formation in the real life. With the rapidly development of the biology technology, biologists are trying to control the pattern formation artificially and has achieved some progress. However, the influence that exerted on the pattern formation by the external factors, such as light and temperature, remains to be solved. In this work, The RD model is obtained following the assumptions in Turing's original paper and spatially discretized into square grids. The nodes in the outermost layer are considered as candidates for control. Controllability of the RD system with all such nodes as control is first shown. Then controllability of the RD system with minimal number of control nodes is studied. Our results show that nearly 87.5% control nodes can be saved while the system is still controllable. Numerical simulations are provided to demonstrate the effects of controlling the reaction and diffusion of the morphogens.
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