SwePub
Sök i SwePub databas

  Utökad sökning

Träfflista för sökning "WFRF:(Fu Yifeng 1984) srt2:(2005-2009)"

Sökning: WFRF:(Fu Yifeng 1984) > (2005-2009)

  • Resultat 1-10 av 10
Sortera/gruppera träfflistan
   
NumreringReferensOmslagsbildHitta
1.
  •  
2.
  •  
3.
  •  
4.
  • Fan, Yi, et al. (författare)
  • A study of fluid coolant with carbon nanotube suspension for MicroChannel coolers
  • 2008
  • Ingår i: 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008; Pudong, Shanghai; China; 28 July 2008 through 31 July 2008.
  • Konferensbidrag (refereegranskat)abstract
    • In this work, silicon microchannel coolers were made using the Deep Ion Reactive Etching (DIRE) technique. Stable and homogeneous Carbon NanoTube (CNT) suspension was also prepared. Meanwhile, a closed-loop cooling test system was developed to investigate the heat removal of the silicon microchannel cooler with different coolants. The experimental setup included a test module, a minipump for providing controllable flow, and a fan system for cooling the circular fluid. Beside the inlet and outlet of the test module, two thermocouples and pressure gauges were set up to measure the temperature and pressure of the fluids. The heat removal of the silicon microchannel cooler using different CNT volume fraction of suspension coolant was studied. The results show that the microchannel cooler with CNT suspension as coolant could strengthen the heat removal capability of microchannel cooler. In addition to heat transfer enhancement, the microchannel cooler with CNT suspension coolant did not produce extra pressure drop in the present study.
  •  
5.
  •  
6.
  •  
7.
  •  
8.
  • Fu, Yifeng, 1984, et al. (författare)
  • Development of a test platform for thermal characterization using through-silicon-via technology
  • 2009
  • Ingår i: IMAPS Nordic Annual Conference 2009; Tonsberg; Norway; 13 September 2009 through 15 September 2009. ; , s. 35-38
  • Konferensbidrag (refereegranskat)abstract
    • In order to look into the heat transfer mechanism and improve the thermal performance of an electronic component, a thermal test platform has been designed and fabricated. A series of micro-machining processes have been developed to make the test platform. The Through-Silicon-Via technique using Cu as a conductor has been used to fabricate the temperature sensors in order to realize an in-situ temperature monitoring on a thermal interface. Pt-based temperature sensor array has been deposited on the chip and calibrated by an industry standard RTD. Results show that the Pt sensors work well which demonstrates the successful deposition of temperature sensing materials and good interconnection between through-hole vias and IC components. This indicates that the test platform can be used for thermal interface material characterization as well as 3D electronics reliability studies.
  •  
9.
  •  
10.
  •  
Skapa referenser, mejla, bekava och länka
  • Resultat 1-10 av 10
 
pil uppåt Stäng

Kopiera och spara länken för att återkomma till aktuell vy