| 1. |
- Liu, Johan, 1960, et al.
(författare)
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Stem Cell Growth and Migration on Nanofibrous Polymer Scaffolds and Micro-Fluidic Channels on Silicon-Chip
- 2009
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Ingår i: Proceedings of the 2009 Electronic Components and Technology Conference. - 0569-5503. - 9781424444762 ; , s. 1080-1085
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Konferensbidrag (refereegranskat)abstract
- Stem cell growth and migration on nanofibrous scaffolds and micro-fluidic channels on Silicon-Chip were studied by using neural stem cells isolated from adult rats' brain. Electrospinning and lithographic technique were used for developing nanofibrous-polylactic acid (PLA) and polyurethane (PU) based-scaffolds and micro-fluidic channels on Si-Chips respectively. Immunocytochemical and morphological analysis showed better cell-matrix interaction with profound adhesion, proliferation and migration on the developed scaffolds. Cell culture assay with microfluidic channel revealed the ability of developed channel system in guiding neuronal stem cell growth towards specified directions. These studies extend the possibility of using developed nanofibrous scaffolds and micro-fluidic channel system for future electrical signal transmission based on living neural stem cells.
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| 2. |
- Wang, Teng, 1983, et al.
(författare)
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Through silicon vias filled with planarized carbon nanotube bundles
- 2009
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Ingår i: Nanotechnology. - : IOP Publishing. - 0957-4484 .- 1361-6528. ; 20:48
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Tidskriftsartikel (refereegranskat)abstract
- The feasibility of using carbon nanotube (CNT) bundles as the fillers of through silicon vias (TSVs) has been demonstrated. CNT bundles are synthesized directly inside TSVs by thermal chemical vapor deposition (TCVD). The growth of CNTs in vias is found to be highly dependent on the geometric dimensions and arrangement patterns of the vias at atmospheric pressure. The CNT-Si structure is planarized by a combined lapping and polishing process to achieve both a high removal rate and a fine surface finish. Electrical tests of the CNT TSVs have been performed and their electrical resistance was found to be in the few hundred ohms range. The reasons for the high electrical resistance have been discussed and possible methods to decrease the electrical resistance have been proposed.
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| 3. |
- Andersson, Cristina, 1969, et al.
(författare)
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Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages
- 2009
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Ingår i: Soldering and Surface Mount Technology. - : Emerald. - 1758-6836 .- 0954-0911. ; 21:2, s. 28-38
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Tidskriftsartikel (refereegranskat)abstract
- Purpose - The purpose of this paper is to assess the effect of different temperature cycling profiles on the reliability of lead-free 388 plastic ball grid array (PBGA) packages and to deeply understand crack initiation and propagation.Design/methodology/approach - Temperature cycling of Sn-3.8Ag-0.7Cu PBGA packages was carried out at two temperature profiles, the first ranging between - 55 degrees C and 100 degrees C (TC1) and the second between 0 degrees C and 100 degrees C (TC2). Crack initiation and propagation was analyzed periodically and totally 7,000 cycles were run for TO and 14,500 for TC2. Finite element modeling (FEM), for the analysis of strain and stress, was used to corroborate the experimental results.Findings - The paper finds that TC1 had a characteristic life of 5,415 cycles and TC2 of 14,094 cycles, resulting in an acceleration factor of 2.6 between both profiles. Cracks were first visible for TC1, after 2,500 cycles, and only after 4,000 cycles for TC2. The crack propagation rate was faster for TC1 compared to TC2, and faster at the package side compared to the substrate side. The difference in crack propagation rate between the package side and substrate side was much larger for TC1 compared to TC2. Cracks developed first at the package side, and were also larger compared to the substrate side. The Cu tracks on the substrate side affected the crack propagation sites and behaved as SMD. All cracks propagated through the solder and crack propagation was mainly intergranular. Crack propagation was very random and did not follow the distance to neutral point (DNP) theory. FEM corroborated the experimental results, showing both the same critical location of highest creep strain and the independence of DNP.Originality/value - Such extensive work on the reliability assessment of Pb-free 388 PBGA packages has never been performed. This work also corroborates the results from other studies showing the difference in behavior between Pb-free and Pb-containing alloys.
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| 4. |
- Carlberg, Björn, 1983, et al.
(författare)
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Electrospun polyurethane scaffolds for proliferation and neuronal differentiation of human embryonic stem cells.
- 2009
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Ingår i: Biomedical materials (Bristol, England). - : IOP Publishing. - 1748-605X .- 1748-6041. ; 4:4
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Tidskriftsartikel (refereegranskat)abstract
- Adult central nervous system (CNS) tissue has a limited capacity to recover after trauma or disease. Hence, tissue engineering scaffolds intended for CNS repair and rehabilitation have been subject to intense research effort. Electrospun porous scaffolds, mimicking the natural three-dimensional environment of the in vivo extracellular matrix (ECM) and providing physical support, have been identified as promising candidates for CNS tissue engineering. The present study demonstrates in vitro culturing and neuronal differentiation of human embryonic stem cells (hESCs) on electrospun fibrous polyurethane scaffolds. Electrospun scaffolds composed of biocompatible polyurethane resin (Desmopan 9370A, Bayer MaterialScience AG) were prepared with a vertical electrospinning setup. Resulting scaffolds, with a thickness of approximately 150 microm, exhibited high porosity (84%) and a bimodal pore size distribution with peaks at 5-6 and 1 microm. The mean fiber diameter was measured to approximately 360 nm with a standard deviation of 80 nm. The undifferentiated hESC line SA002 (Cellartis AB, Göteborg, Sweden) was seeded and cultured on the produced scaffolds and allowed propagation and then differentiation for up to 47 days. Cultivation of hESC on electrospun fibrous scaffolds proved successful and neuronal differentiation was observed via standard immunocytochemistry. The results indicate that predominantly dopaminergic tyrosine hydroxylase (TH) positive neurons are derived in co-culture with fibrous scaffolds, in comparison to reference cultures under the same differentiation conditions displaying large proportions of GFAP positive cell types. Scanning electron micrographs confirm neurite outgrowth and connection to adjacent cells, as well as cell attachment to individual fibers of the fibrous scaffold. Consequently, electrospun polyurethane scaffolds have been proven feasible as a substrate for hESC propagation and neuronal differentiation. The physical interaction between cells and the fibrous scaffold indicates that these scaffolds provide a three-dimensional physical structure; a potential candidate for neural tissue engineering repair and rehabilitation.
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| 5. |
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| 6. |
- Chen, S., et al.
(författare)
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Coffin-Mansson equation of Sn-4.0Ag-0.5Cu solder joint
- 2009
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Ingår i: Soldering and Surface Mount Technology. - : Emerald. - 1758-6836 .- 0954-0911. ; 21:2, s. 48-54
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Tidskriftsartikel (refereegranskat)abstract
- Purpose: The purpose of this paper is to fit Coffin-Manson equation of Sn-4.0Ag-0.5Cu lead free solder joint by using results of solders joint reliability test and finite element analysis. Also to present a novel device for solder joint reliability test. Design/methodology/approach: Two-points bending test of Sn-4.0Ag-0.5Cu lead free solder joint was carried out at three deflection levels by using a special bending tester that can control displacement exactly by a cam system. The failure criterion was defined as resistance of solder joint getting 10 percent increase. The X-section was done for all failure samples to observe crack initiation and propagation in solder joint. Finite element analysis was presented with ANSYS for obtaining shear strain range, analyzing distribution of stress and strain and supporting experimental results. Findings: The experimental results indicate that the fatigue life decreased obviously with the displacement increased. By using optical microscope and SEM photographs, two kinds of failure mode were found in solder joint. The majority failure mode took place at the bottom corner of solder joint under the termination of resistor initially, and propagated into the solder matrix. Another failure mode was delamination. It appeared at the interface between the termination of resistor and its ceramic body. The distribution status of stress and strain in solder joint and the calculation results of shear strain range at different deflection levels were obtained from simulation result. The Coffin-Manson equation of Sn-4.0Ag-0.5Cu lead free solder joint was fitted by combining experimental data with result of finite element analysis. Originality/value: This paper presents Coffin-Manson equation of Sn-4.0Ag-0.5Cu solder joint with two-points bending test. An effective and economical device was designed and applied.
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| 7. |
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| 8. |
- Fan, Yi, et al.
(författare)
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Computational Fluid Dynamics for Effects of Coolants on On-chip Cooling Capability with Carbon Nanotube Micro-fin Architectures
- 2009
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Ingår i: Microsystem Technologies. - : Springer Science and Business Media LLC. - 0946-7076 .- 1432-1858. ; 15:3, s. 375-381
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Tidskriftsartikel (refereegranskat)abstract
- Carbon nanotubes (CNTs) have shown a broad promising application in high mechanical strength and electronic structure. In this work, the effects of coolants on heat transfer capability of on-chip cooling with CNTs Micro-fin Architectures was studied, and the two-dimensional computational fluid dynamics (CFD) simulations have been done for a series of material parameters of coolants in this paper. The influences of thermal conductivity, density, specific heat and viscosity on cooling have been obtained in the case studies. The results demonstrate that pressure drop between the inlet and outlet of the cooling device is dependent on coolant's density and viscosity. Consequently, it will be necessary to find out a good balance between heat transfer capability and pressure drop. The simulation results also indicate that the heat sink capability will be better if there are more fin rows in the microchannel.
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| 10. |
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