| 41. |
- Hu, Z. L., et al.
(author)
-
Molecular dynamics simulation of inertial trapping-induced atomic scale mass transport inside single walled carbon nanotubes
- 2013
-
In: Applied Physics Letters. - : AIP Publishing. - 0003-6951 .- 1077-3118. ; 102:8
-
Journal article (peer-reviewed)abstract
- The forced transverse vibration of a single-walled carbon nanotube (SWNT) embedded with atomic-size particles was investigated using molecular dynamic simulations. The particles inside the cylindrical cantilever can be trapped near the antinodes or at the vicinity of the SWNT tip. The trapping phenomenon is highly sensitive to the external driving frequencies such that even very small changes in driving frequency can have a strong influence on the probability of the location of the particle inside the SWNT. The trapping effect could potentially be employed to realize the atomic scale control of particle position inside an SWNT via the finite adjustment of the external driving frequency. It may also be suggested that the trapping phenomenon could be utilized to develop high-sensitive mass detectors based on a SWNT resonator.
|
|
| 42. |
- Hu, Zhili, 1983, et al.
(author)
-
Molecular Gun Composed of Carbon Nanotube
- 2011
-
In: Journal of Computational and Theoretical Nanoscience. - : American Scientific Publishers. - 1546-1955 .- 1546-1963. ; 8:9, s. 1716-1719
-
Journal article (peer-reviewed)abstract
- Using molecular simulation, this paper predicts that by bending one end of the outer carbon nanotube (CNT) of a double-wall CNT (DWCNT), the inner CNT could possibly be shot out with a speed of several 100 m/s, and a kinetic energy of several eV from either left or the right end of the outer CNT, depending on the length of inner CNT. Analysis in this paper suggests that the outer CNT is a supplier of the CNT bullet's kinetic energy and the bullet can be shot out only if the outer CNT buckles while the inner CNT does not. Noticeably, such molecular gun could be practical in experiment environment since the bending of a CNT could be obtained by applying external electrical field.
|
|
| 43. |
- Hu, Zhili, 1983, et al.
(author)
-
The effect of modulus on the performance of thermal conductive adhesives
- 2010
-
In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010. - 9781424481422 ; :Article number 5582884, s. 648-651
-
Conference paper (peer-reviewed)abstract
- By analyzing the effect of modulus of epoxy and modulus of filler particles on the thermal conductivity of thermal conductive adhesives (TCA), this paper concludes, in contrast to intuition, that the stiffer epoxy will generate a larger contact area, and the "soft" epoxy with modulus of 0.5GPa will create the largest contact area, hence the highest thermal conductivity. Therefore, it is advisable to adopt softer epoxy in TCA. On the other hand, this paper finds that if the shrinkage of epoxy is low, i.e. 1% linear shrinkage, fillers composed of a mixture of Ag flakes and certain high stiffness material will cause a higher thermal conductivity, i.e. 7% larger than that of pure Ag fillers. This suggests that with low shrinkage epoxy, it is advisable to mix Ag flakes with high stiffness particles, e.g. Diamond or SiC. However, when linear shrinkage of epoxy is high, i.e. 3%, the highest thermal conductivity is achieved by using pure Ag fillers. Therefore, in such cases it is not advisable to use Bi-model. © 2010 IEEE.
|
|
| 44. |
|
|
| 45. |
- Huang, Shirong, et al.
(author)
-
Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology
- 2013
-
In: 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013). - 9781479928330 ; , s. 347-352
-
Conference paper (peer-reviewed)abstract
- Monolayer graphene was synthesized through thermal chemical vapor deposition (TCVD) as heat spreader for chip cooling. Platinum (Pt) serpentine functioned as hot spot on the thermal testing chip. The thermal testing chip with monolayer graphene film attached was bonded using flip-chip technology. The temperature at the hot spot with a monolayer graphene film as heat spreader was decreased by about 12°C and had a more uniform temperature compared to those without graphene heat spreader when driven by a heat flux of about 640W/cm 2 . Further improvements to the cooling performance of graphene heat spreader could be made by optimizing the synthesis parameters and transfer process of graphene films. © 2013 IEEE.
|
|
| 46. |
|
|
| 47. |
- Inoue, Masahiro, et al.
(author)
-
Anisotropic Thermal Conductivity in Electrically Conductive Adhesives with Single- and Bimodal Filler-size Distributions Containing Ag Flakes and Micro-particles
- 2010
-
In: 3rd Electronics System Integration Technology Conference, ESTC 2010; Berlin; Germany; 13 September 2010 through 16 September 2010. - 9781424485536
-
Conference paper (peer-reviewed)abstract
- Adhesives containing Ag flakes and spherical micro-particles were prepared. The variations in their electrical and thermal conductivities with matrix chemistry and curing temperature were investigated. Due to the alignment of Ag flakes along the in-plane direction, the adhesives containing only Ag flakes provided maximum thermal conductivity in this direction. Introduction of Ag spherical micro-particles effectively improved the thermal conductivity in the vertical direction for the bi- and single-modal adhesives. The adhesives containing only micro-particles are expected to be most effective from the viewpoint of the number of interfaces. However, the filler size distributions that provide maximum thermal conductivity in the vertical direction alter depending on the matrix chemistry and curing temperature due to variation in the interfacial thermal resistance between fillers.
|
|
| 48. |
|
|
| 49. |
|
|
| 50. |
|
|
