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Hexacoordinated Gallium(III) Triazenide Precursor for Epitaxial Gallium Nitride by Atomic Layer Deposition

Rouf, Polla (author)
Linköpings universitet,Kemi,Tekniska fakulteten
Samii, Rouzbeh (author)
Linköpings universitet,Kemi,Tekniska fakulteten
Rönnby, Karl (author)
Linköpings universitet,Kemi,Tekniska fakulteten
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Bakhit, Babak (author)
Linköpings universitet,Tunnfilmsfysik,Tekniska fakulteten
Buttera, Sydney C. (author)
Carleton Univ, Canada
Martinovic, Ivan (author)
Linköpings universitet,Halvledarmaterial,Tekniska fakulteten
Ojamäe, Lars (author)
Linköpings universitet,Kemi,Tekniska fakulteten
Chih-Wei, Chih-Wei (author)
Linköpings universitet,Halvledarmaterial,Tekniska fakulteten
Palisaitis, Justinas (author)
Linköpings universitet,Tunnfilmsfysik,Tekniska fakulteten
Kessler, Vadim (author)
Swedish University of Agricultural Sciences,Sveriges lantbruksuniversitet,Institutionen för Molekylära vetenskaper,Department of Molecular Sciences,Swedish Univ Agr Sci, Sweden
Pedersen, Henrik (author)
Linköpings universitet,Kemi,Tekniska fakulteten
O´brien, Nathan (author)
Linköpings universitet,Kemi,Tekniska fakulteten
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 (creator_code:org_t)
 
2021-04-22
2021
English.
In: Chemistry of Materials. - : AMER CHEMICAL SOC. - 0897-4756 .- 1520-5002. ; 33:9, s. 3266-3275
  • Journal article (peer-reviewed)
Abstract Subject headings
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  • Gallium nitride (GaN) is the main component of modern-day high electron mobility transistors due to its favorable electronic properties. As electronic devices become smaller with more complex surface architecture, the ability to deposit high-quality GaN films at low temperatures is required. Herein, we report a new highly volatile Ga(III) triazenide precursor and demonstrate its ability to deposit high-quality epitaxial GaN by atomic layer deposition (ALD). This new Ga(III) triazenide, the first hexacoordinated Ga-N bonded precursor used in a vapor deposition process, was easily synthesized and purified by either sublimation or recrystallisation. Thermogravimetric analysis showed single-step volatilization with an onset temperature of 155 degrees C and negligible residual mass. Three temperature intervals with self-limiting growth were observed when depositing GaN films. The GaN films grown in the second growth interval at 350 degrees C were epitaxial on 4H-SiC without an AlN seed layer and found to have a near stoichiometric Ga/N ratio with very low levels of impurities. In addition, electron microstructure analysis showed a smooth film surface and a sharp interface between the substrate and film. The band gap of these films was 3.41 eV with the Fermi level at 1.90 eV, showing that the GaN films were unintentionally n-type-doped. This new triazenide precursor enables ALD of GaN for semiconductor applications and provides a new Ga(III) precursor for future deposition processes.

Subject headings

NATURVETENSKAP  -- Fysik -- Den kondenserade materiens fysik (hsv//swe)
NATURAL SCIENCES  -- Physical Sciences -- Condensed Matter Physics (hsv//eng)
NATURVETENSKAP  -- Kemi -- Materialkemi (hsv//swe)
NATURAL SCIENCES  -- Chemical Sciences -- Materials Chemistry (hsv//eng)

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