High-dose Al-implanted 4H-SiC p(+)-n-n(+) junctions

• p(+)-n-n(+) junctions were fabricated by ion implantation with Al of low-doped epitaxial n layers of 4H-SiC grown by chemical vapor deposition on commercial 4H-SiC wafers both with and without reduction of micropipe densities. It was shown that, using high levels of Al ion doping (5x10(16) cm(-2)) in combination with rapid thermal anneal, single-crystal p(+)-4H-SiC layers can be obtained. These layers do not form barriers at the contact metal-semiconductor interface and do not introduce additional resistance into structures with p(+)-n junctions. This significantly reduces the forward voltage drop across the structure in a wide range of current densities up to 10(4) A cm(-2).

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