Influence of surface treatment prior to ALD high-kappa dielectrics on the performance of SiGe surface-channel pMOSFETs

• Compressively strained Si0.7Ge0.3 surface-channel pMOSFETs with atomic layer deposition (ALD) Al2O3/HfO2/Al2O3 nanolaminate and low-pressure chemical vapor deposition p(+) poly-SiGe gate electrode were fabricated. Surface treatment with either hydrogen fluoride (HF) clean, or HF clean followed by water rinse was performed prior to the ALD processing. The devices with water rinse show a good control of interfacial layer and device reproducibility, while the devices without water rinse lack a clearly observable interfacial layer and show scattered electrical characteristics and distorted mobility curve. A similar to20% increase in hole mobility compared to the Si universal mobility and a similar to0.6-nm-thick continuous interfacial layer are obtained for the pMOSFETs with water rinse.

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Nyckelord

atomic layer deposition (ALD)

high-kappa

MOSFET

SiGe

surface

channel

surface treatment

gate dielectrics

layers

Publikations- och innehållstyp

ref (ämneskategori)

art (ämneskategori)