Sökning: onr:"swepub:oai:DiVA.org:kth-24815" >
Effects of bonding ...
Effects of bonding process parameters on wafer-to-wafer alignment accuracy in benzocyclobutene (BCB) dielectric wafer bonding
-
- Niklaus, Frank (författare)
- KTH,Mikrosystemteknik
-
Kumar, R J (författare)
-
McMahon, J J (författare)
-
visa fler...
-
Yu, J (författare)
-
Matthias, T (författare)
-
Wimplinger, M (författare)
-
Lindner, P (författare)
-
Lu, J. Q. (författare)
-
Cale, T. S. (författare)
-
Gutmann, R J (författare)
-
visa färre...
-
(creator_code:org_t)
- WARRENDALE, PA : MATERIALS RESEARCH SOCIETY, 2005
- 2005
- Engelska.
-
Ingår i: Materials, Technology and Reliability of Advanced Interconnects-2005. - WARRENDALE, PA : MATERIALS RESEARCH SOCIETY. - 1558998160 ; , s. 393-398
- Relaterad länk:
-
https://urn.kb.se/re...
Abstract
Ämnesord
Stäng
- Wafer-level three-dimensional (3D) integration is an emerging technology to increase the performance and functionality of integrated circuits (ICs). Aligned wafer-to-wafer bonding with dielectric polymer layers (e.g., benzocyclobutene (BCB)) is a promising approach for manufacturing of 3D ICs, with minimum bonding impact on the wafer-to-wafer alignment accuracy essential. In this paper we investigate the effects of thermal and mechanical bonding parameters on the achievable post-bonding wafer-to-wafer alignment accuracy for polymer wafer bonding with 200 trim diameter wafers. Our baseline wafer bonding process with soft-baked BCB (similar to 35% cross-linked) has been modified to use partially cured (similar to 43% crosslinked) BCB. The partially cured BCB layer does not reflow during bonding, minimizing the impact of inhomogeneities in BCB reflow under compression and/or slight shear forces at the bonding interface. As a result, the non-uniformity of the BCB layer thickness after wafer bonding is less than 0.5% of the nominal layer thickness and the wafer shift relative to each other during the wafer bonding process is less than 1 mu m (average) for 200 mm diameter wafers. The critical adhesion energy of a bonded wafer pair with the partially cured BCB wafer bonding process is similar to that with soft-baked BCB.
Ämnesord
- TEKNIK OCH TEKNOLOGIER -- Materialteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Materials Engineering (hsv//eng)
Nyckelord
- Materials science
- Teknisk materialvetenskap
Publikations- och innehållstyp
- ref (ämneskategori)
- kon (ämneskategori)
Hitta via bibliotek
Till lärosätets databas
- Av författaren/redakt...
-
Niklaus, Frank
-
Kumar, R J
-
McMahon, J J
-
Yu, J
-
Matthias, T
-
Wimplinger, M
-
visa fler...
-
Lindner, P
-
Lu, J. Q.
-
Cale, T. S.
-
Gutmann, R J
-
visa färre...
- Om ämnet
-
- TEKNIK OCH TEKNOLOGIER
-
TEKNIK OCH TEKNO ...
-
och Materialteknik
- Artiklar i publikationen
-
Materials, Techn ...
- Av lärosätet
-
Kungliga Tekniska Högskolan