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Wafer-level integra...
Wafer-level integration of NiTi shape memory alloy wires for the fabrication of microactuators using standard wire bonding technology
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- Fischer, Andreas C., 1982- (författare)
- KTH,Mikrosystemteknik
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- Gradin, Henrik (författare)
- KTH,Mikrosystemteknik
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- Braun, Stefan (författare)
- KTH,Mikrosystemteknik
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- Schröder, Stephan (författare)
- KTH,Mikrosystemteknik
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- Stemme, Göran (författare)
- KTH,Mikrosystemteknik
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- Niklaus, Frank (författare)
- KTH,Mikrosystemteknik
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(creator_code:org_t)
- IEEE, 2011
- 2011
- Engelska.
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Ingår i: 24th International Conference on Micro Electro Mechanical Systems (MEMS), 2011 IEEE. - : IEEE. ; , s. 348-351
- Relaterad länk:
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http://ieeexplore.ie...
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https://kth.diva-por... (primary) (Raw object)
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https://urn.kb.se/re...
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https://doi.org/10.1...
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Abstract
Ämnesord
Stäng
- This paper reports on the first integration of SMA wires into silicon based MEMS structures using a standard wire bonder. This approach allows fast and efficient placement, alignment and mechanical attachment of NiTi-based SMA wires to silicon-based MEMS. The wires are mechanically anchored and clamped into deep-etched silicon structures on a wafer. The placement precision is high with an average deviation of 4 #x03BC;m and the mechanical clamping is strong, allowing successful actuation of the SMA wires.
Nyckelord
- MEMS structures;NiTi;SMA wires;deep-etched silicon structures;mechanical clamping;microactuator fabrication;shape memory alloy wire;size 4 mum;standard wire bonding technology;wafer-level integration;etching;lead bonding;microactuators;nickel compounds;wafer level packaging
Publikations- och innehållstyp
- ref (ämneskategori)
- kon (ämneskategori)