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Very large scale he...
Very large scale heterogeneous integration (VLSHI) and wafer-level vacuum packaging for infrared bolometer focal plane arrays
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- Forsberg, Fredrik (författare)
- KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden
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- Roxhed, Niclas (författare)
- KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden
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- Fischer, Andreas C., 1982- (författare)
- KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden
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- Samel, Björn (författare)
- RISE,Acreo,Acreo AB
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- Ericsson, Per (författare)
- RISE,Acreo,Acreo AB
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- Hoivik, Nils D. (författare)
- Sensonor AS, Norway
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- Lapadatu, Adriana Cozma (författare)
- Sensonor AS, Norway
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- Bring, Martin (författare)
- Sensonor AS, Norway
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- Kittilsland, Gjermund (författare)
- Sensonor AS, Norway
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- Stemme, Göran (författare)
- KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden
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- Niklaus, Frank (författare)
- KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden
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(creator_code:org_t)
- Elsevier BV, 2013
- 2013
- Engelska.
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Ingår i: Infrared physics & technology. - : Elsevier BV. - 1350-4495 .- 1879-0275. ; 60, s. 251-259
- Relaterad länk:
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https://urn.kb.se/re...
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https://doi.org/10.1...
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https://urn.kb.se/re...
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Abstract
Ämnesord
Stäng
- Imaging in the long wavelength infrared (LWIR) range from 8 to 14 μm is an extremely useful tool for non-contact measurement and imaging of temperature in many industrial, automotive and security applications. However, the cost of the infrared (IR) imaging components has to be significantly reduced to make IR imaging a viable technology for many cost-sensitive applications. This paper demonstrates new and improved fabrication and packaging technologies for next-generation IR imaging detectors based on uncooled IR bolometer focal plane arrays. The proposed technologies include very large scale heterogeneous integration for combining high-performance, SiGe quantum-well bolometers with electronic integrated read-out circuits and CMOS compatible wafer-level vacuum packing. The fabrication and characterization of bolometers with a pitch of 25 μm × 25 μm that are arranged on read-out-wafers in arrays with 320 × 240 pixels are presented. The bolometers contain a multi-layer quantum well SiGe thermistor with a temperature coefficient of resistance of -3.0%/K. The proposed CMOS compatible wafer-level vacuum packaging technology uses Cu-Sn solid-liquid interdiffusion (SLID) bonding. The presented technologies are suitable for implementation in cost-efficient fabless business models with the potential to bring about the cost reduction needed to enable low-cost IR imaging products for industrial, security and automotive applications.
Nyckelord
- Bolometer
- IR
- MEMS
- Thermal imaging
- Very large scale heterogeneous integration
- Automotive applications
- Cost-sensitive applications
- Fabrication and characterizations
- Heterogeneous integration
- Long-wavelength infrared ranges
- Noncontact measurements
- Temperature coefficient of resistance
- Wafer level vacuum packaging
- Bolometers
- CMOS integrated circuits
- Cost reduction
- Infrared detectors
- Infrared imaging
- Infrared radiation
- Integration
- Iridium
- Semiconductor quantum wells
- Silicon alloys
- Technology
- Vacuum
- Wafer bonding
- Electronics packaging
Publikations- och innehållstyp
- ref (ämneskategori)
- art (ämneskategori)
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Till lärosätets databas
- Av författaren/redakt...
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Forsberg, Fredri ...
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Roxhed, Niclas
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Fischer, Andreas ...
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Samel, Björn
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Ericsson, Per
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Hoivik, Nils D.
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visa fler...
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Lapadatu, Adrian ...
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Bring, Martin
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Kittilsland, Gje ...
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Stemme, Göran
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Niklaus, Frank
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visa färre...
- Artiklar i publikationen
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Infrared physics ...
- Av lärosätet
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RISE
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Kungliga Tekniska Högskolan