Ceramic microcomponents for high-temperature fluidics

• For aggressive environments, the material properties of silicon become a limitation. Macroscopically, ceramics are as abundant for high-temperature applications as is silicon in miniaturized systems, but this group of materials has been little exploited for MEMS components. A major reason is the lack of means for high-resolution structuring. This paper describes the application of silicon-based manufacturing processes in the fabrication of ceramic yet truly micromechanical structures and devices for very high-temperature applications, and demonstrates the technique’s implementation in, and significance for, high-temperature microfluidics. Embossing of structures down to 2 µm wide is demonstrated, as well as deep embossing (50 µm), punching through 15 µm tape, and lamination of structured layers. The resulting samples survive temperatures of 1400ºC.

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Materialteknik -- Annan materialteknik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Materials Engineering -- Other Materials Engineering (hsv//eng)

Nyckelord

microfluidics

high-temperature

ceramics

Other materials science

Övrig teknisk materialvetenskap

Teknisk fysik med inriktning mot mikrosystemteknik

Engineering Science with specialization in Microsystems Technology

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