Compositional variations of sputter deposited Ti/W barrier layers on substrates with pronounced surface topography

• Sputter deposited Ti/W barrier layers have been found to be Ti deficient with respect to the target composition, which is attributed to the preferential resputtering of Ti from the deposited films by energetic neutrals or ions from the discharge. On the o

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Nyckelord

deposition process; titanium; tungsten; ion bombardment; YIELD AMPLIFICATION; ION-BOMBARDMENT; MICROSTRUCTURE

Electronics

Elektronik

Publikations- och innehållstyp

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