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Fabrication, micros...
Fabrication, microstructure, and thermal conductivity of multilayered Cu mesh/AZ31 Mg foil composites
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- Yao, Fanjin (författare)
- Chongqing University
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- You, Guoqiang (författare)
- Chongqing University
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- Zeng, Sheng (författare)
- Chongqing University
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- Zhou, Kaixuan (författare)
- Chongqing University
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- Peng, Lizhen (författare)
- Chongqing University
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- Ming, Yue (författare)
- Lund University,Lunds universitet,Materialteknik,Institutionen för maskinvetenskaper,Institutioner vid LTH,Lunds Tekniska Högskola,Materials Engineering,Department of Mechanical Engineering Sciences,Departments at LTH,Faculty of Engineering, LTH,Chongqing University
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(creator_code:org_t)
- Elsevier BV, 2021
- 2021
- Engelska 12 s.
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Ingår i: Journal of Materials Research and Technology. - : Elsevier BV. - 2238-7854. ; 14, s. 1539-1550
- Relaterad länk:
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http://dx.doi.org/10... (free)
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https://doi.org/10.1...
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https://lup.lub.lu.s...
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https://doi.org/10.1...
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Abstract
Ämnesord
Stäng
- In this study, multilayered Cu mesh/AZ31 Mg foil composites were designed and fabricated by diffusion bonding in a closed graphite mold at 400–445 °C. The effects of temperature on the microstructure of the joints formed and the thermal conductivity of the composite was evaluated. The mechanism responsible for the observed improvement in thermal conductivity was analyzed. After diffusion bonding, the thermal conductivity of the multilayered composite was as high as 122.3 W/m·K at room temperature (25 °C), which is 109.4% higher than that of the AZ31 Mg alloy (58.4 W/m·K) fabricated using the same process. Moreover, the fabricated Mg matrix composites had a maximum density of 2.21 g/cm3, indicating that they were lightweight. A continuous film-like structure composed of intermetallic compounds and α-Mg region with good contribution to heat conduction has been found, which has a reference for the design and fabrication of high-thermal-conductivity Mg matrix composites.
Ämnesord
- TEKNIK OCH TEKNOLOGIER -- Materialteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Materials Engineering (hsv//eng)
Nyckelord
- Cu mesh
- Diffusion bonding
- Mg-based composites
- Microstructure
- Thermal conductivity
Publikations- och innehållstyp
- art (ämneskategori)
- ref (ämneskategori)
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