On-Chip Sensors for Temperature Monitoring of Packaged GaN MMICs

• A novel approach to on-chip temperature sensors for non-invasive thermal characterization and monitoring of packaged GaN MMICs is presented. The proposed sensor is fully compatible with commercial GaN foundry processes and enables improved reliability estimation of highly integrated systems. A dedicated test structure is developed to demonstrate the capabilities of the sensor, and an accurate calibration method of its temperature response is proposed. This combination allows for continuous temperature monitoring during operation with electrical acquisition of temperature transients. The method also enables the thermal characterization of the device and package.

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Robotteknik och automation (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Robotics (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Nyckelord

Resistors

Electro-thermal effects

MMIC

Semiconductor device packaging

Sensors

Monitoring

Temperature measurement

MODFETs

Temperature sensors

GaN

Thermal sensors

Sensor phenomena and characterization

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