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Integrated front-en...
Integrated front-ends up to 200 GHz
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- Vassilev, Vessen, 1969 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Wadefalk, Niklas, 1973 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Abbasi, Morteza, 1982 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Kozhuharov, Rumen, 1949 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Zirath, Herbert, 1955 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Gunnarsson, Sten, 1976 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Pellikka, T. (författare)
- Omnisys Instruments AB
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- Emrich, Anders, 1962 (författare)
- Omnisys Instruments AB
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- Kallfass, Ingmar (författare)
- Fraunhofer-Institut fur Angewandte Festkorperphysik - IAF
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- Leuther, Arnulf (författare)
- Fraunhofer-Institut fur Angewandte Festkorperphysik - IAF
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(creator_code:org_t)
- ISBN 9781612849652
- 2011
- 2011
- Engelska.
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Ingår i: 2011 IEEE MTT-S International Microwave Workshop on Millimeter Wave Integration Technologies, IMWS 2011, Sitges, 15 September 2011 through 16 September 2011. - 9781612849652 ; , s. 57-60
- Relaterad länk:
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http://dx.doi.org/10...
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https://research.cha...
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https://doi.org/10.1...
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Abstract
Ämnesord
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- In this paper, we present results of work done in packaging highly integrated circuits based on 100nm mHEMT technology. We present several examples of fully integrated receivers and sources for frequencies bands 90-130 GHz and 160-210 GHz. The circuits are packaged into waveguide blocks, characterized and compared to on-wafer measurements. Waveguide to microstrip transitions based on 50 um alumina substrate, and including via holes, are used to effectively interface the MMICs to a rectangular waveguide at RF without using tuning structures to resonate wire-inductance. Noise and return loss are characterized on wafer and after packaging. Typical increase of 0.7 dB in the NF is observed at 90-130 GHz after the packaging and 1 dB at 160-210 GHz. We address the issue of MMICs with high level of integration resulting in large cavities in the package causing instabilities for certain biasing conditions. Some of the packaged modules are characterized at both room and cryogenic temperatures. © 2011 IEEE.
Ämnesord
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
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Vassilev, Vessen ...
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Wadefalk, Niklas ...
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Abbasi, Morteza, ...
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Kozhuharov, Rume ...
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Zirath, Herbert, ...
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Gunnarsson, Sten ...
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visa fler...
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Pellikka, T.
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Emrich, Anders, ...
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Kallfass, Ingmar
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Leuther, Arnulf
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visa färre...
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- TEKNIK OCH TEKNOLOGIER
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2011 IEEE MTT-S ...
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Chalmers tekniska högskola