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A highly integrated...
A highly integrated chipset for 40 Gbps wireless D-band communication based on a 250 nm InP DHBT technology
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- Carpenter, Sona, 1983 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- He, Zhongxia Simon, 1984 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Bao, M. (författare)
- Telefonaktiebolaget L M Ericsson,Ericsson
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- Zirath, Herbert, 1955 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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(creator_code:org_t)
- ISBN 9781479936229
- 2014
- 2014
- Engelska.
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Ingår i: Technical Digest - IEEE Compound Semiconductor Integrated Circuit Symposium, CSIC. - 1550-8781. - 9781479936229
- Relaterad länk:
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http://dx.doi.org/10...
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https://research.cha...
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https://doi.org/10.1...
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Abstract
Ämnesord
Stäng
- A highly integrated chipset comprising a transmitter (TX) and a receiver (RX) chip, based on a 250 nm InP DHBT technology for high data rate D-band (110-170 GHz) wireless communication is described. The chipset is designed for point-to-point wireless communication for 4G and 5G mobile communication infrastructure, high data rate backhaul, low-latency wireless HDTV transmission and >40 Gbps transmission over dielectric waveguide. The measured RX conversion gain is 26 dB, with a noise figure of 9 dB. The measured TX conversion gain is 20 dB. A maximum QPSK data rate of 44 Gbps is demonstrated, which exceeds the present state-of-the art in the D-band by a factor of 2.
Ämnesord
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Nyckelord
- InP DHBT
- D-band
- Wireless communication
- RX/TX
- QPSK
- BPSK
Publikations- och innehållstyp
- kon (ämneskategori)
- ref (ämneskategori)
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