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Wafer bonding: A fl...
Wafer bonding: A flexible way to manufacture SOI materials for high performance applications
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- Bengtsson, Stefan, 1961 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Amirfeiz, Petra, 1973 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Johansson, Mikael (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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(creator_code:org_t)
- 2004
- 2004
- Engelska.
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Ingår i: Proc. 19th Symp. on Microelectronics Technology and Devices. ; 3, s. 241-
- Relaterad länk:
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https://research.cha...
Abstract
Ämnesord
Stäng
- An overview is given on the use of wafer bonding for formation of Silicon-On-Insulator (SOI) materials for high performance applications. Recent developments in wafer bonding and available techniques for formation of thin semiconductor films is presented. Furthermore, a review is given on results in use of wafer bonding for formation of advanced SOI-materials. Finally, a more detailed discussion is given on the use of wafer bonding for manufacture of SOI-materials intended for high-frequency applications and SOI-materials with films of electrically insulating but highly thermally conductive materials as buried insulators.
Ämnesord
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Nyckelord
- Thin films
- Strength of materials
- Silicon on insulator technology
- MOSFET devices
- CMOS integrated circuits
- Thermal conductivity
- Silicon on sapphire technology
- Silicon wafers
Publikations- och innehållstyp
- kon (ämneskategori)
- ref (ämneskategori)