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Homogenization Mode...
Homogenization Model Based on Micropolar Theory for the Interconnection Layer in Microsystem Packaging
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- Zhang, Yan, 1976 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Larsson, Ragnar, 1960 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Fan, Jing-yu (författare)
- Shanghai University
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visa fler...
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- Cheng, Zhaonian, 1942 (författare)
- Shanghai University
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- Liu, Johan, 1960 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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visa färre...
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(creator_code:org_t)
- ISBN 1424404886
- 2006
- 2006
- Engelska.
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Ingår i: Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06). - 1424404886 ; , s. 166-170
- Relaterad länk:
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https://research.cha...
Abstract
Ämnesord
Stäng
- The increase in microsystem packaging density sets the requiement for component sizes in the system to become smaller and smaller. The scale decrease makes the analysis more complicated as the corresponding resolution should be improved to a great extent. Interconnection in the system is a typical interface structure that widely appear in the packaing system, in which periodic microstructures may be included inside. A homogenization model is developed in this paper, which focuses on the interface behavior. The interface model based on micropolar theory provides a natural way to include the characteristic scale that can reflect the size effect of the considered structure. Computations are carried out as the numerical example of the model, and comparisons of this model with those of the convertional method show its validity and efficiency.
Ämnesord
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
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- ref (ämneskategori)
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