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Electroless deposit...
Electroless deposition of high-uniformity nickel microbumps with ultrahigh resolution of 8 μm pitch for monolithic Micro-LED display
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- Lu, Yu (författare)
- Fuzhou University
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- Lin, Chang (författare)
- Fuzhou University
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- Tian, Liang (författare)
- Fuzhou University
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visa fler...
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- Wang, Shuaishuai (författare)
- Fuzhou University
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- Zhang, Kaixin (författare)
- Fuzhou University
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- Lang, Taifu (författare)
- Fuzhou University
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- Li, Yang (författare)
- Fuzhou University
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- Li, Qiwei (författare)
- Fuzhou University
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Yang, Tianxi (författare)
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Huang, Zhonghang (författare)
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- Sun, Jie, 1977 (författare)
- Fuzhou University,Chalmers tekniska högskola,Chalmers University of Technology
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- Yan, Qun (författare)
- Fuzhou University
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visa färre...
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(creator_code:org_t)
- 2024
- 2024
- Engelska.
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Ingår i: Materials Science in Semiconductor Processing. - 1369-8001. ; 175
- Relaterad länk:
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https://research.cha...
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https://doi.org/10.1...
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Abstract
Ämnesord
Stäng
- Micro-light-emitting diode (Micro-LED) displays have attracted growing attention due to their unsurpassed properties that satisfy the requirements of reality/virtual reality (AR/VR) displays. A crucial procedure of monolithic integration technology in high-density microdisplays is the interconnection process, which is intimately associated with the quality of the display device. Microfluidic electroless interconnection (MELI), an innovative low-temperature and pressure-free chip-stacking approach that eliminates the warpage-induced issues and cracking damage of the chip caused by thermo-compression bonding (TCB), holds great promise as a technology for establishing interconnections between the CMOS driver and Micro-LED. However, the requirement for the consistency of the microbump arrays and the risk of creating bridges is significantly intensified with smaller gaps in stacked chips, which restricts the application range of MELI to high-density interconnects. This paper analyzes the feasibility of further lowering the stand-off height of stacked chips in ultrafine pitch interconnects by optimizing the bump preparation process. The plasma modification time and surfactant concentration during the bump preparation process have been investigated. The result indicated that microbump arrays with a uniformity of less than 3% could be successfully manufactured by employing a 7-min plasma treatment and incorporating optimal surfactants, which catalyzes the implementation of the subsequent vertical interconnection process and eventually enhances yields of Micro-LEDs.
Ämnesord
- TEKNIK OCH TEKNOLOGIER -- Materialteknik -- Annan materialteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Materials Engineering -- Other Materials Engineering (hsv//eng)
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Nyckelord
- Ultrafine pitch
- High uniformity
- Micro-LED display
- Electroless plating
- Ni microbumps
Publikations- och innehållstyp
- art (ämneskategori)
- ref (ämneskategori)
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Till lärosätets databas
- Av författaren/redakt...
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Lu, Yu
-
Lin, Chang
-
Tian, Liang
-
Wang, Shuaishuai
-
Zhang, Kaixin
-
Lang, Taifu
-
visa fler...
-
Li, Yang
-
Li, Qiwei
-
Yang, Tianxi
-
Huang, Zhonghang
-
Sun, Jie, 1977
-
Yan, Qun
-
visa färre...
- Om ämnet
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- TEKNIK OCH TEKNOLOGIER
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TEKNIK OCH TEKNO ...
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och Materialteknik
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och Annan materialte ...
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- TEKNIK OCH TEKNOLOGIER
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TEKNIK OCH TEKNO ...
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och Elektroteknik oc ...
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och Annan elektrotek ...
- Artiklar i publikationen
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Materials Scienc ...
- Av lärosätet
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Chalmers tekniska högskola