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- Östling, Mikael, et al.
(author)
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Device integration issues towards 10 nm MOSFETs
- 2006
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In: 2006 25TH INTERNATIONAL CONFERENCE ON MICROELECTRONICS, VOLS 1 AND 2, PROCEEDINGS. - NEW YORK, NY : IEEE. - 142440116X ; , s. 25-30
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Conference paper (peer-reviewed)abstract
- An overview of critical integration issues for future generation MOSFETs towards 10 nm gate length is presented. Novel materials and innovative structures are discussed. Implementation of high K gate dielectrics is presented and device performance is demonstrated for TiN metal gate surface channel SiGe MOSFETs with a gate stack based on ALD-formed HfO(2)/Al(2)O(3). Low frequency noise properties for those devices are also analyzed. A selective SiGe epitaxy process for low resistivity source/drain contacts has been developed and implemented in pMOSFETs. A spacer pattering technology using optical lithography to fabricate sub 50 nm high-frequency MOSFETs and nanowires is demonstrated, Finally ultra thin body Sol devices with high mobility SiGe channels are demonstrated.
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