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  • Östling, Mikael, et al. (author)
  • Device integration issues towards 10 nm MOSFETs
  • 2006
  • In: 2006 25TH INTERNATIONAL CONFERENCE ON MICROELECTRONICS, VOLS 1 AND 2, PROCEEDINGS. - NEW YORK, NY : IEEE. - 142440116X ; , s. 25-30
  • Conference paper (peer-reviewed)abstract
    • An overview of critical integration issues for future generation MOSFETs towards 10 nm gate length is presented. Novel materials and innovative structures are discussed. Implementation of high K gate dielectrics is presented and device performance is demonstrated for TiN metal gate surface channel SiGe MOSFETs with a gate stack based on ALD-formed HfO(2)/Al(2)O(3). Low frequency noise properties for those devices are also analyzed. A selective SiGe epitaxy process for low resistivity source/drain contacts has been developed and implemented in pMOSFETs. A spacer pattering technology using optical lithography to fabricate sub 50 nm high-frequency MOSFETs and nanowires is demonstrated, Finally ultra thin body Sol devices with high mobility SiGe channels are demonstrated.
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  • Result 1-1 of 1
Type of publication
conference paper (1)
Type of content
peer-reviewed (1)
Author/Editor
Östling, Mikael (1)
Malm, B. Gunnar (1)
Hållstedt, Julius (1)
Zhang, Zhen (1)
Zhang, Shili (1)
von Haartman, Martin (1)
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Hellstrom, Per-Erik (1)
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University
Royal Institute of Technology (1)
Language
English (1)
Research subject (UKÄ/SCB)
Engineering and Technology (1)
Year

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