| 1. |
- Chen, Cairong, et al.
(author)
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Design and implementation of a high efficient power converter for self-powered UHF RFID applications
- 2006
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In: 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06), Proceedings. - NEW YORK : IEEE. - 1424404886 ; , s. 131-133, s. 393-395
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Conference paper (peer-reviewed)abstract
- This paper is an investigation of off-chip solution of power converters for passive UHF RFID transponders. The power converter, consisting of a chain of schottky diodes and capacitors, is designed and then implemented on Rogers4350 PCB substrate. The ISM unlicensed frequency bands 915 MHz is used for RF signal. The deembedded measurement results show that with minimum input power of -4.7dBm, the power converter achieves 1.8V/5 mu A output driving capability, which is sufficient for the transponder operation. It corresponds to a 3.6m operating distance when 4-W EIRP radiation is allowed.
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| 2. |
- Huynh, Allan, 1977-, et al.
(author)
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High-Speed Board-to-Board Interconnects utilizing Flexible Foils and Elastomeric Connectors
- 2006
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In: HDP'06. Conference on High Density Microsystem Design and Packaging and Component Failure Analysis. - : IEEE. - 1424404886 ; , s. 157-160
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Conference paper (peer-reviewed)abstract
- This paper presents a board-to-board interconnect technique utilizing elastomeric connectors and parallel microstrip lines on a flexible foil cable with low dielectric loss (tandelta = 0.002). It is shown that a pad structure combined with an elastomeric connector can be co-designed such that a good signal integrity and thus a high data transmission rate is achieved. It is also shown that 2 Gbps data transmission rate can be achieved with a 490-mm-long microstrip on the flexible cable, where crosstalk is taken into account. Utilizing the elastomeric connector together with the flat and flexible cable, dense parallel microstrips can easily be designed and processed since standard printed circuit board processing techniques can be utilized
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| 3. |
- Zhang, Lu, et al.
(author)
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An innovative fully printable RFID technology based on high speed time-domain reflections
- 2006
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In: 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06), Proceedings. - 1424404886 ; , s. 148-152
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Conference paper (peer-reviewed)abstract
- In this paper, we present an innovative, chipless and fully printable RFID technology. The proposed tag is a fully passive device. Neither power supply nor. chip assembly is required. In our design, information data is embedded in the tag as impedance mismatches along a transmission line. The RFID-reader sends a short time pulse modulated at high frequencies. The reflections due to the impedance mismatches in the tag are transmitted back and detected by the reader. A prototype of the tag has been constructed and tested. The idea has been successfully proven both by simulations and experimental measurements.
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| 4. |
- Zhang, Yan, 1976, et al.
(author)
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Homogenization Model Based on Micropolar Theory for the Interconnection Layer in Microsystem Packaging
- 2006
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In: Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06). - 1424404886 ; , s. 166-170
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Conference paper (peer-reviewed)abstract
- The increase in microsystem packaging density sets the requiement for component sizes in the system to become smaller and smaller. The scale decrease makes the analysis more complicated as the corresponding resolution should be improved to a great extent. Interconnection in the system is a typical interface structure that widely appear in the packaing system, in which periodic microstructures may be included inside. A homogenization model is developed in this paper, which focuses on the interface behavior. The interface model based on micropolar theory provides a natural way to include the characteristic scale that can reflect the size effect of the considered structure. Computations are carried out as the numerical example of the model, and comparisons of this model with those of the convertional method show its validity and efficiency.
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| 5. |
- Zheng, Li-Rong, et al.
(author)
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System-on-flexible-substrates : Electronics for future smart-intelligent world
- 2006
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In: 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06), Proceedings. - NEW YORK : IEEE. - 1424404886 ; , s. 29-36
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Conference paper (peer-reviewed)abstract
- In this paper, we present architecture, circuit implementation and integration issues of embedded smart systems on flexible substrates for future ubiquitous intelligent world. The work is exampled by several concepts of innovative, self-powered, Ion I g-range interconnected radio-frequency identification and sensor networks in warehouse and intelligent goods distribution systems. Two types of RFID concepts are designed for this network. The first one is a self-powered, ultra-low power UWB RFID. A power scavenging system is designed which can draws energy from the 802.11 access point and its surrounding electromagnetic waves. In the second demonstration, we developed a chipless passive RFID based on time-domain reflection principle. As this RFID is chipless and needs only interconnections and antenna, it is potentially fully printable on flexible substrate such as a paper board. Finally, some implementation and experimental results are presented.
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