| 1. |
- Wu, Zhigang, et al.
(author)
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Microfluidic Hydrodynamic Cell Separation : A Review
- 2009
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In: Micro and Nanosystems. - Sharjah,U.A.E. : Bentham Science Publishers. - 1876-4037 .- 1876-4029. ; 1:3, s. 181-192
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Journal article (peer-reviewed)abstract
- Microfluidic continuous cell separation based on hydrodynamic interaction in a microfluidic channel has attracted attention because of its robustness, high throughput and cell viability. This paper systematically gives an overview on recent advances in hydrodynamic particle and cell separation in microfluidic devices. It presents the basic ideas and fluid mechanics for the hydrodynamic interaction of a particle in a microfluidic system. Secondly, different kinds of devices are introduced with detailed descriptions of their mechanisms, designs and performances. Finally, the review addresses some practical issues of microfluidic sorting devices for use in biological or medical studies.
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| 2. |
- Yuan, G., et al.
(author)
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Critical atomic-level processing technologies: Remote plasma-enhanced atomic layer deposition and atomic layer etching
- 2018
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In: Micro and Nanosystems. - : Bentham Science Publishers Ltd.. - 1876-4037 .- 1876-4029. ; 10:2, s. 76-83
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Research review (peer-reviewed)abstract
- As feature sizes of devices shrink every year, deposition and etching processes change to be very challenge, especially for sub-7 nm technology node. The acceptable variability of feature size is expected to be several atoms of silicon/germanium in the future. Therefore, Remote Plasma-Enhanced Atomic Layer Deposition (RPE-ALD) and Atomic Layer Etching (ALE) change to be more and more important in the semiconductor fabrication. Due to their self-limiting behavior, the atomic-scale fidelity could be realized for both of them in the processes. Compared with traditional Physical Vapor Deposition (PVD) and Chemical Vapor Deposition (CVD) methods, atomic-scale thickness controllability and good conformality can be achieved by RPE-ALD. Unlike conventional plasma etching, atomicscale precision and excellent depth uniformity can be achieved by ALE. The fundamentals and applications of RPE-ALD and ALE have been discussed in this paper. Using the combination of them, atomic-level deposition/etch-back method is also mentioned for achieving high quality ultra-thin films on three dimensional (3D) features.
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| 3. |
- Yuan, G., et al.
(author)
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Thermal interface materials based on vertically aligned carbon nanotube arrays: A review
- 2019
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In: Micro and Nanosystems. - : Bentham Science Publishers Ltd.. - 1876-4037 .- 1876-4029. ; 11:1, s. 3-10
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Research review (peer-reviewed)abstract
- As the feature size of integrated circuit devices is shrinking to sub-7 nm node, the chip power dissipation significantly increases and mainly converted to the heat. Vertically Aligned Carbon Nanotube arrays (VACNTs) have a large number of outstanding properties, such as high axial thermal conductivity, low expansion coefficient, light-weight, anti-aging, and anti-oxidation. With a dramatic increment of chip temperature, VACNTs and their composites will be the promising materials as Thermal Interface Materials (TIMs), especially due to their high thermal conductivity. In this review, the synthesis, transfer and potential applications of VACNTs have been mentioned. Thermal Chemical Vapor Deposition (TCVD) has been selected for the synthesis of millimeter-scale VACNTs. After that, they are generally transferred to the target substrate for the application of TIMs in the electronics industry, using the solder transfer method. Besides, the preparation and potential applications of VACNTs-based composites are also summarized. The gaps of VACNTs are filled by the metals or polymers to replace the low thermal conductivity in the air and make them free-standing composites films. Compared with VACNTs- metal composites, VACNTs-polymer composites will be more suitable for the next generation TIMs, due to their lightweight, low density and good mechanical properties.
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| 4. |
- Lager, Mårten, et al.
(author)
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Underwater terrain navigation during realistic scenarios
- 2018
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In: Multisensor Fusion and Integration in the Wake of Big Data, Deep Learning and Cyber Physical System - An Edition of the Selected Papers from the 2017 IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems MFI 2017. - Cham : Springer International Publishing. - 1876-1100 .- 1876-1119. - 9783319905082 ; 501, s. 186-209
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Conference paper (peer-reviewed)abstract
- Many ships today rely on Global Navigation Satellite Systems (GNSS), for their navigation, where GPS (Global Positioning System) is the most well-known. Unfortunately, the GNSS systems make the ships dependent on external systems, which can be malfunctioning, be jammed or be spoofed. There is today some proposed techniques where, e.g., bottom depth measurements are compared with known maps using Bayesian calculations, which results in a position estimation. Both maps and navigational sensor equipment are used in these techniques, most often relying on high-resolution maps, with the accuracy of the navigational sensors being less important. Instead of relying on high-resolution maps and low accuracy navigation sensors, this paper presents an implementation of the opposite, namely using low-resolution maps, but compensating this by using high-accuracy navigational sensors and fusing data from both bottom depth measurements and magnetic field measurements. A Particle Filter uses the data to estimate a position, and as a second step, a Kalman Filter enhances the accuracy even further. The algorithm has been tuned and evaluated using both a medium and a high-accuracy Inertial System. Comparisons of the various tuning methods are presented along with their performance results. The results from the simulated tests, described in this paper, show that for the high-end Inertial System, the mean position error is 10.2 m, and the maximum position error is 33.0 m during a 20 h test, which in most cases would be accurate enough to use for navigation.
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| 5. |
- Jeong, Seung Hee, et al.
(author)
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Adhesive transfer soft lithography: low-cost and flexible rapid prototyping of microfluidic devices, Micro and Nanosystems
- 2014
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In: micro and nanosystems. - : Bentham Science Publishers. - 1876-4037. ; 6, s. 42-49
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Journal article (peer-reviewed)abstract
- A simple and low-cost approach was proposed for prototyping PDMS based microfluidic devices by transferringadhesive film microstructures onto a flexible substrate as a mould for PDMS replicas. The microstructures were engravedon an adhesive coated film using a commercial cutting plotter and then transferred (or laminated) onto a flexiblesubstrate, allowing for engraved isolated patterns. The proposed technique was demonstrated by a hydrodynamic focusingmicrofluidic device, having splitting and re-combining sheath channels. The whole processing could be finished within 1h in a normal laboratory environment. This approach offers an easy, flexible and rapid prototyping of microfluidic andlab-on-a-chip devices to users without expertise in microfabrication. In addition, by minimizing the use of chemicals, theprocess becomes more environmentally friendly than conventional photolithography based micro-fabrication techniques.
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