| 1. |
- Edwards, Michael, 1986, et al.
(author)
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Finite element simulation of 2D-based materials as heat spreaders
- 2016
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In: IMAPS Nordic Annual Conference 2016 Proceedings. - 9781510827226
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Conference paper (peer-reviewed)abstract
- Since the discovery of graphene, the first discovered 2D material, by Novoselov and Geim in 2004, the field of 2D materials has taken off and about 20 further 2D materials have been found. One of the most promising of these materials for the passive cooling of chips is hBN. HBN has the very unusual combination of being electrically insulating and thermally conductive, which potentially makes it an ideal material for both laterally spreading heat and passivating hotspots on chips. This gives hBN an advantage over graphene, where the chip requires a SiO2 passivation layer to prevent short circuits. To help evaluate the performance of these heat spreading films, a finite element model has been devised to support the experimental work undertaken in various publications. This model has been validated with experimental data and suggests that both graphene-And hBN-based materials have significant potential in lateral heat spreading applications.
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| 2. |
- Fu, Yifeng, 1984, et al.
(author)
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Carbon nanotube growth on different underlayers for thermal interface material application
- 2016
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In: IMAPS Nordic Annual Conference 2016 Proceedings. - 9781510827226
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Conference paper (peer-reviewed)abstract
- Thermal interface material (TIM) is a critical component in thermal management of high density packaging systems since both the reliability and lifetime of microsystems are dependent on how the heat is dissipated. Carbon nanotubes (CNTs) are promising candidate for development of TIMs due to their excellent thermal and mechanical properties. The thermal conductivity of CNTs can be up to 3000 W/mK in the longitudinal direction which acts as ideal heat transfer path. However, the huge interfacial thermal resistance between CNTs and contact surface hinders the exploitation of CNTs as TIMs. In this paper, we will focus on the growth of CNTs on various substrates and underlayers and analyze the interaction between catalyst and underlayer materials. Microscopic analysis is performed to characterize the quality of the CNT materials and monitor the diffusion of Fe particles into different barrier layers. Thermal conductivity of the CNT TIMs will be measured to examine the performance of the materials.
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| 3. |
- Hansson, Josef, 1991, et al.
(author)
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A review of recent progress of thermal interface materials: from research to industrial applications
- 2016
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In: IMAPS Nordic Annual Conference 2016 Proceedings; Tonsberg; Norway; 5 - 7 June 2016. - 9781510827226
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Conference paper (peer-reviewed)abstract
- The increasing trend of further scaling down electronic components put an increasing demand for more efficient cooling. A significant part of the thermal resistance from source to ambient occurs at the interface between materials, and thermal interface materials are crucial for efficient heat transfer. Recent years have seen a significant amount of progress various types of thermal interface materials. In this review, the field of thermal interface materials (TIMs) development is summarized and analyzed, focusing on three topics which have received attention at a research level, and their road towards market applicability. The first topic is development in particle laden polymers, which uses thermally conductive filler particles in a polymer matrix. New development is focused on novel fillers such as h-BN or carbon based fillers, and hybrid filler combinations. The next topic is continuous metal phase TIMs, which includes solder and liquid metal TIMs. The thermal performance is already very good, and development is largely focused on improving the mechanical properties. Finally, the last topic is carbon nanotube array TIMs, which used chemical vapor deposition-grown carbon nanotube arrays as bridging material. The concept has promise for great performance in both handling, mechanical stability and thermal performance, but is still at a research stage. In addition to these topics, a quantitative study on the progress of thermal interface materials development is made, both in terms of research papers published and in terms of patents filed. The study shows a stable trend of continuous development on all levels and concludes that significant improvements can be expected to continue in the future.
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| 4. |
- Kabiri Samani, Majid, 1976, et al.
(author)
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Thermal conductivity measurement of densified carbon nanotube bundles by pulsed photothermal reflectance technique
- 2016
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In: IMAPS Nordic Annual Conference 2016 Proceedings. - 9781510827226
-
Conference paper (peer-reviewed)abstract
- Carbon nanotubes (CNTs) were proposed as a promising interconnection material in future miniaturized electronics, owing to their exceptional electrical and thermal properties. A series of CNT bundles with 1 mm diameter were grown on silicon substrate by thermal Chemical Vapor Deposition (CVD) at temperature 700 oC. The as grown CNT bundles were densified by a vapor densification method. SEM analysis shows that the vapor densification is densified the CNT forests, which reduces the air volume fraction to increase thermal conductivity of the CNT bundles. The pulsed photothermal reflectance technique is applied to measure thermal conductivity of the CNT bundle before and after densification and the results show the thermal conductivity of densified CNT bundles increases and capability of making CNT filled through silicon via with better thermal and electrical performance.
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| 5. |
- Mu, Wei, 1985, et al.
(author)
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Large area and uniform monolayer graphene CVD growth on oxidized copper in a cold wall reactor
- 2016
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In: IMAPS Nordic Annual Conference 2016 Proceedings. - 9781510827226
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Conference paper (peer-reviewed)abstract
- Graphene growth on copper in cold wall chemical vapor deposition (CVD) is not an inherently self- limiting process, which means that adlayers appear as long as there is sufficient growth time. The growth of large area and uniform monolayer becomes crucial and imminent. In this study, the pre-Treatment of oxidation was employed on copper. The results have shown that oxidation pre-Treatment in combination with argon annealing process would not only decrease the density of nucleation site, but also suppress the activity of nucleation site for the multilayer graphene growth. Therefore, large area and uniform monolayer graphene was obtained. The characterization of SEM. AFM and Raman analysis was also performed on either pristine graphene copper or transferred graphene on silicon oxide substrate.
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| 6. |
- Nilsson, Torbjörn, 1962, et al.
(author)
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Enhanced cooling properties of radar antenna electronics using novel materials
- 2016
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In: IMAPS Nordic Annual Conference 2016 Proceedings. - 9781510827226
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Conference paper (peer-reviewed)abstract
- Thermal interface materials (TIM) of polymer networks and boron nitride were infiltrated with indium and investigated in parallel in order to produce drastically improved thermal properties of thermal interface material. The materials were composed of electrospun polymer or BN fiber network and infiltrated indium. The mechanical tensile and shear test showed that the electrospun polymer network has superior reliability properties. The materials were also investigated in terms of adherence to a surface. Practical tests showed that the indium infiltrated thermal interfae materials best adhere to a Sn coated surface. As a final benchmark the best interface material, polymer fiber-indium TIM (NanoTIM), was benchmarked against a state-of-The-Art interface material on the commercial market, using a demonstrator in a laser housing from Saab. The thermal resistance over a thermal joint was almost halfed by using the NanoTIM material.
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| 7. |
- NYLANDER, ANDREAS, 1988, et al.
(author)
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Development of bulk-nanostructuring methods for BiSbTe Thermoelectric
- 2016
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In: IMAPS Nordic Annual Conference 2016 Proceedings. - 9781510827226
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Conference paper (peer-reviewed)abstract
- Devices based upon the thermoelectric effect are sought after as a technology with the potential of miniaturizing power generation equipment and heat pumps. By the dawn of the 21th century and the advent of nanoengineering, these materials have gotten an upswing in attention from the scientific community with the methods and instruments that now are available to improve the materials figure of merit. In this paper three methods were investigated from their performance enhancing effects on BiSbTe: powder purification, mixed grains and electron filtering. By varying the parameters of each method, a performance improvement of 17% in respect to figure of merit was achieved by electron filtering.
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| 8. |
- Sun, Shuangxi, 1986, et al.
(author)
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Heat dissipation of a hybrid CNT/Graphene based heat spreader
- 2016
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In: IMAPS Nordic Annual Conference 2016, Tonsberg, Norway, 5-7 June 2016. - 9781510827226
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Conference paper (peer-reviewed)abstract
- Graphene and Carbon Nanotube have been received much attention in the microelectronics application, due to their intrinsic unique performance in the thermal and electronic conduction. In this paper, a free standing three dimensional (3D) carbon nanotube (CNT)/graphene (G) hybrid material was synthesized through chemical vapor deposition (CVD) process for heat dissipation application. Scanning electron microscope (SEM) was employed to characterize the morphology of this hybrid material. Thermal test chip was designed and fabricated to test the cooling effect of this CNT/G hybrid material. The temperature of the hot spot on the chip can decreased around 10 oC with the help of this hybrid material.
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| 9. |
- Wang, Nan, 1988, et al.
(author)
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Synthesis of highly conductive and mechanically strong silver coated silk bundles for flexible electronic applications
- 2016
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In: IMAPS Nordic Annual Conference 2016 Proceedings. - 9781510827226
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Conference paper (peer-reviewed)abstract
- Portable and wearable electronics that feature lightweight, highly compact and low cost can enable a wide variety of new applications, such as paper-like displays, smart clothing, stretchable solar cells, camera eyes and biomedical sensors. The applications for these types of system require conductive materials that are both highly conductive and mechanically robust enough to have large deformation stability. In this work, silver coated silk hybrid fibers were fabricated to meet the above requirements. As one of natural polymers used by human at the earliest stage, silk fiber has many advantages, such as light weight, good comfortability and mechanically robust. The chemical structure of silk fiber is composed of two main proteins, fibroin and sericin. Importantly, the sericin layer shows the special sol-gel property under temperature difference and therefore can be used for adhesion between the deposited silver nanoparticles and the surface of silk bundles. The silver coating layer on the surface of silk fiber can significantly improve the electrical conductivity of the hybrid structure to 1600 S/cm. Such a good conductivity is attributed to a complete silver shell structure. Importantly, the fabricated silver coated silk hybrid fibers demonstrated stable electro-mechanical properties under different structural deformations, including bending, compressing, and twisting. The observed stable and reliable electro-mechanical performance of silver coated silk hybrid fibers suggests the potential use of the material in future wearable and portable electronics.
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| 10. |
- Ye, Lilei, et al.
(author)
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Mechanical characterization ofnanoparticleenhancedSn-3.0Ag-0.5Cu solder
- 2016
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In: IMAPS Nordic Annual Conference 2016 Proceedings. - 9781510827226
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Conference paper (peer-reviewed)abstract
- Solder plays an important role as interconnect in the electronics assembly, which provide the necessary electrical, mechanical and thermal continuity. In recent years, miniaturization of the portable products demands better solder-joint performance and conventional solder technology can not guarantee device reliability. The particle reinforced solder alloy is considered as the potentially available method to enhance the solder joints. The particle size should be small enough to hinder the grain boundary sliding and suppress the growth of intermetallic compound. Nanocomposite solders are regarded as one of the most promising interconnect materials for the high density electronic packaging due to their high mechanical strength and fine microstructure. However, the developments of nanocomposite solders have been limited by the inadequate compatibility between nanoparticles and solder matrix with respect to density, hardness, coefficient of thermal expansion, and surface activity. In order to solve this problem, carbon nanotube (CNT) was selected as reinforcement materials in Sn-3.0Ag-0.5Cu solder in this work. The effect of the nanoparticle on void content of solder bump was studied. The microstructure and shear strength of nanosocomposite solders were also investigated.
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