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Sökning: WFRF:(Arazna A.)

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1.
  • Sitek, J., et al. (författare)
  • Comparisons of nano-additives influence on properties of the bi-modal solder pastes for special applications
  • 2011
  • Ingår i: Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011. - 9781457717680 ; , s. 183-187
  • Konferensbidrag (refereegranskat)abstract
    • The paper presented the results of investigation of two solder pastes SnBi and SAC with different nano-particles, which could be applied for special application. It was presented that materials and samples preparation for investigation. The results of SEM analyzer of solder joints executed using these pastes and their shear strength measurements enable to make the comparison of nano-additives influence on properties of the bi-modal solders pastes. It was observed that addition of nano-particles into both solder pastes changed the microstructure of solder joints, and formed a large number of nano-sized grains with uniform distribution. For the SAC solder joints with nano-Ag particles it was also observed that specific Ag3Sn crystallites. We supposed that the Ag3Sn crystals, which created "internal net" and nano-sized grains with uniform distribution must influence the mechanical properties of the solder joints. The results of shear strength measurements of solder joints confirmed the significantly higher shear strength of bimodal solder joints in comparison to reference solder joints without nano-additives.
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2.
  • Janeczek, K., et al. (författare)
  • Investigation of thermal interface materials reinforced with micro- and nanoparticles
  • 2017
  • Ingår i: China Semiconductor Technology International Conference 2017, CSTIC 2017. - 9781509066940
  • Konferensbidrag (refereegranskat)abstract
    • Heat management is one of the major challenges in modern electronic devices. The higher performance results in a production of greater amount of heat which needs to be efficiently dissipated so as to ensure the electronic devices operational during the period of lifetime. This paper discusses the application of micro- and nano-materials in thermal interface materials (TIM) used for heat management. Effects of type, size and geometry of different fillers were experimentally investigated. The results showed that it is recommended to utilize silver particles compared to copper ones to achieve higher heat dissipation. And the particles of smaller size may enhance the thermal conductivity of elaborated materials.
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  • Resultat 1-2 av 2
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Zhang, Y. (2)
Liu, Johan, 1960 (2)
Ma, S. (2)
Arazna, A. (2)
Sitek, J. (2)
Zha, Q. (1)
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Fan, J (1)
Janeczek, K. (1)
Lipiec, K. (1)
Ga, Y. (1)
Koscielski, M. (1)
Bukat, K. (1)
Jakubowska, M. (1)
Mlozniak, A. (1)
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