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Search: WFRF:(Bornoff Robin)

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1.
  • Belov, Ilja, et al. (author)
  • CFD aided reflow oven profiling for PCB preheating in a soldering process
  • 2007
  • In: Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. - Piscataway, NJ. : IEEE. - 142441105X ; , s. 535-542
  • Conference paper (peer-reviewed)abstract
    • A CFD-aided reflow oven profile prediction algorithm has been developed and applied to modelling of preheating of a PCB with non-uniform distribution of component thermal mass in a forced air convection solder reflow oven. The iterative algorithm combines an analytic approach with CFD modelling. It requires an experimentally validated CFD model of the solder reflow oven and a CFD model of the PCB as main inputs. Results of computational experiments have been presented to reveal good agreement between predicted PCB profiles and corresponding CFD calculations. Application guidelines contained in the description of the algorithm will assist potential users both during the virtual prototyping phase of a PCB including designing for assembly and in the phase of reflow oven profiling.
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  • Result 1-2 of 2
Type of publication
conference paper (1)
journal article (1)
Type of content
other academic/artistic (1)
peer-reviewed (1)
Author/Editor
Leisner, Peter (2)
Belov, Ilja (2)
Bergner, Fredrik (2)
Lindgren, Mats (2)
Bornoff, Robin (2)
University
Jönköping University (2)
Language
English (2)
Research subject (UKÄ/SCB)
Natural sciences (2)
Engineering and Technology (2)
Year
2007 (2)

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