1. |
- Pang, Zhibo, et al.
(author)
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Global Fresh Food Tracking Service Enabled by Wide Area Wireless Sensor Network
- 2010
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In: 2010 IEEE Sensors Applications Symposium, SAS 2010. - : IEEE Sensors Council. ; , s. 6-9
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Conference paper (peer-reviewed)abstract
- A global fresh food tracking service is presented, in which a set of primary environmental conditions for transport of fresh fruits and vegetables, including global position, temperature, relative humidity, concentrations of CO2, O2 and ethylene gases and 3-axis acceleration, is collected through mobile and remotely controllable wireless sensor nodes. Real time monitoring, tracking, alarming, close-loop controlling and information sharing could therefore be provided as WEB services with service oriented architecture. Fully functioned hardware modules, protocols and system software have been developed. A 50-day field test has been successfully carried out, proving the system concept and the robustness of hardware and software designed. Due to its worldwide deploy-ability and added-values to fresh food supply chain, it is feasible to establish a practical fresh food tracking service business.
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2. |
- Ahmad, Waqar, et al.
(author)
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Decoupling capacitance for the power integrity of 3D-DRAM-over-logic system
- 2012
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In: IEEE 13th Electronics Packaging Technology Conference (EPTC), 2011. - : IEEE conference proceedings. - 9781457719813 ; , s. 590-594
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Conference paper (peer-reviewed)abstract
- The 3D-DRAM stacked over the processor is a vibrant technique in order to overcome the memory wall as well as the bandwidth wall problems. We considered a system with two DRAM dies over a single processor die. We assumed the decoupling capacitors to be placed on each DRAM die and connected to the power distribution TSV pairs, where the TSVs pass through the DRAM stack. In this paper we proposed a mathematical model for the optimum value of the decoupling capacitance on each DRAM die along with the optimum values of the effective resistance of the interconnecting power distribution TSV pairs in order to ensure the power integrity of the logic load during switching. The proposed model has a maximum of 1.1% error as compared to the Ansoft Nexxim4.1.
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3. |
- Ahmad, Waqar, et al.
(author)
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Fast Transient Simulation Algorithm for a 3D Power distribution Bus
- 2010
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In: Proceedings of IEEE Asia Symposium on Quality Electronic Design. ; , s. 343-350
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Conference paper (peer-reviewed)abstract
- Extensive transient simulations for on-chip power delivery networks are required to analyze power delivery fluctuations caused by dynamic IR and Ldi/dt drops. Speed and memory has become a bottleneck for simulation of power distribution networks in modern VLSI design where clock frequency is of the order of GHz. The traditional SPICE based tools are very slow and consume a lot of memory during simulation. The problem is further aggravated for huge networks like power distribution network within a stack of ICs inter-connected through TSVs. This type of 3D power distribution network may contain billions of nodes at a time. In this paper we proposed a faster transient simulation algorithm using visual C++. First we reduce 3D power distribution bus containing n nodes to a two terminal 7 network. Then we solve this two terminal reduced network for voltages and currents. After this, we apply back solving algorithm to the network to solve it for each of the intermediate nodes using visual C++. The proposed algorithm is quite accurate with 1-2% error when compared with Ansoft Nexxim4.1. The proposed algorithm is several times faster than Ansoft Nexxim as well as consumes significantly less memory as compared to Nexxim.
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4. |
- Ahmad, Waqar, et al.
(author)
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Peak-to-peak Switching Noise and LC Resonance on a Power Distribution TSV Pair
- 2010
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In: 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010. - : Institute of Electrical and Electronics Engineers (IEEE). ; , s. 173-176
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Conference paper (peer-reviewed)abstract
- How peak-to-peak switching noise as well as the LC resonance term varies by varying different circuit parameters of a power distribution TSV pair (having decoupling capacitance and logic load), within a 3D stack of ICs interconnected through TSVs.
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5. |
- Ahmad, Waqar, et al.
(author)
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Power distribution TSVs induced core switching noise
- 2011
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In: Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE. - : IEEE conference proceedings. - 9781424490691
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Conference paper (peer-reviewed)abstract
- Size of on-chip interconnects as well as the supply voltage is reducing with each technology node whereas the operating speed is increasing in modern VLSI design. Today, the package inductance and resistance has been reduced to such an extent that core switching noise caused by on-chip inductance and on-chip resistance is gaining importance as compared to I/O drivers switching noise. Both on-chip inductance and skin effect are prime players at frequencies of the order of GHz. The problem is further aggravated when chips are interconnected through TSVs to form a 3D integrated stack in order to achieve low form factor and high integration density. In this paper we analysed peak core switching noise in a 3D stack of integrated chips interconnected through power distribution TSV pairs, through our comprehensive mathematical model which has been proved to be quite accurate as compared to SPICE. We analysed the effect of number of chips in a 3D stack, rise time, decoupling capacitance, and skin effect on power distribution TSVs induced core switching noise in this paper.
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6. |
- Amin, Yasar, et al.
(author)
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Design and Fabrication of Wideband Archimedean Spiral Antenna Based Ultra-Low Cost "Green" Modules for RFID Sensing and Wireless Applications
- 2012
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In: Progress In Electromagnetics Research-PIER. - 1559-8985. ; 130, s. 241-256
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Journal article (peer-reviewed)abstract
- A parametric analysis is performed for a wideband Archimedean spiral antenna in recognition of an emerging concept to integrate RFID along with several applications by using a single antenna. The antenna is fabricated using state-of-the-art inkjet printing technology on various commercially available paper substrates to provide the low-cost, flexible RF modules for the next generation of "green" electronics. The effects on electromagnetic characteristics of the planar Archimedean spiral antenna, due to the use of paper are investigated besides other parameters. The proposed antenna is evaluated and optimized for operational range from 0.8-3.0GHz. It exhibits exceptional coverage throughout numerous RFID ISM bands so do for other wireless applications.
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7. |
- Amin, Yasar, et al.
(author)
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Development and Analysis of Flexible UHF RFID Antennas For "Green" Electronics
- 2012
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In: Progress In Electromagnetics Research-PIER. - 1070-4698. ; 130, s. 1-15
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Journal article (peer-reviewed)abstract
- In this paper, novel Bowtie antennas which cover complete UHF RFID band (860-960MHz), fabricated on various ultra-low-cost substrates using state-of-the-art printing technologies are investigated as an approach that aims to accommodate the antenna during the package printing process whilst faster production on commercially available paper. The proposed antenna structures are evaluated in reference to circuit and field concepts, to exhibit extreme degree of functional versatility. These antennas are developed to cater the variations which appear in electromagnetic properties and thickness of paper substrate due to various environmental effects. Computed (simulated) and well-agreed measurement results confirm a superior performance of the tag modules while stepping towards next generation of "green" tags.
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8. |
- Amin, Yasar, et al.
(author)
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Evolutionary Versatile Printable RFID Antennas For "Green" Electronics
- 2012
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In: Journal Electromagnetic Waves and Applications. - : Taylor & Francis. - 0920-5071 .- 1569-3937. ; 26:2-3, s. 264-273
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Journal article (peer-reviewed)abstract
- The development of low cost directly printable RFID tag antennas is essential for item level tracking. We present evolutionary design approach to achieve robust extremely versatile RFID antennas on paper/flexible substrates which allow a simple integration directly on, e.g., paperboard in a roll-to-roll production line. Fully integrated printed tags for "green" electronics are designed for operability in frequencies 866-868 MHz & 902-928 MHz. We present benchmarking results for various challenges of antennas in terms of ruggedness, reliability and flexing performance.
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9. |
- Amin, Yasar, et al.
(author)
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"Green" Wideband Log-Spiral Antenna for RFID Sensing and Wireless Applications
- 2012
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In: Journal of Electromagnetic Waves and Applications. - UK : Taylor & Francis. - 0920-5071 .- 1569-3937. ; 26:14-15, s. 2043-2050
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Journal article (peer-reviewed)abstract
- The novel idea of integrating RFID with sensors along with other wireless applications by using single tag antenna is implemented, by fabricating proposed antenna using state-of-the-art inkjet printing technology on commercially available paper substrates. For the first time, a parametric analysis is performed for realization of planar log-spiral antenna on paper for operational range from 0.8-3.0GHz, which also exhibits excellent coverage throughout numerous RFID ISM bands, and for other wireless applications. The ANSYS HFSS tool is used to design and predict the performance of the proposed antenna in terms of radiation pattern and input impedance.
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10. |
- Amin, Yasar, et al.
(author)
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Green wideband RFID tag antenna for supply chain applications
- 2012
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In: IEICE Electronics Express. - : Institute of Electronics, Information and Communications Engineers (IEICE). - 1349-2543. ; 9:24, s. 1861-1866
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Journal article (peer-reviewed)abstract
- In this paper, we demonstrate an RFID tag antenna manufactured by advanced inkjet printing technology on paper substrate using novel hole-matching technique for reducing the consumption of substrate material and conductive ink while attaining green RFID tags. In-depth electromagnetic analysis is performed methodologically for optimizing the parameters that effectuate the antenna dimensions. The antenna design is optimized for consistent wideband performance and extended read range throughout the complete UHF RFID band (860-960MHz), while exhibiting benchmarking results when n across cardboard cartons filled with metal or water containing objects.
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