| 1. |
- Nelson, A. Z., et al.
(författare)
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Designing and transforming yield-stress fluids
- 2019
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Ingår i: Current opinion in solid state & materials science. - : Elsevier. - 1359-0286 .- 1879-0348. ; 23:5
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Forskningsöversikt (refereegranskat)abstract
- We review progress in designing and transforming multi-functional yield-stress fluids and give a perspective on the current state of knowledge that supports each step in the design process. We focus mainly on the rheological properties that make yield-stress fluids so useful and the trade-offs which need to be considered when working with these materials. Thinking in terms of “design with” and “design of” yield-stress fluids motivates how we can organize our scientific understanding of this field. “Design with” involves identification of rheological property requirements independent of the chemical formulation, e.g. for 3D direct-write printing which needs to accommodate a wide range of chemistry and material structures. “Design of” includes microstructural considerations: conceptual models relating formulation to properties, quantitative models of formulation-structure-property relations, and chemical transformation strategies for converting effective yield-stress fluids to be more useful solid engineering materials. Future research directions are suggested at the intersection of chemistry, soft-matter physics, and material science in the context of our desire to design useful rheologically-complex functional materials.
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| 2. |
- Wang, C., et al.
(författare)
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3D Printing High-Resolution Conductive Elastomeric Structures with a Solid Particle-Free Emulsion Ink
- 2022
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Ingår i: Advanced Engineering Materials. - : Wiley. - 1438-1656 .- 1527-2648. ; 24:3
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Tidskriftsartikel (refereegranskat)abstract
- Fabricating complex structures on micro- and mesoscales is a critical aspect in the design of advanced sensors and soft electronics. However, soft lithographic methods offer an important approach to fabricating such structures, the progress in the field of additive manufacturing (e.g., 3D printing) offers methods of fabrication with much more material complexity. The rheological complexity of the printing material, however, often dictates the limitations of printing. In particular, the challenges involved in synthesizing printing materials that can enable shape retention at smaller scales (<100 μm), yet be conductive, limits many applications of 3D printing to soft microelectronics. Herein, a printing-centered approach using a novel particle-free conductive emulsion ink is presented. This approach separates the printing and polymerization of a conductive monomer (pyrrole) and renders a novel ink that is used to print filaments with heretofore impossible to realize 3D feature dimensions and build structures with high shape retention. The printability of the ink is evaluated, and post-treatment properties assessed. Multidirectional strain sensors are printed using the emulsion ink to illustrate an exemplary application in soft electronics.
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