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- Berggren, Karl, et al.
(author)
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In vivo measurement of the effective atomic number of breast skin using spectral mammography
- 2018
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In: Physics in Medicine and Biology. - : Institute of Physics Publishing (IOPP). - 0031-9155 .- 1361-6560. ; 63:21
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Journal article (peer-reviewed)abstract
- X-ray characteristics of body tissues are of crucial importance for developing and optimizing x-ray imaging techniques, in particular for dosimetry and spectral imaging applications. For breast imaging, the most important tissues are fibro-glandular, adipose and skin tissue. Some work has and is being done to better characterize these tissue types, in particular fibro-glandular and adipose tissue. In the case of breast skin, several recent studies have been published on the average skin thickness, but with regards to x-ray attenuation, the only published data, to the knowledge of the authors, is the elemental composition analysis of Hammerstein et al (1979 Radiology 130 485-91). This work presents an overview of breast skin thickness studies and a measurement of the effective atomic number (Z(eff)) of breast skin using spectral mammography. Z(eff), which together with the density forms the attenuation, is used to validate the work by Hammerstein et al, and the dependence of clinical parameters on Z(eff) is explored. Measurements were conducted on the skin edge of spectral mammograms using clinical data from a screening population (n = 709). The weighted average of breast skin thickness reported in studies between 1997 and 2013 was found to be 1.56 +/- 0.28 mm. Mean Z(eff) was found to be 7.365 (95% CI: 7.364,7.366) for normal breast skin and 7.441 (95% CI: 7.440,7.442) for the nipple and areola. Z(eff) of normal breast skin is in agreement with Hammerstein et al, despite the different methods and larger sample size used. A small but significant increase in Z(eff) was found with age, but the increase is too small to be relevant for most applications. We conclude that normal breast skin is well described by a 1.56 mm skin layer and the elemental composition presented by Hammerstein et al (1979 Radiology 130 485-91) and recommend using these characteristics when modelling breast skin.
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| 5. |
- Leisner, Peter, et al.
(author)
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Recent progress in pulse reversal plating of copper for electronics applications
- 2007
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In: Transactions of the Institute of Metal Finishing. - 0020-2967 .- 1745-9192. ; 85:1, s. 40-45
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Journal article (peer-reviewed)abstract
- Based on demands for modern printed circuit board (pcb) manufacturing, the copper electroplating process is discussed. Electroplating from an additive free solution using low frequency pulse reversal plating with superimposed cathodic pulsation is suggested, which meets the demands for precise dimensions, high ductility and conductivity, low costs and environmental friendliness.
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| 6. |
- Moller, P., et al.
(author)
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Metal printing ECPR of copper interconnects down to 500 nm using - Electrochemical pattern replication
- 2006
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In: Microelectronic Engineering. - : Elsevier BV. - 0167-9317 .- 1873-5568. ; 83:09-apr, s. 1410-1413
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Journal article (peer-reviewed)abstract
- Printing of copper patterns with dimensions from 100 mu m down to 500 nm lines and 280 run space was demonstrated using electrochemical pattern replication with a master electrode (template) having a pattern depth of 2500 nm. SEM measurements were done to measure the mean line width as well as CD variations on the master and the replicated copper lines. It was found that accurate replication of 500 nm thick metal patterns was enabled by the process and that CD variations in the master were dominating compared to the variations introduced by the electrochemical pattern transfer itself.
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- Möller, Patrik, et al.
(author)
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ECPR (ElerctroChemical Pattern Replication) : Metal Printing for Advanced Package Applications
- 2004
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In: Proceedings of 6th Electronics Packaging Technology Conference. - Piscataway, NJ : IEEE Service Center. - 0780388216 ; , s. 294-297
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Conference paper (other academic/artistic)abstract
- ECPR (electrochemical pattern replication) is a new fabrication process for the production of microstructures in conducting materials. Using ECPR, the cost of metallization for advanced packaging solutions can be significantly reduced compared to using lithography based processes. The technology utilizes a reusable master electrode for electrochemical pattern replication, which enables direct metallization with short cycle times, high throughput and comparably low equipment investments. ECPR provides metallization on most substrates such as silicon wafers, ceramic substrates and flexible or rigid organic substrates. The technique currently enables pattern transfer of copper structures down to 5/5 /spl mu/m line/space with uniform material distribution and high resolution patterns with small line width variations. Results from replication studies on both ultrathin polyimide substrates and silicon wafers are presented.
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