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- Zhang, Yanying, et al.
(författare)
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Living diatoms integrate polysaccharide-Eu3+ complex for UV downconversion
- 2022
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Ingår i: Journal of Materials Research and Technology. - : Elsevier. - 2238-7854. ; 19, s. 2774-2780
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Tidskriftsartikel (refereegranskat)abstract
- In this work, living diatoms (LDT) were fed Eu3+ -complex-polysaccharide aggregates (EIPA), and the living diatoms integrated-EIPAs (LDT-E) in a completely new UV downconversion biophotonic material. The EIPAs were embedded inside siliceous cell walls of living diatoms. When dried, these diatoms (LDT-Es) are luminescent at 612 nm, due to the Eu3+ - complex. As UV-downconversion material, LDT-E absorbs UV light in the band of 250-400 nm and converts into useful visible light, thus contributing to UV-protection and potentially to photocurrent generation in photovoltaic devices. This downconversion material from living diatom retains the porous characteristics of the diatom siliceous cells, as well as the diatom organic components. Most important is the absence of a chemical process to generate this biomaterial from natural living diatoms, in order to obtain UV protection and downconversion. (C) 2022 The Author(s). Published by Elsevier B.V.
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| 2. |
- Guo, Xiaorui, et al.
(författare)
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Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review
- 2019
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Ingår i: Micromachines. - : MDPI AG. - 2072-666X. ; 10:6
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Forskningsöversikt (refereegranskat)abstract
- The significant advance of power electronics in today's market is calling for high-performance power conversion systems and MEMS devices that can operate reliably in harsh environments, such as high working temperature. Silicon-carbide (SiC) power electronic devices are featured by the high junction temperature, low power losses, and excellent thermal stability, and thus are attractive to converters and MEMS devices applied in a high-temperature environment. This paper conducts an overview of high-temperature power electronics, with a focus on high-temperature converters and MEMS devices. The critical components, namely SiC power devices and modules, gate drives, and passive components, are introduced and comparatively analyzed regarding composition material, physical structure, and packaging technology. Then, the research and development directions of SiC-based high-temperature converters in the fields of motor drives, rectifier units, DC-DC converters are discussed, as well as MEMS devices. Finally, the existing technical challenges facing high-temperature power electronics are identified, including gate drives, current measurement, parameters matching between each component, and packaging technology.
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