1. |
- Fu, Yifeng, 1984, et al.
(author)
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Graphene related materials for thermal management
- 2020
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In: 2D Materials. - : IOP Publishing. - 2053-1583. ; 7:1
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Journal article (peer-reviewed)abstract
- Almost 15 years have gone ever since the discovery of graphene as a single atom layer. Numerous papers have been published to demonstrate its high electron mobility, excellent thermal and mechanical as well as optical properties. We have recently seen more and more applications towards using graphene in commercial products. This paper is an attempt to review and summarize the current status of the research of the thermal properties of graphene and other 2D based materials including the manufacturing and characterization techniques and their applications, especially in electronics and power modules. It is obvious from the review that graphene has penetrated the market and gets more and more applications in commercial electronics thermal management context. In the paper, we also made a critical analysis of how mature the manufacturing processes are; what are the accuracies and challenges with the various characterization techniques and what are the remaining questions and issues left before we see further more applications in this exciting and fascinating field.
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2. |
- Li, Mengxiong, et al.
(author)
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Highly Oriented Graphite Aerogel Fabricated by Confined Liquid-Phase Expansion for Anisotropically Thermally Conductive Epoxy Composites
- 2020
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In: ACS Applied Materials & Interfaces. - : American Chemical Society (ACS). - 1944-8252 .- 1944-8244. ; 12:24, s. 27476-27484
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Journal article (peer-reviewed)abstract
- Graphene-based thermally conductive polymer composites are of great importance for the removal of the excess heat generated by electronic devices. However, due to the orientation of graphene sheets in the polymer matrix, the through-plane thermal conductivity of polymer/graphene composites remains far from satisfactory. We here demonstrate a confined liquid-phase expansion strategy to fabricate highly oriented confined expanded graphite (CEG) aerogels. After being incorporated into epoxy resin (EP), the resulting EP/CEG composites exhibit a high through-plane thermal conductivity (4.14 ± 0.21 W m-1 K-1) at a quite low filler loading of 1.75 wt % (0.91 vol %), nearly 10 times higher than that of neat EP resin and 7.5 times higher than the in-plane thermal conductivity of the composite, indicating that the CEG aerogel has a high through-plane thermal conductivity enhancement efficiency that outperforms those of many graphite/graphene-based fillers. The facile preparation method holds great industrial application potential in fabricating anisotropic thermally conductive polymer composites.
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3. |
- Liu, Ya, 1991, et al.
(author)
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A Novel Graphene Quantum Dot-Based mRNA Delivery Platform
- 2021
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In: ChemistryOpen. - : Wiley. - 2191-1363. ; 10:7, s. 666-671
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Journal article (peer-reviewed)abstract
- During the last decades, there has been growing interest in using therapeutic messager RNA (mRNA) together with drug delivery systems. Naked, unformulated mRNA is, however, unable to cross the cell membrane and is susceptible to degradation. Here we use graphene quantum dots (GQDs) functionalized with polyethyleneimine (PEI) as a novel mRNA delivery system. Our results show that these modified GQDs can be used to deliver intact and functional mRNA to Huh-7 hepatocarcinoma cells at low doses and, that the GQDs are not toxic, although cellular toxicity is a problem for these first-generation modified particles. Functionalized GQDs represent a potentially interesting delivery system that is easy to manufacture, stable and effective.
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4. |
- Liu, Ya, 1991, et al.
(author)
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Effect of Boron Nitride Particle Geometry on the Thermal Conductivity of a Boron Nitride Enhanced Polymer Composite Film
- 2019
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In: THERMINIC 2019 - 2019 25th International Workshop Thermal Investigations of ICs and Systems.
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Conference paper (peer-reviewed)abstract
- Hexagonal Boron Nitride (h-BN) has been considered as a promising enhancement filler for thermal management due to its high thermal conductivity, structural stability, and super electrical resistivity. Numerus studies have reported using BN as an enhancement filler to achieve high thermally conductive polymer based thermal management materials. However, there are limited data regarding the influence of the flake size of BN sheets to the thermal management property of BN filled composites. In this work, three h-BN size geometries, including microscale h-BN powder, h-BN nanosheets, and a mixture of micro and nanoscale h-BN, were studied regarding its thermal transfer performance. The results show that h-BN nanosheets are able to achieve the highest in-plane thermal conductivity with loading from 0 - 5 wt% while for the through-plane thermal conductivity, all three geometries show similar thermal property when the filler loading less than 5 wt%. Through-plane thermal conductivity exhibits a sudden increase to 5.69 W m-1 K-1 at a loading of 5 wt%..
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5. |
- Liu, Ya, 1991, et al.
(author)
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Egg albumen templated graphene foams for high-performance supercapacitor electrodes and electrochemical sensors
- 2018
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In: Journal of Materials Chemistry A. - : Royal Society of Chemistry (RSC). - 2050-7488 .- 2050-7496. ; 6:37, s. 18267-18275
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Journal article (peer-reviewed)abstract
- We demonstrate a simple and scalable strategy to obtain N, S and Si co-doped biocompatible graphene foams (GFs) with different shapes using egg albumen as the template. The unique porous structure and element doping endow the GFs with a high charge-discharge rate and good wettability, which largely improve the electrochemical performance of the electrodes, including ultrahigh specific capacitance (534 F g-1at 1 A g-1), and excellent rate capability (308 F g-1at 100 A g-1) and cycling performance (96.1% retention of the initial capacitance after 10000 cycles at a high current density of 10 A g-1). Besides, when used as an electrochemical sensor for dopamine, the GF exhibits a detection limit as low as 1.2 μM with a linear response up to 70 μM, due to the low equivalent series resistance. These reveal great potential for promoting the application of 3D graphene in energy storage and electrochemical sensors.
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6. |
- Liu, Ya, 1991, et al.
(author)
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Graphene based thermal management system for battery cooling in electric vehicles
- 2020
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In: Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020.
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Conference paper (peer-reviewed)abstract
- In this work, a graphene assembled film integrated heat sink and water cooling technology was used to build an experimental set-up of a thermal management system to demonstrate the possibility to achieve efficient cooling of the propulsion battery in electric vehicles. The experimental results showed that the temperature decrease of a Li-ion battery module can reach 11°C and 9 °C under discharge rates as of 2C and 1C, respectively. The calculated thermal resistance of the graphene based cooling system is about 76% of a similar copper based cooling system. Surface modification was carried out on the graphene sheet to achieve a reliable bonding between the graphene sheet and the battery cell surface. This work provides a proof of concept of a new highly efficient approach for electric vehicle battery thermal management using the light-weight material graphene.
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7. |
- Liu, Ya, 1991, et al.
(author)
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Surface modification of graphene for use as a structural Fortifier in water-borne epoxy coatings
- 2019
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In: Coatings. - : MDPI AG. - 2079-6412. ; 9:11
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Journal article (peer-reviewed)abstract
- Graphene, the typical two-dimensional sp2 hybridized carbon allotrope, is widely used as a filler for improving the mechanical performance of polymers. However, its superhydrophobic surface makes it a big challenge to obtain stable graphene dispersions, especially in water-borne systems. On the contrary, graphene oxide (GO) shows excellent dispersibility in water, but strong oxidants and acids destroy its structure and degrade its mechanical properties. This largely limits its application in water-borne coatings. In this work, graphene from mechanical exfoliation was surface modified by p-aminophenol derived diazonium salt to achieve a homogenous dispersion. Moreover, the hydroxyl groups in p-aminophenol are able to combine with epoxy resins during the curing process to improve mechanical performance of the final coatings. The result shows that functionalized graphene shows a lower coefficient of friction and better abrasion resistance compared to GO.
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8. |
- Liu, Ya, 1991, et al.
(author)
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Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader
- 2019
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In: Proceedings - 2019 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2019. ; , s. 1-5
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Conference paper (peer-reviewed)abstract
- Thermally conductive materials with electrically insulating properties have been extensively investigated for thermal management of electronic devices. The combined properties of high thermal conductivity, structural stability, corrosion resistance and electric resistivity make hexagonal boron nitride (h-BN) a promising candidate for this purpose. Theoretical studies have revealed that h-BN has a high in-plane thermal conductivity up to 400-800 W m-1 K-1 at room temperature. However, it is still a big challenge to achieve high thermally conductive h-BN thick films that are commercially feasible due to its poor mechanical properties. On the other hand, many polymers exhibit advantages for flexibility. Thus, combining the merits of polymer and the high thermal conductivity of h-BN particles is considered as a promising solution for this issue. In this work, orientated PVP/h-BN films were prepared by electrospinning and a subsequent mechanical pressing process. With the optimized h-BN loading, a PVP/h-BN composite film with up to 22 W m-1 K-1 and 0.485 W m-1 K-1 for in-plane and through-plane thermal conductivity can be achieved, respectively. We believe this work can help accelerate the development of h-BN for thermal management applications.
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9. |
- Liu, Ya, 1991, et al.
(author)
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Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader
- 2019
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In: Advancing Microelectronics. - 2222-8748. ; 2019:NOR, s. 1-5
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Journal article (peer-reviewed)abstract
- Thermally conductive materials with electrically insulating properties have been extensively investigated for thermal management of electronic devices. The combined properties of high thermal conductivity, structural stability, corrosion resistance and electric resistivity make hexagonal boron nitride (h-BN) a promising candidate for this purpose. Theoretical studies have revealed that h-BN has a high in-plane thermal conductivity up to 400 - 800 W m−1 K−1 at room temperature. However, it is still a big challenge to achieve high thermally conductive h-BN thick films that are commercially feasible due to its poor mechanical properties. On the other hand, many polymers exhibit advantages for flexibility. Thus, combining the merits of polymer and the high thermal conductivity of h-BN particles is considered as a promising solution for this issue. In this work, orientated PVP/h-BN films were prepared by electrospinning and a subsequent mechanical pressing process. With the optimized h-BN loading, a PVP/h-BN composite film with up to 22 W m-1 K-1 and 0.485 W m-1 K-1 for in-plane and through-plane thermal conductivity can be achieved, respectively. We believe this work can help accelerate the development of h-BN for thermal management applications.
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10. |
- Wang, Nan, et al.
(author)
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Highly thermal conductive and electrically insulated graphene based thermal interface material with long-term reliability
- 2019
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In: Proceedings - Electronic Components and Technology Conference. - 0569-5503. ; 2019-May, s. 1564-1568
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Conference paper (peer-reviewed)abstract
- High density packaging in combination with increased transistor integration inevitably leads to challenging power densities in terms of thermal management. The conventional TIMs that are widely used in the microelectronic industry today are experiencing more and more stress due to their limited thermal performance and poor reliability. Composed by particle laden polymer matrix, thermal conductivity (K) of conventional TIMs is generally limited to 5 W/mK, and such values can be even lower for electrically insulated TIMs. Conventional TIMs also suffer from severe pump-out and dry-out failures, which brought great threat to the performance and lifetime of the electronic devices. Here, we solve these problems by applying a novel highly thermal conductive, electrically insulated and reliable graphene based TIMs (I-GTs). Composed by vertical graphene structures, I-GTs provide a continuous heat pathway from top to bottom, which enables superfast heat dissipation at through-plane direction. The highest bulk through-plane thermal conductivity of the conductive body can reach up to 1000 W/mK, which is orders of magnitude higher than conventional TIMs, and even outperforms the pure indium TIMs by over ten times. The highly flexible and foldable nature of I-GT enables at least 100% compressibility upon small applied pressures. As excellent gap fillers, I-GT can provide complete physical contact between two surfaces and thereby minimize the contact resistance to heat flow. The measured minimum thermal resistance for I-GTs reaches about 30 Kmm2/W. Such values are significantly higher than the randomly dispersed composites presented above. To ensure fully electrical insulation, a smooth and soft adhesive layer with a thickness of few microns was coated on the surface of I-GT. The breakdown voltage of I-GT reaches up to 950 V. Thermal cycling test shows the highly stable nature of I-GT. The good compressibility and elasticity of I-GT ensures continued proper TIM contact with substrates, which counteracts the effect of internal stress induced by the mismatch of coefficient of thermal expansion (CTE) during temperature cycling. In addition, the I-GTs have the advantages of low density and good maintainability. The resulting I-GTs thus opens new opportunities for addressing large heat dissipation issues for form-factor driven electronics and other high power driven systems.
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