| 1. |
- Jamnig, Andreas, et al.
(author)
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3D-to-2D Morphology Manipulation of Sputter-Deposited Nanoscale Silver Films on Weakly Interacting Substrates via Selective Nitrogen Deployment for Multifunctional Metal Contacts
- 2020
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In: ACS APPLIED NANO MATERIALS. - : AMER CHEMICAL SOC. - 2574-0970. ; 3:5, s. 4728-4738
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Journal article (peer-reviewed)abstract
- The ability to reverse the inherent tendency of noble metals to grow in an uncontrolled three-dimensional (3D) fashion on weakly interacting substrates, including two-dimensional (2D) materials and oxides, is essential for the fabrication of high-quality multifunctional metal contacts in key enabling devices. In this study, we show that this can be effectively achieved by deploying nitrogen (N-2) gas with high temporal precision during magnetron sputtering of nanoscale silver (Ag) islands and layers on silicon dioxide (SiO2) substrates. We employ real-time in situ film growth monitoring using spectroscopic ellipsometry, along with optical modeling in the framework of the finite-difference time-domain method, and establish that localized surface plasmon resonance (LSPR) from nanoscale Ag islands can be used to gauge the evolution of surface morphology of discontinuous layers up to a SiO2 substrate area coverage of similar to 70%. Such analysis, in combination with data on the evolution of room-temperature resistivity of electrically conductive layers, reveals that presence of N-2 in the sputtering gas atmosphere throughout all film-formation stages: (i) promotes 2D growth and smooth film surfaces and (ii) leads to an increase of the continuous-layer electrical resistivity by similar to 30% compared to Ag films grown in a pure argon (Ar) ambient atmosphere. Detailed ex situ nanoscale structural analyses suggest that N-2 favors 2D morphology by suppressing island coalescence rates during initial growth stages, while it causes interruption of local epitaxial growth on Ag crystals. Using these insights, we deposit Ag layers by deploying N-2 selectively, either during the early precoalescence growth stages or after coalescence completion. We show that early N-2 deployment leads to 2D morphology without affecting the Ag-layer resistivity, while postcoalescence introduction of N-2 in the gas atmosphere further promotes formation of three-dimensional (3D) nanostructures and roughness at the film growth front. In a broader context this study generates knowledge that is relevant for the development of (i) single-step growth manipulation strategies based on selective deployment of surfactant species and (ii) real-time methodologies for tracking film and nanostructure morphological evolution using LSPR.
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| 2. |
- Colin, Jonathan, et al.
(author)
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In Situ and Real-Time Nanoscale Monitoring of Ultra-Thin Metal Film Growth Using Optical and Electrical Diagnostic Tools
- 2020
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In: Nanomaterials. - : MDPI. - 2079-4991. ; 10:11
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Research review (peer-reviewed)abstract
- Continued downscaling of functional layers for key enabling devices has prompted the development of characterization tools to probe and dynamically control thin film formation stages and ensure the desired film morphology and functionalities in terms of, e.g., layer surface smoothness or electrical properties. In this work, we review the combined use of in situ and real-time optical (wafer curvature, spectroscopic ellipsometry) and electrical probes for gaining insights into the early growth stages of magnetron-sputter-deposited films. Data are reported for a large variety of metals characterized by different atomic mobilities and interface reactivities. For fcc noble-metal films (Ag, Cu, Pd) exhibiting a pronounced three-dimensional growth on weakly-interacting substrates (SiO2, amorphous carbon (a-C)), wafer curvature, spectroscopic ellipsometry, and resistivity techniques are shown to be complementary in studying the morphological evolution of discontinuous layers, and determining the percolation threshold and the onset of continuous film formation. The influence of growth kinetics (in terms of intrinsic atomic mobility, substrate temperature, deposition rate, deposition flux temporal profile) and the effect of deposited energy (through changes in working pressure or bias voltage) on the various morphological transition thicknesses is critically examined. For bcc transition metals, like Fe and Mo deposited on a-Si, in situ and real-time growth monitoring data exhibit transient features at a critical layer thickness of similar to 2 nm, which is a fingerprint of an interface-mediated crystalline-to-amorphous phase transition, while such behavior is not observed for Ta films that crystallize into their metastable tetragonal beta-Ta allotropic phase. The potential of optical and electrical diagnostic tools is also explored to reveal complex interfacial reactions and their effect on growth of Pd films on a-Si or a-Ge interlayers. For all case studies presented in the article, in situ data are complemented with and benchmarked against ex situ structural and morphological analyses.
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| 3. |
- Jamnig, Andreas, et al.
(author)
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Manipulation of thin metal film morphology on weakly interacting substrates via selective deployment of alloying species
- 2022
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In: Journal of Vacuum Science & Technology. A. Vacuum, Surfaces, and Films. - : A V S AMER INST PHYSICS. - 0734-2101 .- 1520-8559. ; 40:3
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Journal article (peer-reviewed)abstract
- We demonstrate a versatile concept for manipulating morphology of thin (& LE;25 nm) noble-metal films on weakly interacting substrates using growth of Ag on SiO2 as a model system. The concept entails deployment of minority metallic (Cu, Au, Al, Ti, Cr, and Mo) alloying species at the Ag-layer growth front. Data from in situ and real-time monitoring of the deposition process show that all alloying agents-when deployed together with Ag vapor throughout the entire film deposition-favor two-dimensional (2D) growth morphology as compared to pure Ag film growth. This is manifested by an increase in the substrate area coverage for a given amount of deposited material in discontinuous layers and a decrease of the thickness at which a continuous layer is formed, though at the expense of a larger electrical resistivity. Based on ex situ microstructural analyses, we conclude that 2D morphological evolution under the presence of alloying species is predominantly caused by a decrease of the rate of island coalescence completion during the initial film-formation stages. Guided by this realization, alloying species are released with high temporal precision to selectively target growth stages before and after coalescence completion. Pre-coalescence deployment of all alloying agents yields a more pronounced 2D growth morphology, which for the case of Cu, Al, and Au is achieved without compromising the Ag-layer electrical conductivity. A more complex behavior is observed when alloying atoms are deposited during the post-coalescence growth stages: Cu, Au, Al, and Cr favor 2D morphology, while Ti and Mo yield a more pronounced three-dimensional morphological evolution. The overall results presented herein show that targeted deployment of alloying agents constitutes a generic platform for designing bespoken heterostructures between metal layers and technologically relevant weakly interacting substrates.& nbsp;Published under an exclusive license by the AVS.
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| 4. |
- Jamnig, Andreas, 1991-, et al.
(author)
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On the effect of copper as wetting agent during growth of thin silver films on silicon dioxide substrates
- 2021
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In: Applied Surface Science. - : Elsevier BV. - 0169-4332 .- 1873-5584. ; 538
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Journal article (peer-reviewed)abstract
- We study the effect of Cu incorporation on the morphological evolution and the optoelectronic properties of thin Ag films deposited by magnetron sputtering on weakly-interacting SiO2 substrates. In situ and real time spectroscopic ellipsometry data show that by adding up to 4at.% Cu throughout the entire film deposition process, wetting of the substrate by the metal layer is promoted, as evidenced by a decrease of the thickness at which the film becomes continuous from 19.5nm (pure Ag) to 15nm (Ag96Cu4). The in situ data are consistent with ex situ x-ray reflectometry analyses which show that Cu-containing films exhibit a root mean square roughness of 1.3nm compared to the value 1.8nm for pure Ag films, i.e., Cu leads to smoother film surfaces. These morphological changes are coupled with an increase in continuous-layer electrical resistivity from 1.0×10-5Ωcm (Ag) to 1.25×10-5Ωcm (Ag96Cu4). Scanning electron microscopic studies of discontinuous layers reveal that the presence of Cu at the film growth front promotes smooth surfaces (as compared to pure Ag films) by hindering the rate of island coalescence. To further understand the effect of Cu on film growth and electrical properties, in a second set of experiments, we deploy Cu with high temporal precision to target specific film-formation stages. The results show that longer presence of Cu in the vapor flux and the film growth front promote flat morphology. However, both a flat surface and a continuous-layer electrical resistivity that is equal to that of pure Ag films can only be achieved when Cu is deployed during the first 2.4nm of film deposition, during which morphological evolution is, primarily, governed by island coalescence. Our overall results highlight potential pathways for fabricating high-quality multifunctional metal contacts in a wide range of optoelectronic devices based on weakly-interacting oxides and van der Waals materials.
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| 5. |
- Jamnig, Andreas, et al.
(author)
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The effect of kinetics on intrinsic stress generation and evolution in sputter-deposited films at conditions of high atomic mobility
- 2020
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In: Journal of Applied Physics. - : AMER INST PHYSICS. - 0021-8979 .- 1089-7550. ; 127:4
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Journal article (peer-reviewed)abstract
- Vapor-based metal film growth at conditions that promote high atomic mobility is typically accompanied by compressive stress formation after completion of island coalescence, while an apparent stress relaxation is observed upon deposition interruption. Despite numerous experimental studies confirming these trends, the way by which growth kinetics affect postcoalescence stress magnitude and evolution is not well understood, in particular, for sputter-deposited films. In this work, we study in situ and in real-time stress evolution during sputter-deposition of Ag and Cu films on amorphous carbon. In order to probe different conditions with respect to growth kinetics, we vary the deposition rate F from 0:015 to 1:27 nm/s, and the substrate temperature T-S from 298 to 413 K. We find a general trend toward smaller compressive stress magnitudes with increasing T-S for both film/substrate systems. The stress-dependence on F is more complex: (i) for Ag, smaller compressive stress is observed when increasing F; (ii) while for Cu, a nonmonotonic evolution with F is seen, with a compressive stress maximum for F = 0.102 nm/s. Studies of postdeposition stress evolution show the occurrence of a tensile rise that becomes less pronounced with increasing T-S and decreasing F, whereas a faster tensile rise is seen by increasing F and T-S. We critically discuss these results in view of ex situ obtained film morphology which show that deposition-parameter-induced changes in film grain size and surface roughness are intimately linked with the stress evolution. (c) 2020 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
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| 6. |
- Papaderakis, Athanasios, et al.
(author)
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Ternary IrO2-Pt-Ni deposits prepared by galvanic replacement as bifunctional oxygen catalysts
- 2020
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In: JOURNAL OF ELECTROANALYTICAL CHEMISTRY. - : ELSEVIER SCIENCE SA. - 1572-6657. ; 877
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Journal article (peer-reviewed)abstract
- Bifunctional oxygen catalysts with IrO2 and Pt active components have been prepared by means of galvanic partial replacement of Ni layers electrodeposited on glassy carbon substrates (Ni/GC). The resulting IrO2Pt(Ni)/GC electrodes have a homogeneous and compact morphology (SEM), while surface electrochemistry and spectroscopic measurements (EDS, XPS) confirm the ternary bulk structure (EDS: 56.39% Ir- 7.60% Pt - 36.01% Ni atomic ratio) and the existence of a IrO2-Pt thin skin on the outermost layers of the deposits (XPS: Ir+ Pt atomic ratio of 21.7). IrO2Pt (Ni)/GC electrodes were evaluated as bifunctional electrocatalysts for oxygen evolution (OER) and oxygen reduction (ORR) reactions in acid, by means of steady-state current-potential measurements and linear sweep voltanunetry at a Rotating Disc Electrode (RDE) respectively. The OER overpotential required for a current density (per substrate geometric area) of 1 (eta(1)) and 10 mA cm(-2) (eta(10)) on the prepared electrodes was 235 and 302 my respectively, which is in the range of some typical thermally produced IrO2-based DSAs. Their intrinsic OER catalytic activity (as estimated by normalization of the recorded currents at an overpotential of 260 mV by the oxides charge) was found to be 0.29 mA mC(-1) comparable or better to other thermally produced IrO2 and Pt-IrO2 systems. Koutecky-Levich analysis shows that ORR proceeds on the ternary catalysts via the four electrons pathway. The overall ORR catalytic activity (0.4 mA cm(-2) at +0.8 V vs. SIIE) is found to be in the range of that recorded on nanoparticle catalysts, while a suppression of the intrinsic activity compared to bulk Pt is observed most probably due to the presence of IrO2, the latter being in line with similar non-alloyed Pt-IrO2 systems reported in the literature.
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| 7. |
- Pliatsikas, Nikolaos, et al.
(author)
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Energetic bombardment and defect generation during magnetron-sputter-deposition of metal layers on graphene
- 2021
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In: Applied Surface Science. - : Elsevier. - 0169-4332 .- 1873-5584. ; 566
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Journal article (peer-reviewed)abstract
- In the present work, we elucidate the interplay among energetic bombardment effects in magnetron sputtering and defect generation in two-dimensional (2D) materials. Using deposition of gold (Au) layers on single-layer graphene (SLG) as a model system, we study the effect of pressure-distance (pd) product during magnetron sputtering on the pristine SLG properties. Raman spectroscopy, complemented by X-ray photoelectron spectroscopy, shows that for pd = 8.2 Pa center dot cm, Au layer deposition causes defects in the SLG layer, which gradually diminish and eventually disappear with increasing pd to 82.5 Pa center dot cm. Stochastic and deterministic simulations of the sputtering process, the gas-phase transport, and the interaction of sputtered and plasma species with the substrate surface suggest that defects in SLG primarily emanate from ballistic damage caused by backscattered Ar atoms with energies above 100 eV. With increasing pd, and thereby gas-phase scattering, such high energy Ar species become thermalized and hence incapable of causing atomic displacements in the SLG layer. The overall results of our study suggest that control of backscattered Ar energy is a potential path toward enabling magnetron sputtering for fabrication of multifunctional metal contacts in devices founded upon 2D materials.
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| 8. |
- Pliatsikas, Nikolaos, et al.
(author)
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Manipulation of thin silver film growth on weakly interacting silicon dioxide substrates using oxygen as a surfactant
- 2020
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In: Journal of Vacuum Science & Technology. A. Vacuum, Surfaces, and Films. - : A V S AMER INST PHYSICS. - 0734-2101 .- 1520-8559. ; 38:4
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Journal article (peer-reviewed)abstract
- The authors study the morphological evolution of magnetron-sputtered thin silver (Ag) films that are deposited on weakly interacting silicon dioxide (SiO2) substrates in an oxygen-containing (O-2) gas atmosphere. In situ and real-time monitoring of electrically conductive layers, along with ex situ microstructural analyses, shows that the presence of O-2, throughout all film-formation stages, leads to a more pronounced two-dimensional (2D) morphology, smoother film surfaces, and larger continuous-layer electrical resistivities, as compared to Ag films grown in pure argon (Ar) ambient. In addition, the authors data demonstrate that 2D morphology can be promoted, without compromising the Ag-layer electrical conductivity, if O-2 is deployed with high temporal precision to target film formation stages before the formation of a percolated layer. Detailed real-space imaging of discontinuous films, augmented by in situ growth monitoring data, suggests that O-2 favors 2D morphology by affecting the kinetics of initial film-formation stages and most notably by decreasing the rate of island coalescence completion. Furthermore, compositional and bonding analyses show that O-2 does not change the chemical nature of the Ag layers and no atomic oxygen is detected in the films, i.e., O-2 acts as a surfactant. The overall results of this study are relevant for developing noninvasive surfactant-based strategies for manipulating noble-metal-layer growth on technologically relevant weakly interacting substrates, including graphene and other 2D crystals.
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| 9. |
- Shtepliuk, Ivan, et al.
(author)
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Clustering and Morphology Evolution of Gold on Nanostructured Surfaces of Silicon Carbide: Implications for Catalysis and Sensing
- 2021
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In: ACS Applied Nano Materials. - : American Chemical Society (ACS). - 2574-0970. ; 4:2, s. 1282-1293
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Journal article (peer-reviewed)abstract
- A fundamental understanding of the behavior of gold (Au) nanostructures deposited on functional surfaces is imperative to discover and leverage interface-related phenomena that can boost the efficiency of existing electronic devices in sensorics, catalysis, and spintronics. In the present work, Au layers with nominal thickness of 2 nm were sputter-deposited on graphenized SiC substrates represented by buffer layer (BuL)/4H-SiC and monolayer epitaxial graphene (MLG)/4H-SiC. Morphometric analysis by means of scanning electron microscopy shows that Au on BuL self-assembles in nearly round-shaped plasmonically active islands, while on MLG, a fractal growth of considerably larger and ramified islands is observed. To correlate the experimentally established differences in surface morphology on the two types of graphenized substrates with energetics and kinetics of Au nanostructure growth, the deposit-substrate interaction strength was studied using density functional theory (DFT) calculations, molecular dynamics simulations, and optical measurements. The theoretical considerations involve participation of Au clusters with different sizes and energetics at the initial stages of the metal nanostructure formation. The results indicate that gold exhibits a considerably stronger interaction with BuL than with MLG, which can be considered as a key aspect for explaining the experimentally observed morphological differences. From the statistical analysis of Raman spectra, indications of Au intercalation of MLG are discussed. The current research shows that, due to its unique surface chemistry, buffer layer has peculiar affinity to gold when compared to other atomically flat surfaces, which is beneficial for boosting high-performance catalytic and sensing technologies based on low-dimensional materials.
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| 10. |
- Shtepliuk, Ivan, et al.
(author)
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Electrochemical performance of gold-decorated graphene electrodes integrated with SiC
- 2023
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In: Microelectronic Engineering. - : Elsevier BV. - 0167-9317 .- 1873-5568. ; 278
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Journal article (peer-reviewed)abstract
- Here we investigate the interface properties of gold (Au) decorated graphenized surfaces of 4H-SiC intended for electrochemical electrodes. These are fabricated using a two-step process: discontinuous Au layers with a nominal thickness of 2 nm are sputter-deposited onto 4H-SiC substrates with different graphenization extent—zero-layer graphene (ZLG) and monolayer epitaxial graphene) —followed by thermal annealing. By performing combined morphometric analysis, Raman mapping analysis, conductive atomic force microscopy, and electrochemical impedance spectroscopy measurements, we shed light on the relationship between physical processes (Au intercalation, particle re-shaping, and de-wetting) caused by thermal annealing and the intrinsic properties of graphenized SiC (vertical electron transport, charge-transfer properties, vibrational properties, and catalytic activity). We find that the impedance spectra of all considered structures exhibit two semicircles in the high and low frequency regions, which may be attributed to the graphene/ZLG/SiC (or Au/graphene/ZLG/SiC) and SiC/ZLG/graphene/electrolyte (or SiC/ZLG//Au/electrolyte) interfaces, respectively. An equivalent circuit model is proposed to estimate the interface carrier transfer parameters. This work provides an in-depth comprehension of the way by which the Au/2D carbon/SiC interaction strength influences the interface properties of heterostructures, which can be helpful for developing high performance catalytic and sensing devices.
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