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- Wu, Kuan-Hsun, et al.
(author)
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Considerations of SiP based Antenna in Package/Module (AiP/AiM) Design at Sub-Terahertz Frequencies for Potential B5G/6G Applications
- 2021
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In: Proceedings - Electronic Components and Technology Conference. - 0569-5503. ; 2021-June, s. 1162-1168
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Conference paper (peer-reviewed)abstract
- Antenna-in-Package/Module (AiP/AiM) are the primary technologies to realize the RF subsystems for frequencies beyond millimeter-wave (mmW) bands, including sub-terahertz for potential B5G/6G applications. Due to the small wavelength, the mechanical process of the current system-in-package (SiP) results in limitations to realize antenna arrays at sub-terahertz. In this paper, the mechanical limits to cause radiation discrepancy is investigated by designing an AiP/AiM at 110 GHz band. Through the parametric studies based on the currently available cheap SiP process, one may summarize the considerations of AiP/AiM design for beyond sub-terahertz frequencies. The examination will consider the design of an 8x8 antenna array to provide a radiation gain of 20 dBi. Numerical full-wave simulations by HFSS were performed to obtain reliable behaviors of AiP/AiM radiations.
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