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  • Rosenberg, D., et al. (author)
  • 3D integrated superconducting qubits
  • 2017
  • In: npj Quantum Information. - : Springer Science and Business Media LLC. - 2056-6387. ; 3
  • Journal article (peer-reviewed)abstract
    • As the field of quantum computing advances from the few-qubit stage to larger-scale processors, qubit addressability and extensibility will necessitate the use of 3D integration and packaging. While 3D integration is well-developed for commercial electronics, relatively little work has been performed to determine its compatibility with high-coherence solid-state qubits. Of particular concern, qubit coherence times can be suppressed by the requisite processing steps and close proximity of another chip. In this work, we use a flip-chip process to bond a chip with superconducting flux qubits to another chip containing structures for qubit readout and control. We demonstrate that high qubit coherence (T1, T2, echo > 20 μs) is maintained in a flip-chip geometry in the presence of galvanic, capacitive, and inductive coupling between the chips.
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Type of publication
journal article (1)
Type of content
peer-reviewed (1)
Author/Editor
Kim, D. (1)
Yan, F. (1)
Krantz, Philip, 1984 (1)
Melville, A (1)
Das, R. (1)
Gustavsson, S (1)
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Oliver, W.D. (1)
Rosenberg, D (1)
Hover, D. (1)
Weber, S.J. (1)
Yoder, J.L. (1)
Kerman, A.J. (1)
Yost, D. (1)
Racz, L. (1)
Samach, G. O. (1)
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University
Chalmers University of Technology (1)
Language
English (1)
Research subject (UKÄ/SCB)
Natural sciences (1)
Engineering and Technology (1)
Year
2017 (1)

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