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1.
  • Chen, Xi, et al. (author)
  • Photothermally tunable silicon-microring-based optical add-drop filter through integrated light absorber
  • 2014
  • In: Optics Express. - 1094-4087. ; 22:21, s. 25233-25241
  • Journal article (peer-reviewed)abstract
    • An optically pumped thermo-optic (TO) silicon ring add-drop filter with fast thermal response is experimentally demonstrated. We propose that metal-insulator-metal (MIM) light absorber can be integrated into silicon TO devices, acting as a localized heat source which can be activated remotely by a pump beam. The MIM absorber design introduces less thermal capacity to the device, compared to conventional electrically-driven approaches. Experimentally, the absorber-integrated add-drop filter shows an optical response time of 13.7 mu s following the 10%-90% rule (equivalent to a exponential time constant of 5 mu s) and a wavelength shift over pump power of 60 pm/mW. The photothermally tunable add-drop filter may provide new perspectives for all-optical routing and switching in integrated Si photonic circuits.
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2.
  • Chen, Xi, et al. (author)
  • Photothermally tunable silicon-microring-based optical add-drop filter through integrated light absorber
  • 2014
  • In: Optics Express. - : Optica Publishing Group. - 1094-4087. ; 22:21, s. 25233-25241
  • Journal article (peer-reviewed)abstract
    • An optically pumped thermo-optic (TO) silicon ring add-drop filter with fast thermal response is experimentally demonstrated. We propose that metal-insulator-metal (MIM) light absorber can be integrated into silicon TO devices, acting as a localized heat source which can be activated remotely by a pump beam. The MIM absorber design introduces less thermal capacity to the device, compared to conventional electrically-driven approaches. Experimentally, the absorber-integrated add-drop filter shows an optical response time of 13.7 μs following the 10%–90% rule (equivalent to a exponential time constant of 5 μs) and a wavelength shift over pump power of 60 pm/mW. The photothermally tunable add-drop filter may provide new perspectives for all-optical routing and switching in integrated Si photonic circuits.
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3.
  • Chen, Xi, et al. (author)
  • Photothermally tunable silicon microring-resonator-based optical add-drop filter
  • Other publication (other academic/artistic)abstract
    • A themro-optic (TO) silicon photonic add-drop filterwith small switching power and fast response is experimentallydemonstrated. We propose that metal-insulator-metal (MIM)absorbers can be integrated into the silicon TO devices, acting asan efficient and localized heat source. The MIM absorber designintroduces less thermal capacity to the device, comparing to theelectrically driven heater used in conventional TO devices. As a keyelement in silicon photonics, microring resonators have applicationin wavelength-division-multiplexing (WDM) devices, owning to theirunique spectrum properties. In this work, a silicon microring add-dropfilter is equipped with a MIM absorber. Experimentally, the deviceshows a measured optical response time of 5.0 μs and pumping powerderivative of the wavelength shift of 60 pm/mW.
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4.
  • Dou, Maofeng, et al. (author)
  • Casimir quantum levitation tuned by means of material properties and geometries
  • 2014
  • In: Physical Review B. Condensed Matter and Materials Physics. - 1098-0121 .- 1550-235X. ; 89:20, s. 201407-
  • Journal article (peer-reviewed)abstract
    • The Casimir force between two surfaces is attractive in most cases. Although stable suspension of nano-objects has been achieved, the sophisticated geometries make them difficult to be merged with well-established thin film processes. We find that by introducing thin film surface coating on porous substrates, a repulsive to attractive force transition is achieved when the separations are increased in planar geometries, resulting in a stable suspension of two surfaces near the force transition separation. Both the magnitude of the force and the transition distance can be flexibly tailored though modifying the properties of the considered materials, that is, thin film thickness, doping concentration, and porosity. This stable suspension can be used to design new nanodevices with ultralow friction. Moreover, it might be convenient to merge this thin film coating approach with micro- and nanofabrication processes in the future.
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5.
  • Lou, Fei, et al. (author)
  • Design and analysis of ultra-compact EO polymer modulators based on hybrid plasmonic microring resonators
  • 2013
  • In: Optics Express. - 1094-4087. ; 21:17, s. 20041-20051
  • Journal article (peer-reviewed)abstract
    • Ultra-compact EO polymer modulators based on hybrid plasmonic microring resonators are proposed, simulated and analyzed. Comparing with Si slot microring modulator, hybrid plasmonic microring modulator shows about 6-times enhancement of the figure of merit when the bending radius is around 510 nm, due to its much larger intrinsic quality factor in sub-micron radius range. Influences of the EO polymer height and Si height on the device's performance are analyzed and optimal design is given. When operating with a bias of 3.6V, the proposed device has optical modulation amplitude of 0.8 and insertion loss of about 1 dB. The estimated power consumption is about 5 fJ/bit at 100 GHz.
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6.
  • Lou, Fei (author)
  • Design, fabrication and characterization of plasmonic components based on silicon nanowire platform
  • 2014
  • Doctoral thesis (other academic/artistic)abstract
    • Optical interconnects based on CMOS compatible photonic integrated circuits are regarded as a promising technique to tackle the issues traditional electronics faces, such as limited bandwidth, latency, vast energy consumption and so on. In recent years, plasmonic integrated components have gained great attentions due to the properties of nano-scale confinement, which may potentially bridge the size mismatch between photonic and electronic circuits. Based on silicon nanowire platform, this thesis work studies the design, fabrication and characterization of several integrated plasmonic components, aiming to combine the benefits of Si and plasmonics.The basic theories of surface plasmon polaritons are introduced in the beginning, where we explain the physics behind the diffraction-free confinement. Numerical methods frequently used in the thesis including finite-difference time-domain method and finite-element method are then reviewed. We summarize the device fabrication techniques such as film depositions, e-beam lithography and inductively coupled plasma etching as well as characterization methods, such as direct measurement method, butt coupling, grating coupling etc.Fabrication results of an optically tunable silicon-on-insulator microdisk and III-V cavities in applications as light sources for future nanophotonics interconnects are briefly discussed. Afterwards we present in details the experimental demonstrations and novel design of plasmonic components.Hybrid plasmonic waveguides and directional couplers with various splitting ratios are firstly experimentally demonstrated. The coupling length of two 170 nm wide waveguides with a separation of 140 nm is only 1.55 µm. Secondly, an ultracompact polarization beam splitter with a footprint of 2×5.1 μm2 is proposed. The device features an extinction ratio of 12 dB and an insertion loss below 1.5 dB in the entire C-band. Thirdly, we show that plasmonics offer decreased bending losses and enhanced Purcell factor for submicron bends. Novel hybrid plasmonic disk, ring and donut resonators with radii of ~ 0.5 μm and 1 μm are experimentally demonstrated for the first time. The Q-factor of disks with 0.5 μm radii are                         , corresponding to Purcell factors of . Thermal tuning is also presented. Fourthly, we propose a design of electro-optic polymer modulator based on plasmonic microring. The figure of merit characterizing modulation efficiency is 6 times better comparing with corresponding silicon slot polymer modulator. The device exhibits an insertion loss below 1 dB and a power consumption of 5 fJ/bit at 100 GHz. At last, we propose a tightly-confined waveguide and show that the radius of disk resonators based on the proposed waveguide can be shrunk below 60 nm, which may be used to pursue a strong light-matter interaction.The presented here novel components confirm that hybrid plasmonic structures can play an important role in future inter- and intra-core computer communication systems.
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7.
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8.
  • Lou, Fei, et al. (author)
  • Experimental demonstration of ultra-compact directional couplers based on silicon hybrid plasmonic waveguides
  • 2012
  • In: Applied Physics Letters. - : AIP Publishing. - 0003-6951 .- 1077-3118. ; 100:24, s. 241105-
  • Journal article (peer-reviewed)abstract
    • Hybrid plasmonic waveguides and directional couplers have been experimentally demonstrated. Using a direct measurement method, the propagation loss of a 170 nm wide waveguide is measured to be 0.08 dB/mu m at 1550 nm when the thickness of low-index region is 56 nm. Ultra-compact directional couplers based on such hybrid plasmonic waveguides are demonstrated with gaps of 140 nm, 185 nm, 235 nm, and 290 nm. The corresponding coupling lengths measured are 1.55 mu m, 2.2 mu m, 3.2 mu m, and 4.8 mu m, respectively, which are in very good agreement with the simulations. These ultra-compact devices can be potentially used in future ultra-dense photonic integrated circuits.
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9.
  • Lou, Fei, et al. (author)
  • Hybrid plasmonic microdisk resonators for optical interconnect applications
  • 2013
  • In: Integrated Optics. - : SPIE - International Society for Optical Engineering. - 9780819495839 ; , s. 87810X-
  • Conference paper (peer-reviewed)abstract
    • In this paper, we present our theoretical and experimental work on hybrid plasmonic microdisks. The 170 nm wide access waveguide is first simulated and characterized, and shows a propagation loss about 0.08 dB/mu m. 3-D FDTD simulations are then used to investigate the lower limit of the bending radius of the hybrid plasmonic microdisk. Microdisks with radius around 500 nm are fabricated, characterized, and analyzed. The 5th and 4th order resonances are experimentally observed around 1412 nm and 1625 nm. The extinction ratios of the two resonances are measured to be 5.5dB and above 10dB, respectively. The measured intrinsic quality factors are 350 and 110, respectively. Comparisons are also made between the theoretical and experimental results. The demonstrated ultra-small hybrid plasmonic microdisk may find applications in low-power-consumption modulators, nano laser cavities with large Purcell-factor, molecule sensors, and others.
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10.
  • Lou, Fei, et al. (author)
  • Photonic devices based on silicon hybrid plasmonic waveguides
  • 2012
  • In: 2012 Asia Communications And Photonics Conference (ACP). - Washington, D.C. : Optica Publishing Group. ; , s. AS2H.2-
  • Conference paper (peer-reviewed)abstract
    • A 170 nm wide hybrid plasmonic waveguide with a loss of 0,08 dB/mu m is demonstrated experimentally. Directional couplers with different gaps and microdisks with 0.5 mu m radius based on such waveguides are also presented.
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11.
  • Lou, Fei, et al. (author)
  • Sub-wavelength microdisk resonator based on hybrid plasmonic waveguides
  • 2012
  • In: Information Optoelectronics, Nanofabrication and Testing, IONT 2012. - 9781557529602
  • Conference paper (peer-reviewed)abstract
    • Based on hybrid plasmonic waveguides, microdisk resonators with radii of 0.5 μm and FSRs of about 200 nm are simulated and experimentally demonstrated. Thermal tuning of the devices in 6 nm range is also presented.
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12.
  • Lou, Fei, et al. (author)
  • Transmission characteristics of a novel grating assisted microring
  • 2011
  • In: 2011 Asia Communications and Photonics Conference and Exhibition, ACP 2011. - Washington, D.C. : IEEE Computer Society. - 9780819489616 ; , s. 83080A-
  • Conference paper (peer-reviewed)abstract
    • We propose a new type of grating-assisted microring (GAMR) structure with Bragg gratings placed on microring's arms. Two Fabry-Perot resonances interact with microring resonance, resulting in GAMR's unique amplitude and phase spectra. The structure's characteristics are analytically studied using coupled mode theory and numerically verified by 2D-FDTD. With proper cavity lengths, GAMR exhibits an electromagnetically induced transparency (EIT)-like spectrum. The ultra-narrow resonance can be used for sensing, modulation, and other applications.
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13.
  • Lou, Fei, et al. (author)
  • Ultra-sharp bends based on hybrid plasmonic waveguides
  • 2014
  • In: European Conference on Optical Communication, ECOC.
  • Conference paper (peer-reviewed)abstract
    • To explore the potentials of hybrid plasmonics, ultrasharp 90 degree bends and resonators based on silicon waveguide and hybrid plasmonic waveguides are simulated and analyzed. Experimental demonstrations of ring and donut resonators based on hybrid plasmonics are also presented.
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14.
  • Lou, Fei, et al. (author)
  • Ultracompact polarization beam splitter based on a dielectric-hybrid plasmonic-dielectric coupler
  • 2012
  • In: Optics Letters. - 0146-9592 .- 1539-4794. ; 37:16, s. 3372-3374
  • Journal article (peer-reviewed)abstract
    • An ultracompact polarization beam splitter (PBS) based on a dielectric-hybrid plasmonic-dielectric coupler is proposed. The device utilizes the polarization-dependent nature of hybrid plasmonic waveguides. By choosing proper waveguide parameters, a 2 x 5.1 mu m(2) PBS (including S-bends) with extinction ratios over 15 dB and insertion losses below 1.5 dB in the full C-band should be achievable. The effect of fabrication errors is also investigated.
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15.
  • Lou, Fei, et al. (author)
  • Whispering gallery mode nanodisk resonator based on layered metal-dielectric waveguide
  • 2014
  • In: Optics Express. - 1094-4087. ; 22:7, s. 8490-8502
  • Journal article (peer-reviewed)abstract
    • This paper proposes a layered metal-dielectric waveguide consisting of a stack of alternating metal and dielectric films which enables an ultracompact mode confinement. The properties of whispering gallery modes supported by disk resonators based on such waveguides are investigated for achieving a large Purcell factor. We show that by stacking three layers of 10 nm thick silver with two layers of 50 nm dielectric layers (of refractive index n) in sequence, the disk radius can be as small as 61 nm similar to lambda(0) / (7n) and the mode volume is only 0.0175 (lambda(0) / (2n))(3). When operating at 40 K, the cavity's Q-factor can be similar to 670; Purcell factor can be as large as 2.3x10(4), which is more than five times larger than that achievable in a metal-dielectric-metal disk cavity in the same condition. When more dielectric layers with smaller thicknesses are used, even more compact confinement can be achieved. For example, the radius of a cavity consisting of seven dielectric-layer waveguide can be shrunk down to lambda(0) / (13.5n), corresponding to a mode volume of 0.005 lambda(0) / (2n))(3), and Purcell factor can be enhanced to 7.3x10(4) at 40 K. The influence of parameters like thicknesses of dielectric and metal films, cavity size, and number of dielectric layers is also comprehensively studied. The proposed waveguide and nanodisk cavity provide an alternative for ultracompact light confinement, and can find applications where a strong light-matter interaction is necessary.
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16.
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17.
  • Shi, Yuechun, et al. (author)
  • All-optical switching of silicon disk resonator based on photothermal effect in metal-insulator-metal absorber
  • 2014
  • In: Optics Letters. - 0146-9592 .- 1539-4794. ; 39:15, s. 4431-4434
  • Journal article (peer-reviewed)abstract
    • Efficient narrowband light absorption by a metal-insulator-metal (MIM) structure can lead to high-speed light-to-heat conversion at a micro-or nanoscale. Such a MIM structure can serve as a heater for achieving all-optical light control based on the thermo-optical (TO) effect. Here we experimentally fabricated and characterized a novel all-optical switch based on a silicon microdisk integrated with a MIM light absorber. Direct integration of the absorber on top of the microdisk reduces the thermal capacity of the whole device, leading to high-speed TO switching of the microdisk resonance. The measurement result exhibits a rise time of 2.0 mu s and a fall time of 2.6 mu s with switching power as low as 0.5 mW; the product of switching power and response time is only about 1.3 mW.mu s. Since no auxiliary elements are required for the heater, the switch is structurally compact, and its fabrication is rather easy. The device potentially can be deployed for new kinds of all-optical applications.
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18.
  • Shi, Yuechun, et al. (author)
  • All-optical switching of silicon disk resonator based on photothermal effect in metal–insulator–metal absorber
  • 2014
  • In: Optics Letters. - : Optica Publishing Group. - 0146-9592 .- 1539-4794. ; 39:15, s. 4431-4434
  • Journal article (peer-reviewed)abstract
    • Efficient narrowband light absorption by a metal–insulator–metal (MIM) structure can lead to high-speed light-to-heat conversion at a micro- or nanoscale. Such a MIM structure can serve as a heater for achieving all-optical light control based on the thermo-optical (TO) effect. Here we experimentally fabricated and characterized a novel all-optical switch based on a silicon microdisk integrated with a MIM light absorber. Direct integration of the absorber on top of the microdisk reduces the thermal capacity of the whole device, leading to high-speed TO switching of the microdisk resonance. The measurement result exhibits a rise time of 2.0 μs and a fall time of 2.6 μs with switching power as low as 0.5 mW; the product of switching power and response time is only about 1.3  mW·μs1.3  mW·μs. Since no auxiliary elements are required for the heater, the switch is structurally compact, and its fabrication is rather easy. The device potentially can be deployed for new kinds of all-optical applications.
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19.
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20.
  • Wang, Yanan, et al. (author)
  • SKIN+ : Fabricating Soft Fluidic User Interfaces for Enhancing On-Skin Experiences and Interactions
  • 2018
  • In: CHI EA '18, Extended Abstracts of the 2018 CHI Conference on Human Factors in Computing Systems. - New York, NY, USA : Association for Computing Machinery (ACM). - 9781450356213
  • Conference paper (peer-reviewed)abstract
    • Human skin is the largest organ on our body not only senses and external environment. A growing number of researchers devote themselves to design seamless interfaces directly on skin. In this late-breaking work, we propose a novel way for creating dynamic 2.5D skin textures, called SKIN+, a soft fluidic mini-scale user interface by introducing fluidic actuation. We have created four swatches with different pre-defined textures, topologies and structures to explore how this fluidic actuation system can benefit on-skin experiences and interactions. Our work details the intriguing experiences and interactions and future applications of on-skin wearables. Our work also extends the expressiveness, aesthetics and design space of soft fluidic interface as skin decoration and beauty technology.
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21.
  • Wosinski, Lech, et al. (author)
  • Advanced silicon device technologies for optical interconnects
  • 2012
  • In: Optoelectronic Integrated Circuits XIV. - : SPIE - International Society for Optical Engineering. - 9780819489081 ; , s. 826506-
  • Conference paper (peer-reviewed)abstract
    • Silicon photonics is an emerging technology offering novel solutions in different areas requiring highly integrated communication systems for optical networking, sensing, bio-applications and computer interconnects. Silicon photonicsbased communication has many advantages over electric wires for multiprocessor and multicore macro-chip architectures including high bandwidth data transmission, high speed and low power consumption. Following the INTEL's concept to "siliconize" photonics, silicon device technologies should be able to solve the fabrication problems for six main building blocks for realization of optical interconnects: light generation, guiding of light including wavelength selectivity, light modulation for signal encoding, detection, low cost assembly including optical connecting of the devices to the real world and finally the electronic control systems.
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22.
  • Wosinski, Lech, et al. (author)
  • Hybrid plasmonic components based on silicon nanowire platform
  • 2014
  • In: 2014 13th International Conference on Optical Communications and Networks, ICOCN 2014. - 9781479972180
  • Conference paper (peer-reviewed)abstract
    • CMOS compatible photonic integrated circuits have gained great attentions in short haul interconnects applications because of the promises to tackle the issues of traditional copper interconnects. Towards the monolithic integration of electronics and photonics, lots of efforts have been made to decrease the device footprint by using surface plasmon polaritons (SPPs), in order to enhance performances and decrease power consumption. With current metals, this is, however, only true for single or few cascaded devices. This situation can be mitigated by hybridizing SPPs with dielectric modes; hybrid plasmonic waveguides based on silicon platform can provide an alternative to exploit the advantages of both plasmonics and silicon. This paper presents several examples of design, fabrication and characterization of hybrid plasmonic functional components based on silicon nanowire platform, including hybrid plasmonic directional couplers, polarization beam splitters, disks and rings with submicron radii. A proposal of electro-optic polymer modulator based on hybrid plasmonic ring resonator is also discussed. The presented components provide alternative perspectives of novel devices which may be useful in future inter- and intra-core communication systems.
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23.
  • Wosinski, Lech, et al. (author)
  • Hybrid Plasmonics for Computer Interconnects
  • 2013
  • In: Asia Communications and Photonics Conference 2013, OSA Technical Digest. - Washington, D.C. : Optical Society of America. - 9781557529893 ; , s. ATh4A-
  • Conference paper (peer-reviewed)abstract
    • Hybrid plasmonic waveguide structures allows for sub-wavelength light confinement while keeping propagation losses on an acceptable level. Design and experimental realization of ultra-compact hybrid plasmonic devices based on a silicon platform are presented.
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24.
  • Wosinski, Lech, et al. (author)
  • Nanoscale Si-based photonics for next generation integrated circuits
  • 2013
  • In: 2013 15th International Conference on Transparent Optical Networks (ICTON). - : Institute of Electrical and Electronics Engineers (IEEE). ; , s. 6602976-
  • Conference paper (peer-reviewed)abstract
    • Silicon-based integrated photonics became a very attractive technology for guiding and manipulating of light in highly integrated structures due to the large index contrast between silicon and cladding materials allowing for very high mode confinement. Moreover, these structures can be realized by conventional planar CMOS techniques. Different passive devices based on Si nanowire waveguides have been realized using SOI technology or amorphous silicon deposition with applications in highly integrated communication systems for optical networking, bio and sensing, as well as for computer interconnects in data centers. Nevertheless for future use, especially for inter-core and intra-core computer communication, structures allowing for subwavelength light confinement based on surface plasmon waveguiding are an attractive solution. Different methods to decrease or compensate the intrinsic high losses of these structures have been proposed. Here we report our work on design and experimental realization of hybrid plasmonic waveguides and devices that allow for considerable decrease of losses, still keeping sub-wavelength light confinement.
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25.
  • Wosinski, Lech, et al. (author)
  • Novel plasmonic waveguides and devices
  • 2012
  • In: Information Optoelectronics, Nanofabrication and Testing, IONT 2012.
  • Conference paper (peer-reviewed)abstract
    • We present a set of simulated and fabricated devices based on hybrid plasmonic waveguides allowing for sub-wavelength light confinement. These devices increase integration level and enhance the performances of photonic integrated circuits for interconnect applications.
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26.
  • Wosinski, Lech, et al. (author)
  • Silicon- and Plasmonics-Based Nanophotonics for Telecom and Interconnects
  • 2014
  • Conference paper (peer-reviewed)abstract
    • Silicon nanophotonics became recently a very promising solution for high-speed signal transmission and processing with high bandwidth and very compact size, even for multifunctional integrated structures. With submicron waveguide cross section and bending radius down to 2 mu m with acceptable losses (0.04 dB/90 degrees bend) these structures give promising perspectives for electronic - photonic integration on a common Si platform since they can be realized by conventional planar CMOS techniques. Many research groups, both in academia and the electronics industry, have demonstrated different passive and active components, as well as integrated functional devices. However for more complex optical architectures, for example in optical interconnects for inter-and intra-core data communication, even higher integration density and modal field confinement below the diffraction limit of light, are necessary. For downscaling of photonic components, different solutions based on surface plasmon waveguiding along metal - dielectric interfaces have been proposed including strip-line, slot-line [1] and v-grove [2] structures, as well as some more sophisticated multi-layered systems [3] and quantum dot arrays [4]. Unfortunately, most of them suffer from the high losses always associated with maximum light confinement, resulting in short propagation lengths of the order of several micrometers. Hybrid plasmonic structures, which consist of a low refractive index slot sandwiched between e.g. a gold layer and a silicon material, appear to be a good solution [5-7]. In such structures, light is partly localized in the low-index dielectric and partly in the high-index Si giving relaxed conditions for propagation of the hybrid mode, but still with high confinement. Losses as low as 0.01 dB/mu m (propagation length over 400 mu m) have been obtained experimentally [8]. This is still orders of magnitude higher than those of conventional photonic waveguides, but acceptable for many functional components, not only to decrease the overall size of the structure, but also due to some specific advantages plasmonic components can bring forward, including temperature and production error tolerances, energy efficiency, large Purcell factor and others. So the best choice will probably be to use some kind of hybrid nanoplasmonic-photonic structures with conventional photonic waveguiding and functional plasmonic components. Hybrid plasmonic microring modulators, for example, with sub-micron radius have an intrinsically low quality factor Q, which on one side causes low channel bandwidth of these devices, but simultaneously allows for temperature and production error tolerances. The Q value of a 500 nm radius microring is anyway 8 times higher than the Q of similar Si slot microrings [9]. According to our calculations done for modulators using electrooptic polymer (EOP), even with a moderate electrooptic coefficient of 80 pm/V, due to the small footprint, the device capacitance is very small allowing for RC-limited modulation speed of 190 GHz (modulation speed limited by the cavity photon lifetime is larger than 300 GHz) and giving the average power consumption of only 5 fJ/bit. Similarly for lasers, due to the small cavity volume we should be able to get lower threshold power for lasing than is the case for traditional laser designs.
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27.
  • Wosinski, Lech, et al. (author)
  • Silicon- and plasmonics-based nanophotonics for telecom and interconnects
  • 2012
  • In: 2012 Asia Communications And Photonics Conference (ACP). ; , s. AW1A.3-
  • Conference paper (peer-reviewed)abstract
    • We presented a set of fabricated devices based on silicon nanowire waveguides in application to telecom and optical interconnects. New developments in form of hybrid plasmonic waveguides allowing for sub-wavelength light confinement are also included.
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28.
  • Wosinski, Lech, et al. (author)
  • Silicon platform-based nanophotonics for interconnect applications
  • 2013
  • Conference paper (peer-reviewed)abstract
    • In this paper we present our technology based on silicon platform used for fabrication of nanophotonic devices as well as novel components with hybrid plasmonic nanowire waveguides. Over past decade silicon photonics established its position as an important photonic platform, mainly due to compatibility to microelectronic fabrication and great advantage of CMOS process compatibility allowing for high accuracy, high yield and possibility for mass production. This technology is intended to drive optical interconnect applications that demand high-volume and low-cost production of a wide scale of interconnect components and structures for data communication from data centers to intra-core architectures. We have designed and fabricated a variety of passive devices based on Si nanowire waveguides allowing to build highly integrated structures. For the inter- and intra-core communication the size of these structures is constrained by the diffraction limit of light. To go below this limit, plasmonic structures based on metal-dielectric interfaces have been proposed although their intrinsic high losses make their use with the available metal films impractical. Recently a new type of "hybrid plasmonic waveguides" was developed that allows for similar light confinement as in a metal-insulator-metal structure, but with much longer propagation lengths. Here a very thin low-index dielectric layer (slot layer) is sandwiched between a metal from one side and a high-index dielectric from the other side. Using this structure a number of different components based on hybrid plasmonic waveguides have been simulated and/or fabricated including waveguide couplers and splitters, different ring and disk resonators, polarisation beam splitters etc. This provides the way to realize subwavelength functional components for future ultra-compact integrated structures for optical interconnects and other applications.
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