11. |
- McMahon, Grainne, et al.
(author)
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Participation Biographies: Routes and relevancies of young people’s participation
- 2019
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In: Diskurs Jugend- und Kindheitsforschung. - 1862-5002. ; 14:4, s. 431-445
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Journal article (peer-reviewed)abstract
- Starting from a critical perspective of the dominant participation discourse which draws on a narrow and institutionalised concept of participation to ascribe young people a lack of interest in participation, this article focusses on the participation biographies of young people in European countries. The analysis reveals that participatory activities emerge differently where they become biographically meaningful. They can be expressions of the search for recognition and for feelings of self-efficacy, of coping with biographical challenges as well as with experiences in institutional contexts and of how young people position themselves between youth and adults. Thus, this article underscores that participation is not just a question of formal information but one of responses to and experiences of societal recognition.
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12. |
- Shah, Umer, et al.
(author)
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Low Loss High Linearity RF Interposers Enabled by Through-Glass Vias
- 2018
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In: IEEE Microwave and Wireless Components Letters. - : IEEE. - 1531-1309 .- 1558-1764. ; 28:11, s. 960-962
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Journal article (peer-reviewed)abstract
- This letter reports on a new low-loss and high linearity3-D wafer-level interposer technology enabled by throughglass vias (TGVs) with an inverted via configuration. Theproposed TGV utilizes a tapered via sidewall profile to achievea void-free conformal metal coverage with lower process timeand fewer fabrication steps than a fully filled conventional TGV.Measurement results for a single 100 μm tall TGV show aninsertion loss of 0.014 dB at 10 GHz and a DC resistanceof 28 mΩ. Finally, this letter reports for the first time onnonlinearity measurements of TGVs. Single-tone measurementsshow that the third harmonic level for a coplanar waveguide(CPW) TGV test structure is only 2 dB higher than a referenceCPW through line without TGVs, indicating an overall excellentlinearity performance.
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13. |
- Shah, Umer, et al.
(author)
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Permeability Enhancement by Multilayer Ferromagnetic Composites for Magnetic-Core On-Chip Inductors
- 2014
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In: IEEE Microwave and Wireless Components Letters. - : IEEE Press. - 1531-1309 .- 1558-1764. ; 24:10, s. 677-679
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Journal article (peer-reviewed)abstract
- This letter reports about unpatterned ferromagnetic NiFe/AlN multilayer composites used as advanced magnetic core materials for on-chip and interposer integrated inductances. The proposed composite structure reduces RF induced currents and thus pushes the permeability cutoff to beyond 3.7 GHz, which is by a factor of 7.1 higher than for homogeneous NiFe layers of same thickness. To the best knowledge of the authors, we achieve the highest effective relative permeability of 28 at 1 GHz, highest ferromagnetic resonance frequency and highest inductance enhancement factor above 1 GHz ever reported for devices based on on-chip unpatterned NiFe magnetic cores. A single loop inductor is also implemented as a technology demonstrator, achieving an inductance enhancement of 4.8 and a quality factor enhancement of 4.5 at 400 MHz.
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14. |
- Vyas, Agin, 1992, et al.
(author)
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A micromachined coupled-cantilever for piezoelectric energy harvesters
- 2018
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In: Micromachines. - : MDPI AG. - 2072-666X. ; 9:5
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Journal article (peer-reviewed)abstract
- This paper presents a demonstration of the feasibility of fabricating micro-cantilever harvesters with extended stress distribution and enhanced bandwidth by exploiting an M-shaped two-degrees-of-freedom design. The measured mechanical response of the fabricated device displays the predicted dual resonance peak behavior with the fundamental peak at the intended frequency. This design has the features of high energy conversion efficiency in a miniaturized environment where the available vibrational energy varies in frequency. It makes such a design suitable for future large volume production of integrated self powered sensors nodes for the Internet-of-Things
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