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- Trost, Thomas
(author)
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Mechanical stresses on cargo during ground operations in air transport
- 1989
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In: Packaging technology & science. - : John Wiley & Sons, Ltd. - 0894-3214 .- 1099-1522. ; 2:2, s. 85-108
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Journal article (peer-reviewed)abstract
- Abstract Mechanical stresses from the shocks and vibrations to which air cargo is exposed during transport and handling at airports have been investigated. Field trials were carried out at Arlanda Airport, Stockholm, and John F. Kennedy Airport, New York. It was found that when products are transported in the airport area, they are exposed to much higher stresses than during actual flight. Especially severe conditions were registered during transport at John F. Kennedy Airport. Measured stresses are related to the ground and mode of driving within the airport area, as well as to location on the pallet wagon. Guidelines as regards design of realistic, simulating test programs for product and package design are reported. Future development possibilities and suggestions for further research within the area are discussed.
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2. |
- Trost, Thomas
(author)
-
Mechanical stresses on products during air cargo transportation
- 1988
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In: Packaging technology & science. - : John Wiley & Sons, Ltd. - 0894-3214 .- 1099-1522. ; 1:3, s. 137-155
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Journal article (peer-reviewed)abstract
- Abstract A field study was conducted on board a Boeing 747 Combi (freight and passenger) aircraft on the route Stockholm (Arlanda) via Oslo (Gardermoen) to New York (John F. Kennedy Airport) and return to Stockholm (Arlanda). Shock and vibration, acting on the cargo, during air transportation were measured and analysed. The study encompassed all phases of the flight, including taxiing, climb, cruise during both calm and turbulent conditions, descent and approach, landing including touchdown and taxiing to apron. The field data were analysed by conventional frequency analysis and modelling techniques. In order to generalize the results, flight recorder data from the field trial and from other flights are included. Guide-lines for the development of realistic, simulation test programs for product and package design are included.
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