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- Melin, Jonas, et al.
(author)
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Microreplication in a Silicon Processing Compatible Material
- 2005
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In: IEEE/LEOS Optical MEMS 2005: International Conference on Optical MEMS and Their Applications, Oulu, Finland, 1-4 August 2005. - 9780780392786 ; , s. 89-90
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Conference paper (peer-reviewed)abstract
- We present a novel fabrication process for the integration of polymer micro-optical elements on silicon. The process relies on a reverse order protocol based on embossing in an amorphous fluorocarbon polymer, Cytop™.
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3. |
- Berg, Jonas, 1973, et al.
(author)
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Electrical Properties of Si-SiO2-Si Nanogaps
- 2005
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In: Nanotechnology. - : IOP Publishing. - 1361-6528 .- 0957-4484. ; 16:10, s. 2197-2202
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Journal article (peer-reviewed)abstract
- The chances of attaching organic molecules to silicon surfaces can be considerably enhanced if a robust nanogap structure with silicon electrodes can be used to connect the molecules. We describe the electrical properties of such an electrode structure, with a separation of the silicon surfaces in the 37 nm range. These silicon nanogaps are manufactured by partly removing the silicon dioxide insulator from a siliconoxidesilicon material stack, by using a selective oxide etchant. After the activation of the gap (the etching), current instabilities appear, which are comparable to the properties of thin oxides after soft breakdown. Applying a constant voltage can reduce these current instabilities. We also address the issue of surface leakage currents for these nanogap structures.
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- Kabir, Mohammad, 1974, et al.
(author)
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Plasma-enhanced chemical vapour deposition growth of carbon nanotubes on different metal underlayers
- 2005
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In: Nanotechnology. - : IOP Publishing. - 0957-4484 .- 1361-6528. ; 16, s. 458-466
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Journal article (peer-reviewed)abstract
- One important requirement for future applications of carbon nanotube electronic devices is the ability to controllably grow carbon nanotubes on metal electrodes. Here we show that it is possible to grow small diameter (<10 nm) vertically aligned carbon nanotubes on different metal underlayers using plasma-enhanced chemical vapour deposition. A crucial component is the insertion of a thin silicon layer between the metal and the catalyst particle. The electrical integrity of the metal electrode layer after plasma treatment and the quality of the metals as interconnects are also investigated.
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