| 1. |
- Dezelah, Charles L., et al.
(author)
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The Atomic Layer Deposition of HfO2 and ZrO2 using Advanced Metallocene Precursors and H2O as the Oxygen Source
- 2008
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In: Chemical Vapor Deposition. - : Wiley. - 0948-1907 .- 1521-3862. ; 14:11-12, s. 358-365
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Journal article (peer-reviewed)abstract
- The atomic layer deposition (ALD) of HfO2 and ZrO2 thin films is investigated using (MeCp)(2)HfMe2, (MCp)(2)Hf(OMe)(Me), (MeCp)(2)ZrMe2, and (MeCp)(2)Zr(OMe)(Me) as the precursors at deposition temperatures between 300 and 500 degrees C, with water vapor as the oxygen Source. A self-limiting growth mechanism is confirmed at 350 degrees C for all the metal precursors examined. The processes provide nearly stoichiometric HfO2 and ZrO2 films with carbon and hydrogen concentrations below 0.5 and 1.0 at.-%, respectively, for representative samples. All films are polycrystalline as deposited, and possess a thin interfacial SiO2 layer. The capacitance-voltage (C-V) and Current density-voltage (I-V) behavior is reported and discussed for capacitor structures containing films from this study.
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| 2. |
- Niinisto, Jaakko, et al.
(author)
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Advanced cyclopentadienyl precursors for atomic layer deposition of ZrO2 thin films
- 2008
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In: Journal of Materials Chemistry. - : Royal Society of Chemistry (RSC). - 0959-9428 .- 1364-5501. ; 18:28, s. 3385-3390
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Journal article (peer-reviewed)abstract
- ZrO2 thin films were grown onto silicon (100) substrates by atomic layer deposition (ALD) using novel cyclopentadienyl-type precursors, namely (CpMe)(2)ZrMe2 and (CpMe)(2)Zr(OMe) Me (Cp = cyclopentadienyl, C5H5) together with ozone as the oxygen source. Growth characteristics were studied in the temperature range of 250 to 500 degrees C. An ALD-type self-limiting growth mode was verified for both processes at 350 degrees C where highly conformal films were deposited onto high aspect ratio trenches. Signs of thermal decomposition were not observed at or below 400 degrees C, a temperature considerably exceeding the thermal decomposition temperature of the Zr-alkylamides. Processing parameters were optimised at 350 degrees C, where deposition rates of 0.55 and 0.65 angstrom cycle(-1) were obtained for (CpMe)(2)ZrMe2/O-3 and (CpMe)(2)Zr(OMe)Me/O-3, respectively. The films grown from both precursors were stoichiometric and polycrystalline with an increasing contribution from the metastable cubic phase with decreasing film thickness. In the films grown from (CpMe)(2)ZrMe2, the breakdown field did not essentially depend on the film thickness, whereas in the films grown from (CpMe)(2)Zr(OMe)Me the structural homogeneity and breakdown field increased with decreasing film thickness. The films exhibited good capacitive properties that were characteristic of insulating oxides and did not essentially depend on the precursor chemistry.
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