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Träfflista för sökning "WFRF:(Leveugle E.M.) "

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1.
  • Daon, J., et al. (author)
  • Electrically conductive thermal interface materials based on vertically aligned carbon nanotubes mats
  • 2014
  • In: IEEE 20th International Workshop on Thermal Investigation of ICs and Systems (Therminic). Greenwich, London, United Kingdom, 24-26 September 2014. - 9781479954155
  • Conference paper (peer-reviewed)abstract
    • In power microelectronics, the trends towards miniaturization and higher performances result in higher power densities and more heat to be dissipated. In most electronic assembly, thermal interface materials (TIM) help provide a path for heat dissipation but still represent a bottleneck in the total thermal resistance of the system. VA-CNTs mats are typically grown on HR silicon substrate with Al2O3 diffusion barrier layer using Thermal CVD process. In many cases, 'die attach' thermal interface materials need to be electrically conductive and the growth of dense VA-CNT mats on an electrically conductive substrate remains a challenge. This paper presents the growth of dense VA-CNT mats on doped silicon with Al2O3 and TiN diffusion barrier layer. Processes, thermal and electrical characterization of VA-CNTs based thermal interface materials are studied and reported.
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2.
  • Fu, Yifeng, 1984, et al. (author)
  • Carbon nanotube growth on different underlayers for thermal interface material application
  • 2016
  • In: IMAPS Nordic Annual Conference 2016 Proceedings. - 9781510827226
  • Conference paper (peer-reviewed)abstract
    • Thermal interface material (TIM) is a critical component in thermal management of high density packaging systems since both the reliability and lifetime of microsystems are dependent on how the heat is dissipated. Carbon nanotubes (CNTs) are promising candidate for development of TIMs due to their excellent thermal and mechanical properties. The thermal conductivity of CNTs can be up to 3000 W/mK in the longitudinal direction which acts as ideal heat transfer path. However, the huge interfacial thermal resistance between CNTs and contact surface hinders the exploitation of CNTs as TIMs. In this paper, we will focus on the growth of CNTs on various substrates and underlayers and analyze the interaction between catalyst and underlayer materials. Microscopic analysis is performed to characterize the quality of the CNT materials and monitor the diffusion of Fe particles into different barrier layers. Thermal conductivity of the CNT TIMs will be measured to examine the performance of the materials.
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