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| 2. |
- Decharat, Adit, et al.
(author)
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Novel room-temperature wafer-to-wafer attachment and sealing of cavities using cold metal welding
- 2007
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In: PROCEEDINGS OF THE IEEE TWENTIETH ANNUAL INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS. - 9781424409501 ; , s. 754-757
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Conference paper (peer-reviewed)abstract
- In this paper we present for the first time a wafer-to-wafer attachment and sealing method for wafer level manufacturing of micro-cavities using a room temperature bonding process. The proposed attachment and sealing method is based on plastic deformation and cold welding of overlapping metal rings to create metal-to-metal bonding and sealing. We present the results from experiments using various bonding process parameters and metal sealing ring designs and their impact on the resulting bonds. Experiments are performed to evaluate the sealing properties against liquids and vapors of the different sealing ring structures.
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| 3. |
- Decharat, Adit, et al.
(author)
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Room-Temperature Sealing of Microcavities by Cold Metal Welding
- 2009
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In: Journal of microelectromechanical systems. - : Institute of Electrical and Electronics Engineers (IEEE). - 1057-7157 .- 1941-0158. ; 18:6, s. 1318-1325
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Journal article (peer-reviewed)abstract
- In this paper, we present a wafer-to-wafer attachment and sealing method for wafer-level manufacturing of micro-cavities using a room-temperature bonding process. The proposed attachment and sealing method is based on plastic deformation and cold welding of overlapping metal rings to create metal-to-metal bonding and sealing. We present the results from experiments using various bonding process parameters and metal sealing ring designs including their impact on the resulting bond quality. The sealing properties against liquids and vapor of different sealing ring structures have been evaluated for glass wafers that are bonded to silicon wafers. In addition, wafer-level vacuum sealing of microcavities was demonstrated when bonding a silicon wafer to another silicon wafer with the proposed room-temperature sealing and bonding technique.
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| 4. |
- Decharat, Adit, et al.
(author)
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Room-temperature sealing of microcavities by cold metal welding
- 2009
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In: Journal of microelectromechanical systems. - Piscataway : IEEE. - 1057-7157 .- 1941-0158. ; 18:6, s. 1318-1325
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Journal article (peer-reviewed)abstract
- In this paper, we present a wafer-to-wafer attachment and sealing method for wafer-level manufacturing of micro-cavities using a room-temperature bonding process. The proposed attachment and sealing method is based on plastic deformation and cold welding of overlapping metal rings to create metal-to-metal bonding and sealing. We present the results from experiments using various bonding process parameters and metal sealing ring designs including their impact on the resulting bond quality. The sealing properties against liquids and vapor of different sealing ring structures have been evaluated for glass wafers that are bonded to silicon wafers. In addition, wafer-level vacuum sealing of microcavities was demonstrated when bonding a silicon wafer to another silicon wafer with the proposed room-temperature sealing and bonding technique.
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| 6. |
- Fischer, Andreas C., 1982-, et al.
(author)
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Method for plugging a hole and a plugged hole
- 2009
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Patent (pop. science, debate, etc.)abstract
- A method for at least partially inserting a plug into a hole, said method comprising the steps of a) providing a at least one substrate with at least one hole wherein said at least one hole has a largest dimension of from 1 μm to 300 μm, b) providing a piece of material, wherein said piece of material has a larger dimension than said at least one hole, c) pressing said piece of material against the hole with a tool so that a plug is formed, wherein at least a part of said piece of material is pressed into said hole, d) removing the tool from the piece of material. There is further disclosed a plugged hole manufactured with the method. One advantage of an embodiment is that an industrially available wire bonding technology can be used to seal various cavities. The existing wire bonding technology makes the plugging fast and cheap.
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| 7. |
- Forsberg, Fredrik, et al.
(author)
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High-performance quantum-well silicon-germanium bolometers using IC-compatible integration for low-cost infrared imagers
- 2009
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In: TRANSDUCERS 2009. ; , s. 2214-2217
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Conference paper (peer-reviewed)abstract
- This paper reports on the realization and characterization of the very first quantum-well (QW) mono-crystalline Si/SiGe 18x18 pixel infrared bolometer arrays that are manufactured using IC compatible heterogeneous 3D integration on fan-out wafers. This integration process enables bolometer materials on top of CMOS-based integrated circuits that can not be integrated with conventional monolithic deposition techniques. The manufactured bolometer arrays have a negative temperature coefficient of resistance (TCR) of 2.8%/K. Measurements of the 1/f noise showed a higher value than expected for the bolometers. This result can be compared to lower values of noise achieved for samples of the thermistor material and is believed to result from imperfect metal contacts.
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| 8. |
- Gutmann, R.J., et al.
(author)
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Wafer-Level Via-First 3D Integration with Hybrid-Bonding of Cu/BCB Redistribution Layers
- 2005
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Conference paper (other academic/artistic)abstract
- Three-dimensional (3D) integration with through-die viasoffer improved electrical performance compared to edgeconnectedwire bonds in stacked-die assemblies for wirelessapplications. Monolithic wafer-level 3D integration offersthe potential for a high density of micron-sized through-dievias necessary for highest performance memory stacks,microprocessors with large L2 caches and ASICs with largeembedded memories. In addition, such wafer-leveltechnologies offer the potential of lowest cost in largemanufacturing volume of any heterogeneous integrationplatform, incorporating the inherent low cost of monolithicIC interconnectivity. After a brief summary of current wafer-level 3D integrationplatforms, a recently introduced platform that offers theprocess integration advantage of copper-to-copper (Cu-to-Cu) bonding with the increased adhesion strength andenvironmental robustness of dielectric adhesive bondingusing benzocyclobutene (BCB) is discussed. Criticalprocessing challenges of the new platform include BCBpartial curing compatible with damascene patterning, postdamascene-patterning cleaning and surface activation,bonding process parameters, and wafer-level planarizationrequirements. The inherent incorporation of a redistributionlayer into the bonding layer process further reduces theprocess flow and is compatible with wafer-level packaging(WLP) technologies.
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| 9. |
- Kvisteroy, Terje, et al.
(author)
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Far infrared low-cost uncooled bolometer for automotive use
- 2007
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In: Advanced Microsystems for Automotive Applications 2007. - BERLIN : SPRINGER-VERLAG BERLIN. - 9783540713241 ; , s. 265-278
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Conference paper (peer-reviewed)abstract
- A proposed EU regulation requires the automotive industry to develop technologies that will substantially decrease the risk for vulnerable road users such as pedestrians when hit by a vehicle. Automatic brake assist systems, activated by a suitable sensor, will reduce the speed of the vehicle before the impact. Far InfraRed (FIR) detectors are ideal candidates for such sensing systems. In order to enable high volume serial installation, the main development must be focused on cost reduction. Optimizing all aspects of the system, including sensor size, production yield and 3D wafer level vacuum packaging will lower today's "high end" FIR product costs by an order of magnitude. A low-cost FIR infrared bolometer is developed in the Eureka labeled PIMS (Pedestrian Injury Mitigation System) project. In the paper the background and the actual design of the first demonstrator to be finished in 2008 are described in detail.
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| 10. |
- Källhammer, Jan-Erik, et al.
(author)
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Fulfilling the pedestrian protection directive using a long-wavelength infrared camera designed to meet both performance and cost targets
- 2006
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In: Photonics in the Automobile II. - : SPIE. ; , s. 19809-19809
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Conference paper (peer-reviewed)abstract
- Pedestrian fatalities are around 15% of the traffic fatalities in Europe. A proposed EU regulation requires the automotive industry to develop technologies that will substantially decrease the risk for Vulnerable Road Users when hit by a vehicle. Automatic Brake Assist systems, activated by a suitable sensor, will reduce the speed of the vehicle before the impact, independent of any driver interaction. Long Wavelength Infrared technology is an ideal candidate for such sensors, but requires a significant cost reduction. The target necessary for automotive serial applications are well below the cost of systems available today. Uncooled bolometer arrays are the most mature technology for Long Wave Infrared with low-cost potential. Analyses show that sensor size and production yield along with vacuum packaging and the optical components are the main cost drivers. A project has been started to design a new Long Wave Infrared system with a ten times cost reduction potential, optimized for the pedestrian protection requirement. It will take advantage of the progress in Micro Electro-Mechanical Systems and Long Wave Infrared optics to keep the cost down. Deployable and pre-impact braking systems can become effective alternatives to passive impact protection systems solutions fulfilling the EU pedestrian protection regulation. Low-cost Long Wave Infrared sensors will be an important enabler to make such systems cost competitive, allowing high market penetration.
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