| 1. |
- Andersson, Helene, et al.
(author)
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Hydrophobic valves of plasma deposited octafluorocyclobutane in DRIE channels
- 2001
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In: Sensors and actuators. B, Chemical. - 0925-4005 .- 1873-3077. ; 75:1-2, s. 136-141
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Journal article (peer-reviewed)abstract
- The suitability of using octafluorocyclobutane (C4F8) patches as hydrophobic valves in microfluidic biochemical applications has been shown. A technique has been developed to generate lithographically defined C4F8 hydrophobic patches in deep reactive ion-etched silicon channels. Some of the advantages of this process are that no specific cleaning of the substrate is required, C4F8 is deposited on the sidewalls and the bottom of the channels, a standard photoresist mask can be used to define the patches, and that it is a fast and convenient dry chemical process performed by a standard inductively coupled plasma etcher using the Bosch process. Different patch lengths (200-1000 mum) of C4F8 were deposited in 50 mum wide channels to evaluate which size is most suitable for microfluidic biochemical applications. The valve function of the hydrophobic patches was tested for the following liquids: DD water, acetone, propanol, bead solution and a mixture used for pyrosequencing of DNA. Patch lengths of 200 mum of C4F8 successfully stopped each solution for at least 20 consecutive times. The C4F8 film resists water for at least 5 h. The hydrophobic valve also resists very high concentrations (25%) of surfactants (Tween 80). C4F8 shows a much higher resistance towards water and surface active solutions than previous hydrophobic patches. However, 50% Tween 80 was not stopped at all by the hydrophobic patch. An applied pressure of 760 Pa at the inlet was needed for water to over-run the hydrophobic patch.
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| 2. |
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| 3. |
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| 4. |
- Antelius, Mikael, et al.
(author)
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Hermetic integration of liquids in MEMS by room temperature, high-speed plugging of liquid-filled cavities at wafer level
- 2011
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In: Proceedings IEEE International Conference on Micro Electro Mechanical Systems (MEMS). - : IEEE. ; , s. 356-359
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Conference paper (other academic/artistic)abstract
- This paper reports a novel room temperature hermetic liquid sealing process based on wire bonded "plugs" over the access ports of liquid-filled cavities. The method enables liquids to be integrated already at the fabrication stage. Test vehicles were manufactured and used to investigate the mechanical and hermetic properties of the seals. A helium leak rate of better than 1E-10 mbarL/s was measured on the successfully sealed structures. The bond strength of the "plugs" were similar to standard wire bonds on flat surfaces.
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| 5. |
- Antelius, Mikael, et al.
(author)
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Hermetic integration of liquids using high-speed stud bump bonding for cavity sealing at the wafer level
- 2012
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In: Journal of Micromechanics and Microengineering. - : IOP Publishing. - 0960-1317 .- 1361-6439. ; 22:4, s. 045021-
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Journal article (peer-reviewed)abstract
- This paper reports a novel room-temperature hermetic liquid sealing process where the access ports of liquid-filled cavities are sealed with wire-bonded stud bumps. This process enables liquids to be integrated at the fabrication stage. Evaluation cavities were manufactured and used to investigate the mechanical and hermetic properties of the seals. Measurements on the successfully sealed structures show a helium leak rate of better than 10 (10) mbarL s (1), in addition to a zero liquid loss over two months during storage near boiling temperature. The bond strength of the plugs was similar to standard wire bonds on flat surfaces.
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| 6. |
- Antelius, Mikael, et al.
(author)
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Room-temperature wafer-level vacuum sealing by compression of high-speed wire bonded gold bumps
- 2011
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In: Proceedings IEEE International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers). - : IEEE. ; , s. 1360-1363
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Conference paper (other academic/artistic)abstract
- This paper reports experimental results of a novel room temperature vacuum sealing process based on compressing wire bonded gold “bumps”, causing a material flow into the access ports of vacuum-cavities. The leak rate out of manufactured cavities was measured over 5 days and evaluated to less than the detection limit, 6×10-12 mbarL/s, per sealed port. The cavities have been sealed at a vacuum level below 10 mbar. The method enables sealing of vacuum cavities at room temperature using standard commercial tools and processes.
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| 7. |
- Antelius, Mikael, et al.
(author)
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Small footprint wafer-level vacuum packaging using compressible gold sealing rings
- 2011
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In: Journal of Micromechanics and Microengineering. - : IOP Publishing. - 0960-1317 .- 1361-6439. ; 21:8, s. 085011-
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Journal article (peer-reviewed)abstract
- A novel low-temperature wafer-level vacuum packaging process is presented. The process uses plastically deformed gold rings as sealing structures in combination with flux-free soldering to provide the bond force for a sealing wafer. This process enables the separation of the sealing and the bonding functions both spatially on the wafer and temporally in different process steps, which results in reduced areas for the sealing rings and prevents outgassing from the solder process in the cavity. This enables space savings and yields improvements. We show the experimental result of the hermetic sealing. The leak rate into the packages is determined, by measuring the package lid deformation over 10 months, to be lower than 3.5 x 10(-13) mbar l s(-1), which is suitable for most MEMS packages. The pressure inside the produced packages is measured to be lower than 10 mbar.
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| 8. |
- Antelius, Mikael, et al.
(author)
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Wafer-Level Vacuum Sealing by Coining of Wire Bonded Gold Bumps
- 2013
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In: Journal of microelectromechanical systems. - 1057-7157 .- 1941-0158. ; 22:6, s. 1347-1353
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Journal article (peer-reviewed)abstract
- This paper reports on the investigation of a novel room-temperature vacuum sealing method based on compressing wire bonded gold bumps which are placed to partially overlap the access ports into the cavity. The bump compression, which is done under vacuum, causes a material flow into the access ports, thereby hermetically sealing a vacuum inside the cavities. The sealed cavity pressure was measured by residual gas analysis to 8x10(-4) mbar two weeks after sealing. The residual gas content was found to be mainly argon, which indicates the source as outgassing inside the cavity and no measurable external leak. The seals are found to be mechanically robust and easily implemented by the use of standard commercial tools and processes.
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| 9. |
- Aparicio, Francisco J., et al.
(author)
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Dye-based photonic sensing systems
- 2016
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In: Sensors and actuators. B, Chemical. - : Elsevier. - 0925-4005 .- 1873-3077. ; 228, s. 649-657
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Journal article (peer-reviewed)abstract
- We report on dye-based photonic sensing systems which are fabricated and packaged at wafer scale. For the first time luminescent organic nanocomposite thin-films deposited by plasma technology are integrated in photonic sensing systems as active sensing elements. The realized dye-based photonic sensors include an environmental NO2 sensor and a sunlight ultraviolet light (UV) A+B sensor. The luminescent signal from the nanocomposite thin-films responds to changes in the environment and is selectively filtered by a photonic structure consisting of a Fabry-Perot cavity. The sensors are fabricated and packaged at wafer-scale, which makes the technology viable for volume manufacturing. Prototype photonic sensor systems have been tested in real-world scenarios. (C) 2016 Elsevier B.V. All rights reserved.
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