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- Chen, Yu-Hsiang, et al.
(author)
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Effects of decomposition route and microstructure on h-AlN formation rate in TiCrAlN alloys
- 2017
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In: Journal of Alloys and Compounds. - : ELSEVIER SCIENCE SA. - 0925-8388 .- 1873-4669. ; 691, s. 1024-1032
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Journal article (peer-reviewed)abstract
- The phase evolution of cubic (c), solid solution TixCr-0.37Al1-0.37-x N alloys with x = 0.03 and 0.16, and the kinetics of the hexagonal (h)-AlN formation are studied via in situ wide angle x-ray scattering experiments during high temperature (1000-1150 degrees C) annealing. Spinodal decomposition was observed in Ti0.16Cr0.36Al0.48N while Ti0.03Cr0.38Al0.59N decomposes through nucleation and growth of h-AlN, c-TiN and c-CrAlN. h-AlN is formed from c-CrAlN domains in both cases and the formation rate of h-AlN depends on the stability of the c-CrAlN domains. In Ti0.16Cr0.36Al0.48N, the c-CrAlN domains are stabilized by crystallographic coherency with the surrounding c-TiCrN in a microstructure originating from spinodal decomposition. This results in lower formation rates of h-AlN for this composition. These differences are reflected in higher activation energy for h-AlN formation in Ti0.16Cr0.36Al0.48N compared to Ti0.03Cr0.38Al0.59N. It also points out different stabilities of the intermediate phase c-CrAlN during phase decomposition of TiCrAlN alloys. Additional contributions to the low activation energy for formation of h-AlN in Ti0.03Cr0.38Al0.59N stems from precipitation at grain boundaries. (C) 2016 Elsevier B.V. All rights reserved.
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- Schroeder, Jeremy, et al.
(author)
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Thermal stability of epitaxial cubic-TiN/(Al,Sc)N metal/semiconductor superlattices
- 2015
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In: Journal of Materials Science. - : Springer Verlag (Germany). - 0022-2461 .- 1573-4803. ; 50:8, s. 3200-3206
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Journal article (peer-reviewed)abstract
- We report on the thermal stability of epitaxial cubic-TiN/(Al,Sc)N metal/semiconductor superlattices with the rocksalt crystal structure for potential plasmonic, thermoelectric, and hard coating applications. TiN/Al0.72Sc0.28N superlattices were annealed at 950 and 1050 A degrees C for 4, 24, and 120 h, and the thermal stability was characterized by high-energy synchrotron-radiation-based 2D X-ray diffraction, high-resolution (scanning) transmission electron microscopy [HR(S)/TEM], and energy dispersive X-ray spectroscopy (EDX) mapping. The TiN/Al0.72Sc0.28N superlattices were nominally stable for up to 4 h at both 950 and 1050 A degrees C. Further annealing treatments for 24 and 120 h at 950 A degrees C led to severe interdiffusion between the layers and the metastable cubic-Al0.72Sc0.28N layers partially transformed into Al-deficient cubic-(Al,Sc)N and the thermodynamically stable hexagonal wurtzite phase with a nominal composition of AlN (h-AlN). The h-AlN grains displayed two epitaxial variants with respect to c-TiN and cubic-(Al,Sc)N. EDX mapping suggests that scandium has a higher tendency for diffusion in TiN/(Al,Sc)N than titanium or aluminum. Our results indicate that the kinetics of interdiffusion and the cubic-to-hexagonal phase transformation place constraints on the design and implementation of TiN/(Al,Sc)N superlattices for high-temperature applications.
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