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- Stolt, Patrik, et al.
(author)
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Silica exposure among male current smokers is associated with a high risk of developing ACPA-positive rheumatoid arthritis
- 2010
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In: Annals of the Rheumatic Diseases. - : BMJ. - 0003-4967 .- 1468-2060. ; 69:6, s. 1072-1076
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Journal article (peer-reviewed)abstract
- Objective To study the association between silica exposure, separately as well as combined with smoking, and the risk of developing rheumatoid arthritis (RA) with or without the presence of antibodies against citrullinated peptide antigens (ACPA). Methods This Swedish population based case-control study analysed 577 incident RA cases and 659 randomly selected controls, all men aged 18-70 years, included during May 1996 to May 2006. Self-reported silica exposure, defined as exposure to stone dust, rock drilling or stone crushing and cigarette smoking was registered. ACPA status among cases was analysed. Results Silica-exposed subjects were found to have a moderately increased risk of ACPA-positive RA (odds ratio (OR) adjusted for age and residency = 1.67 (95% CI 1.13 to 2.48), but not of ACPA-negative RA (OR = 0.98 (95% CI 0.57 to 1.66)), compared with subjects unexposed to silica. Subjects exposed to rock drilling were found to have a somewhat more markedly increased risk of ACPA-positive RA (OR = 2.34 (95% CI 1.17 to 4.68)). A high risk of developing ACPA-positive RA was observed among silica-exposed current smokers (OR = 7.36 (95% CI 3.31 to 16.38)), exceeding the risk expected from the separate effects of silica exposure and current smoking, indicating an interaction between these exposures (attributable proportion due to interaction = 0.60 (95% CI 0.26 to 0.95)). Conclusion Silica exposure combined with smoking among men is associated with an increased risk of developing ACPA-positive RA. These results suggest that different inhalation exposures may interact in the aetiology of ACPA-positive RA.
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2. |
- Wallin, Erik, et al.
(author)
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World record Cu(In,Ga)Se2-based thin-film sub-module with 17.4 % efficiency
- 2012
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In: Progress in Photovoltaics. - : John Wiley & Sons. - 1062-7995 .- 1099-159X. ; 20:7, s. 851-854
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Journal article (peer-reviewed)abstract
- We report a new certified world-record efficiency for thin-film Cu(In,Ga)Se2-based photovoltaic sub-modules of 17.4%(aperture area). The record efficiency of the 16 cm2, monolithically integrated, sub-module has been independently confirmedby Fraunhofer ISE. The record device is the result of extensive co-optimization of all processing steps. Duringthe optimization process, strong focus has been put on the scalability of processes to cost-effective mass production, asreflected, for example, in Cu(In,Ga)Se2 deposition time and substrate temperature. Device manufacturing as well as resultsof electrical and material characterization is discussed.
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3. |
- Westin, Per-Oskar, 1979-
(author)
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By Means of Beams : Laser Patterning and Stability in CIGS Thin Film Photovoltaics
- 2011
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Doctoral thesis (other academic/artistic)abstract
- Solar irradiation is a vast and plentiful source of energy. The use of photovoltaic (PV) devices to convert solar energy directly to electrical energy is an elegant way of sustainable power generation which can be distributed or in large PV plants based on the need. Solar cells are the small building blocks of photovoltaics and when connected together they form PV modules. Thin film solar cells require significantly less energy and raw materials to be produced, as compared to the dominant Si wafer technologies. CIGS thin film solar cells are considered to be the most promising thin film alternative due to its proven high efficiency. Most thin film PV modules utilise monolithic integration, whereby thin film patterning steps are included between film deposition steps, to create interconnection of individual cells within the layered structure. The state of the art is that CIGS thin film modules are made using one laser patterning step (P1) and two mechanical patterning steps (P2 and P3). Here we present work which successfully demonstrates the replacement of mechanical patterning by laser patterning methods. The use of laser ablation promises such advantages as increased active cell area and reduced maintenance and downtime required for regular replacement of mechanical tools. The laser tool can also be used to transform CIGS into a conducting compound along a patterned line. We have shown that this process can be performed after all semiconductor layers are deposited using a technique we call laser micro-welding. By performing patterning at the end of the process flow P2 and P3 patterning could be performed simultaneously. Such solutions will further reduce manufacturing times and may offer increased control of semiconductor interfaces. While showing promising performance on par with reference processes there are still open questions of importance for these novel techniques, particularly that of long term stability. Thin film modules are inherently sensitive to moisture and require reliable encapsulation. Before the techniques introduced here can be seen industrially they must have achieved proven stability. In this work we present a proof of existence of stable micro-welded interconnections.
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