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Low temperature adh...
Low temperature adhesive wafer bonding using OSTE(+) for heterogeneous 3D MEMS integration
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- Forsberg, Fredrik, 1980- (author)
- KTH,Mikro- och nanosystemteknik
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- Saharil, Farizah (author)
- KTH,Mikro- och nanosystemteknik
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- Stemme, Göran (author)
- KTH,Mikro- och nanosystemteknik
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- Roxhed, Niclas (author)
- KTH,Mikro- och nanosystemteknik
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- van der Wijngaart, Wouter (author)
- KTH,Mikro- och nanosystemteknik
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- Haraldsson, Tommy (author)
- KTH,Mikro- och nanosystemteknik
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- Niklaus, Frank (author)
- KTH,Mikro- och nanosystemteknik
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(creator_code:org_t)
- IEEE conference proceedings, 2013
- 2013
- English.
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In: Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on. - : IEEE conference proceedings. - 9781467356541 ; , s. 342-346
- Related links:
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http://www.mems2013....
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http://ieeexplore.ie...
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https://kth.diva-por... (primary) (Raw object)
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https://urn.kb.se/re...
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https://doi.org/10.1...
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Abstract
Subject headings
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- We demonstrate, for the first time, the use of off stoichiometry thiolene-epoxy, OSTE(+) for adhesive wafer bonding. The dual cure system, with an initial UV-curing step followed by a second thermal cure, allows for high bond strength and potentially high quality material interfaces. We show that cured OSTE(+) is easily removed in oxygen plasma and that the characteristics of OSTE(+) make it a potential candidate for use in heterogeneous 3D MEMS integration. Furthermore, we show how the bond energies of wafers bonded with OSTE(+) adhesive compares with the bond energies of wafers bonded with Cyclotene 3022-46 (BCB) and mr-I 9150XP nanoimprint resist.
Keyword
- OSTE(+)
- Heterogeneous integration
- Wafer bonding
- SRA - ICT
- SRA - Informations- och kommunikationsteknik
Publication and Content Type
- ref (subject category)
- kon (subject category)
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