Integration Of Polymer Microfluidic Channels, Vias, And Connectors With Silicon Photonic Sensors By One-Step Combined Photopatterning And Molding Of OSTE

Mola Romero, Albert (author)

(creator_code:org_t)

IEEE conference proceedings, 2013
2013
English.
In: Proceedings of the 2013 17th International Solid-State Sensors, Actuators and Microsystems Conference (Transducers). - : IEEE conference proceedings. ; , s. 1613-1616

Related links:: http://transducers-e...; show more...; https://kth.diva-por... (primary) (Raw object); https://urn.kb.se/re...; https://doi.org/10.1...; show less...

Abstract Subject headings

We demonstrate a method for the fast and simple packaging of silicon sensors into a microfluidic package consisting of the recently introduced {OSTE} polymer. The microfluidic layer is first microstructured and thereafter dry-bonded to a silicon photonic sensor, in a process compatible with wafer-level production, and with the entire packaging process lasting only 10 minutes. The fluidic layer combines molded microchannels and fluidic (Luer) connectors with photopatterned through-holes (vias) for optical fiber probing and fluid connections. All the features are fabricated in a single photocuring step. We report measurements with an integrated silicon photonic {Mach-Zehnder} interferometer refractive index sensor packaged by these means.

By the author/editor: Errando-Herranz, ...; Saharil, Farizah; Mola Romero, Alb ...; Sandström, Nikla ...; Shafagh, Reza Z.; Wijngaart, Woute ...; show more...; Haraldsson, Tomm ...; Gylfason, Kristi ...; show less...

About the subject

ENGINEERING AND TECHNOLOGY: ENGINEERING AND ...; and Electrical Engin ...; and Other Electrical ...

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